HDI PCB TU-883 Material 8 Layer 1.5mm Impedance Rigid Board

Product Specification

Discover our cutting-edge 8-layer rigid PCB, meticulously crafted from TU-883 material. Designed for high-performance applications, this PCB excels in environments demanding speed and low-loss characteristics. Whether you're developing radio frequency devices, high-performance computing systems, or telecom solutions, our PCB offers the reliability and precision you need to elevate your projects.

Specifications That Matter: Robust Design Meets High Standards
Our 8-layer PCB comes packed with essential specifications that ensure top-tier performance:

Layers: 8 layers for intricate designs
Material: TU-883 (ThunderClad 2) for enhanced durability
Solder Mask: Striking blue on both sides for visibility and protection
Silkscreen Print: Crisp white on the top side for easy identification
Surface Finish: ENEPIG for superior solderability
Total Thickness: 1.45mm ± 10% for flexibility in application
Size: 97.3mm x 67.7mm, perfectly sized for various uses
Minimum Hole Size: 0.25mm for precision engineering
Solder Mask Thickness: 10µm, ensuring durability
Minimum Dielectric Thickness: 100µm to maintain signal integrity
Minimum Trace Width: 150µm for efficient circuitry
Minimum Spacing: 160µm to prevent interference
 

Via Features: Advanced Connectivity Options
Blind Vias: Yes (L1-L2, L7-L8) for compact designs
Buried Vias: Yes (L2-L7) for optimized performance
Back Drilled Vias: Yes (L1-L6) to enhance signal clarity
 

Impedance Control: Customized for 50, 90, and 100-ohm differential pairs on various layers, ensuring signal integrity across applications.

Quality and Compliance: Trustworthy Manufacturing
Our PCB meets IPC-Class-2 quality standards, guaranteeing reliability and excellence. We provide artwork in Gerber RS-274-X format, ensuring compatibility with industry-standard manufacturing processes. Best of all, our products are available for customers worldwide.

TU-883 Material: Engineered for Excellence
TU-883 (ThunderClad 2) is crafted from a high-performance resin designed specifically for low-loss applications. Here’s why it stands out:

High Tg (TMA): 170°C for thermal stability
 

Dielectric Constant: 3.39 @ 10GHz for reliable signal transmission
 

Dissipation Factor: 0.0045 @ 10GHz, minimizing energy loss
 

Stable Performance: Consistent Dk/Df across frequency and temperature ranges
 

Moisture Resistance: Exceptional protection against environmental factors
 

Lead-Free Compatibility: Perfect for modern manufacturing processes

Key Features That Matter
Improved z-axis thermal expansion: Enhances performance under thermal stress
 

Anti-CAF capability: Ensures reliability in harsh conditions
 

Halogen-Free: Eco-friendly and compliant with industry standards

Versatile Applications: Where Our PCB Excels
Our advanced 8-layer PCB is ideal for a wide range of applications, including:

Radio Frequency Devices: Perfect for enhancing communication technologies with minimal signal loss.
 

Backplane and High-Performance Computing: Optimized for data-intensive environments, ensuring reliable performance in demanding computing tasks.
 

Line Cards and Storage Solutions: Designed to support high-speed data transfer, crucial for efficient storage and networking operations.
 

Servers and Telecom Equipment: Essential for maintaining robust connectivity and performance in server and telecommunications infrastructures.
 

Office Routers: Well-suited for enhancing the reliability and speed of office networking solutions, providing seamless connectivity for various devices.

Get a Quote Today!
If you're looking for a high-performance PCB solution that meets the demands of modern electronics, our 8-layer TU-883 PCB is the perfect choice. Contact us now to discuss your requirements or request a quote.