Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| PCB Material | Rogers RO3003 Substrate - 5mil (0.127mm) |
| Layer Count | 4-layer |
| PCB Thickness | 1.64mm |
| Solder Mask | No |
| Silkscreen | No |
| Surface Finish | Immersion Silver |
View Detail Information
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| PCB Material | Rogers RO3003 Substrate - 5mil (0.127mm) | Layer Count | 4-layer |
| PCB Thickness | 1.64mm | Solder Mask | No |
| Silkscreen | No | Surface Finish | Immersion Silver |
| High Light | 1.6mm Immersion Silver Circuit Board ，4-layer Immersion Silver Circuit Board ，RO3003 PCB | ||
In the rapidly evolving world of high-frequency electronics, the demand for reliable and high-performance printed circuit boards (PCBs) is greater than ever. At bicheng, we specialize in delivering cutting-edge PCB solutions tailored to meet the needs of advanced RF and microwave applications.
Why Choose Rogers RO3003?
Rogers RO3003 laminates are engineered to provide exceptional stability in dielectric constant (Dk) across a wide range of temperatures and frequencies. Unlike traditional PTFE glass materials, RO3003 eliminates the step change in Dk near room temperature, making it an ideal choice for high-frequency applications such as:
Automotive radar systems (77 GHz)
Advanced Driver Assistance Systems (ADAS)
5G wireless infrastructure (mmWave)
Key Features of Rogers RO3003
Dielectric Constant (Dk): 3.00 ± 0.04 at 10 GHz/23°C
Dissipation Factor (Df): 0.001 at 10 GHz/23°C
Thermal Conductivity: 0.5 W/mK
Moisture Absorption: 0.04%
Thermal Decomposition Temperature (Td): > 500°C
Coefficient of Thermal Expansion (CTE):
X-axis: 17 ppm/°C
Y-axis: 16 ppm/°C
Z-axis: 25 ppm/°C
| RO3003 Typical Value | |||||
| Property | RO3003 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.0±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.001 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -3 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.06 0.07 | X Y | mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 107 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 107 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 930 823 | X Y | MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.04 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
| Specific Heat | 0.9 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.5 | W/M/K | 50℃ | ASTM D 5470 | |
| Coefficient of Thermal Expansion (-55 to 288℃) | 17 16 25 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.1 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 12.7 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Benefits of RO3003-Based PCBs
Low Dielectric Loss: Ideal for applications up to 77 GHz, ensuring minimal signal loss and superior performance.
Excellent Mechanical Properties: Reliable stripline and multi-layer board constructions with uniform mechanical properties across a range of dielectric constants.
Stable Dielectric Constant: Ensures consistent performance in bandpass filters, microstrip patch antennas, and voltage-controlled oscillators.
Low In-Plane Expansion Coefficient: Matches copper, enabling reliable surface-mounted assemblies and excellent dimensional stability.
Cost-Effective: Volume manufacturing processes make RO3003 laminates an economical choice for high-frequency applications.
PCB Construction Details
Our 4-layer rigid PCB construction with Rogers RO3003 substrate is optimized for high-frequency performance:
Board Dimensions: 110.9 mm x 110.9 mm
Layer Stackup:
Copper Layer 1: 35 μm
Rogers RO3003 Substrate: 5 mil (0.127 mm)
Copper Layer 2: 35 μm
Prepreg: 4 mil (0.102 mm)
Rogers RO3003 Substrate: 50 mil (1.27 mm)
Copper Layer 2: 35 μm
Finished Board Thickness: 1.64 mm
Surface Finish: Immersion Silver
Electrical Testing: 100% tested prior to shipment
Typical Applications
Rogers RO3003 PCBs are widely used in:
Automotive radar systems
Global positioning satellite (GPS) antennas
Cellular telecommunications systems (power amplifiers and antennas)
Patch antennas for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
Why Partner with Us?
At bicheng, we combine advanced materials like Rogers RO3003 with state-of-the-art manufacturing processes to deliver PCBs that meet the highest industry standards (IPC-Class-2). Our commitment to quality and reliability ensures that your high-frequency applications perform at their best.
Global Availability
Our Rogers RO3003 PCBs are available worldwide, making it easy for you to access cutting-edge solutions no matter where you are.
Get Started Today
Ready to elevate your RF and microwave applications? Contact us today to request a quote or discuss your specific requirements. Let us help you achieve unparalleled performance with our Rogers RO3003 PCB solutions.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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