Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | 1W/MK dielectric material |
| Layer count | Single side |
| PCB thickness | 1.6mm ±0.16 |
| PCB size | 115 x 85mm=1PCS |
| Solder mask | white |
| Silkscreen | N/A |
| Copper weight | 1oz |
| Surface finish | OSP |
| Brand Name | Bicheng |
| Model Number | BIC-756.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | 1W/MK dielectric material | Layer count | Single side |
| PCB thickness | 1.6mm ±0.16 | PCB size | 115 x 85mm=1PCS |
| Solder mask | white | Silkscreen | N/A |
| Copper weight | 1oz | Surface finish | OSP |
| Brand Name | Bicheng | Model Number | BIC-756.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Insulated Metal Core PCB ，Single Sided Metal Core PCB ，Insulated Single Sided Copper PCB | ||
Copper Based PCB Single Sided Copper PCB Insulated Metal Substrate PCB IMS PCB
1. General information
This is a type of metal core PCB built on copper base with 1W/MK dielectric. It's single sided copper PCB with 1.6mm thick, white solder mask and OSP on pads. There're 4 countersunk holes in board. Contours are CNC routed.
1.2 Data sheets
| PCB SIZE | 115 x 85mm=1PCS |
| BOARD TYPE | Copper Based PCB, IMS PCB |
| Number of Layers | Single sided PCB |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 35um(1oz) |
| 1W/MK dielectric material | |
| Copper Based | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 9 mil /9 mil |
| Minimum / Maximum Holes: | 3.0 / 6.0 mm |
| Number of Different Holes: | 3 |
| Number of Drill Holes: | 12 |
| Thermal impedance(°C/W) | 0.52 K·cm2/W |
| Breakdown Voltage(VDC) | 5000 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Thermal conductivity | 1W/MK dielectric material, MCPCB |
| Final foil external: | 1oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | OSP |
| Solder Mask Apply To: | Top. 12µm Minimum. |
| Solder Mask Color: | White |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | N/A |
| Colour of Component Legend | N/A |
| Manufacturer Name or Logo: | N/A |
| VIA | no via |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
1.3 Copper PCB Extention
Copper core PCB is one of the most expensive metal substrates, and its thermal conductivity is many times better than that of aluminum and iron substrates. It is suitable for high frequency circuits, high and low temperature changing regions and the heat dissipation and building decoration industries of precision communication equipment.
The circuit layer of copper substrate is required to have a large current-carrying capacity, so a thick copper foil should be used, the thickness of which is generally 35 μm ~ 280 μm;
Thermal insulation layer is the core technology of copper substrate too. The core thermal conductivity is composed of aluminum trioxide and silicon powder and polymer filled with epoxy resin, the thermal resistance is low (0.15), viscoelasticity is excellent, and it has the ability to resist thermal aging. It is able to withstand mechanical and thermal stress.
Metal base is the support member of copper PCB. It is required to have high thermal conductivity, generally copper sheet is used because copper can provide better thermal conductivity, suitable for drilling, punching, shearing and cutting and other conventional machining.
1.4 Metal Core PCB Capability 2021
| Metal Core PCB Capability | ||
| NO. | Parameter | Value |
| 1 | Type of Metal Core | Aluminum, Copper, Iron |
| 2 | Model of Metal Core | A1100, A5052, A6061, A6063, C1100 |
| 3 | Surface Finish | HASL, Immersion Gold, Immersion Silver, OSP |
| 4 | Thickness of Surface plating | HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm |
| 5 | Layer Count | 1-4 Layers |
| 6 | Maximum of Board Size | 23" x 46" (584mm×1168mm) |
| 7 | Mininum of Board Size | 0.1969" x 0.1969" (5mm×5mm) |
| 8 | Board Thickness | 0.0157" x 0.2362" (0.4-6.0mm) |
| 9 | Copper Thickness | 0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),3OZ(105µm),4OZ(140µm) to 10oz (350µm) |
| 10 | Minimum Track Width | 5mil (0.127mm) |
| 11 | Minimum Space | 5mil (0.127mm) |
| 12 | Minimum Hole Size | 0.0197" (0.5mm) |
| 13 | Maximum Hole Size | No limit |
| 14 | Minimum Holes Punched | PCB thickness <1.0mm: 0.0394" (1.0mm) |
| PCB thikness 1.2-3.0mm: 0.0591" (1.5mm) | ||
| 15 | PTH Wall Thickness | >20µm |
| 16 | Tolerance of PTH | ±0.00295" (0.075mm) |
| 17 | Tolerance of NPTH | ±0.00197" (0.05mm) |
| 18 | Deviation of Hole Position | ±0.00394" (0.10mm) |
| 19 | Outline Tolerance | Routing: ±0.00394" (0.1mm) |
| Punching: ±0.00591" (0.15mm) | ||
| 20 | Angle of V-cut | 30°, 45°, 60° |
| 21 | V-cut Size | 0.1969" x 47.24" (5mm×1200mm) |
| 22 | Thickness of V-cut Board | 0.0236" x 0.1181" (0.6-3mm) |
| 23 | Tolerance of V-cut Angle | ±5º |
| 24 | V-CUT Verticality | ≤0.0059" (0.15mm) |
| 25 | Minimum Square Slots Punched | PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm) |
| PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm) | ||
| 26 | Minimum BGA PAD | 0.01378" (0.35mm) |
| 27 | Minimum Width of Solder Mask Bridge. | 8mil (0.2032mm) |
| 28 | Minimum Thickness of Solder Mask | >13µm (0.013mm) |
| 29 | Insulation Resistance | 1012ΩNormal |
| 30 | Peel-off Strength | 2.2N/mm |
| 31 | Solder float | 260℃ 3min |
| 32 | E-test Voltage | 50-250V |
| 33 | Thermal Conductivity | 0.8-8W/M.K |
| 34 | Warp or Twist | ≤0.5% |
| 35 | Flammability | FV-0 |
| 36 | Minimum Height of Component indicator | 0.0059"(0.15mm) |
| 37 | Minimum Open Solder Mask on Pad | 0.000394" (0.01mm) |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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