FR408HR PCB 4-Layer 1.6mm High TG Via In Pad Circuit Boards

Product Specification

We proudly present our advanced 4-layer rigid PCB, constructed with FR408HR material, specifically designed to meet the rigorous demands of high reliability and exceptional performance across various electronic applications. Whether utilized in high-speed digital devices, networking communications, or medical and industrial equipment, this PCB is engineered to deliver outstanding results, ensuring longevity and efficiency in your electronic projects.

Key Specifications: Robust Features for Optimal Performance

This PCB boasts a variety of key specifications that make it suitable for challenging environments:

- Layers: 4 Layers
- Material: FR408HR
- Solder Mask: Blue on both sides
- Silkscreen Print: White on both sides
- Surface Finish: ENIG (Electroless Nickel Immersion Gold)
- Total Thickness: 1.6mm ± 10%
- Size:** 140mm x 160mm
- Minimum Hole Size: 0.3mm
- Solder Mask Thickness: 10µm
- Minimum Dielectric Thickness: 100µm
- Minimum Trace Width: 102µm
- Minimum Spacing: 102µm
- Via Features: Via filled and capped (No blind or buried vias)

These specifications are meticulously designed to ensure high performance and reliability in a variety of applications.

PCB Stack-Up: Strategic Layer Arrangement

The stack-up of this PCB is carefully designed to optimize its functionality and durability:

- Layer 1: 45µm Copper, providing a solid foundation for electrical connectivity.
- Layer 2: 35µm Copper on FR408HR (100µm Prepreg), ensuring minimal signal loss.
- Layer 3: 35µm Copper on FR408HR (1230µm Core), enhancing thermal management.
- Layer 4: 45µm Copper, completing the robust multi-layer structure.

This strategic arrangement allows for excellent electrical performance and heat dissipation, making it ideal for high-density applications.

Quality and Compliance: Adherence to Industry Standards

This PCB adheres to IPC-Class-3 quality standards, ensuring reliability and performance excellence. It is available worldwide, making it accessible for various projects. The provided artwork follows the Gerber RS-274-X format, guaranteeing compatibility with industry standards and facilitating a smooth production process.

Advantages of FR408HR Material: Superior Performance Characteristics

The FR408HR laminate and prepreg are engineered with Isola’s patented resin system, which offers several advantages:

- Improved Z-Axis Expansion: 30% better than competing products, ensuring stability under thermal stress.
 

- Higher Electrical Bandwidth: 25% lower loss improves signal integrity, essential for high-speed applications.
 

- Superior Moisture Resistance: Outstanding performance during reflow processes, reducing the risk of defects.
 

- Compatibility: Laser fluorescing and UV blocking enhance inspection accuracy and production efficiency.

These features make FR408HR an excellent choice for demanding environments.

Key Features: Technical Specifications

- Glass Transition Temperature (Tg): 190°C, ensuring thermal stability.
 

- Dielectric Constant: 3.65 @ 10GHz, providing reliable signal transmission.
 

- Dissipation Factor: 0.0095 @ 10GHz, minimizing energy loss.
 

- RoHS Compliant: Environmentally friendly, meeting regulatory standards.
 

- CAF Resistant: Suitable for lead-free assembly processes.
 

- Reflow Capable: Up to 6 times at 260°C, accommodating various soldering techniques.

Typical Applications: Versatile Use Cases

This PCB is perfectly suited for a wide range of applications, including:

- High-Density Interconnect (HDI) Applications: Ideal for compact designs requiring efficient space utilization.
 

- High-Speed Digital Devices: Supports fast data transfer rates and reliable performance.
 

- Networking and Communication Equipment: Ensures stable connections and minimal signal degradation.
 

- Medical and Industrial Instrumentation: Provides reliability and precision in critical environments.

In summary, our high-performance 4-layer rigid PCB is a versatile solution tailored to meet the needs of modern electronics, combining robust specifications with advanced material technology.