M6 High Speed PCB Low Loss Multilayer 2mm Impedance Circuit Board

Product Specification

We are pleased to introduce a high speed PCB with Megtron 6 (M6)laminates,which is specifically engineered for applications in 5G communication, millimeter-wave radar, high-speed servers, and high-performance computing (HPC). With its exceptional electrical and thermal properties, the M6 laminate ensures superior performance in high-frequency signal transmission, making it an ideal choice for advanced electronic devices.

Key Features of Megtron 6 (M6) 
The M6 laminate stands out in the market due to its unique combination of properties, making it a preferred material for high-frequency and high-speed applications. Here are some of its standout features:

1. Low Dielectric Loss (Df):

Dissipation Factor: 0.002 at 1GHz/23°C, 0.0037 at 13GHz

Ensures minimal signal loss, making it ideal for high-frequency applications.

2. Stable Dielectric Constant (Dk):

Dk: 3.4 at 1GHz/23°C, 3.34 at 13GHz

Provides consistent signal transmission across a wide frequency range.

3. Excellent Thermal Reliability:

High Tg value: >185°C (DSC method), 210°C (DMA method)

Thermal Decomposition Temperature (Td): 410°C (TGA method)

Ensures stability under high-temperature conditions, making it suitable for demanding environments.

4. Low CTE (Coefficient of Thermal Expansion):

X/Y axis: 16 ppm/°C, Z axis: 45 ppm/°C

Reduces the risk of warping or delamination during thermal cycling.

5. Compatibility with FR-4 Processing:

No special equipment required, reducing production costs and simplifying manufacturing.

6. RoHS and Halogen-Free Compliance:

Meets global environmental standards for green manufacturing.

7. Flammability Rating: UL 94V-0

Ensures safety and reliability in high-temperature and high-stress environments.

16-Layer Rigid PCB Stackup Details
The M6 laminate supports 4 to 30-layer multilayer PCB designs, making it suitable for complex circuit requirements. Below is an example of a 16-layer rigid PCB stackup:

Copper Layers: 35 μm (outer layers), 17 μm (inner layers)

Prepreg Material: R-5670(G)

Core Material: M6 R5775G(HVLP)

Board Thickness: 2.0 mm

Surface Finish: Electroless Nickel Immersion Gold (ENIG)

Solder Mask: Green (top and bottom)

Silkscreen: White (top and bottom)

Via Plating Thickness: 25 μm

Minimum Trace/Space: 3/4 mils

Minimum Hole Size: 0.2 mm

Impedance Control
The M6 laminate ensures precise impedance control for high-frequency applications:

Single-Ended Impedance:

75Ω (L1, 11.8 mils, reference layer 4)

50Ω (L1/L16, 5.9 mils, reference layers 2/15)

Differential Impedance:

100Ω (L1, 5.9 mils/7.87 mils, reference layer 2)

100Ω (L10/L12, 3.94 mils/5.9 mils, reference layers 9/11/13)

PCB Construction Details
Board Dimensions: 110 mm x 110 mm (±0.15 mm)

Finished Copper Weight: 1 oz (outer layers), 0.5 oz/1 oz (inner layers)

Via Filling: 0.2 mm vias filled and capped

Electrical Testing: 100% tested prior to shipment

Quality Standard: IPC-Class-2

Typical Applications
The Megtron 6 (M6) R-5775 laminate is widely used in the following industries:

5G Communication: Millimeter-wave antennas, RF front-ends for AAU (Active Antenna Unit).

Automotive Electronics: 77GHz millimeter-wave radar, ADAS (Advanced Driver-Assistance Systems).

Data Centers: High-speed server motherboards, 400G/800G optical module PCBs.

Aerospace: High-frequency circuit boards for satellite communication and radar systems.

Consumer Electronics: Wi-Fi 6E/7 routers, AR/VR devices.

Why Choose Megtron 6 (M6) PCB?
High Performance: Optimized for high-frequency and high-speed applications.

Cost-Effective: Compatible with traditional FR-4 processing technology.

Reliability: Excellent thermal and electrical properties ensure long-term stability.

Global Availability: Ready to ship worldwide

Contact Us for Inquiries
If you’re looking for high-quality PCBs using Megtron 6 (M6) laminate, we’re here to help. Whether you’re working on 5G infrastructure, automotive electronics, or high-performance computing, we have the expertise to deliver reliable and cost-effective solutions.