Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | FR-4 |
| Layer count | 8 layers |
| PCB thickness | 1.6mm ±0.16 |
| PCB size | 210.72 x 212.42mm=1UP |
| Solder mask | Green |
| Silkscreen | White |
| Copper weight | 1oz |
| Surface finish | Immersion gold |
| Brand Name | Bicheng |
| Model Number | BIC-481.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | FR-4 | Layer count | 8 layers |
| PCB thickness | 1.6mm ±0.16 | PCB size | 210.72 x 212.42mm=1UP |
| Solder mask | Green | Silkscreen | White |
| Copper weight | 1oz | Surface finish | Immersion gold |
| Brand Name | Bicheng | Model Number | BIC-481.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Tg170 FR4 Multi layer Printed Circuit Board ，Tg170 Multi layer Printed Circuit Board ，Tg170 FR4 8 Layer PCB Board | ||
| Number of Layers | 8 |
| Board Type | Multilayer PCB |
| Board size | 210.72 x 212.42mm=1UP |
| Board Thickness | 1.60 mm +/-0.16 |
| Board Material | FR-4 |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 170℃ |
| PTH Cu thickness | ≥20 um |
| Inner Iayer Cu thicknes | 35 um (1oz) |
| Surface Cu thickness | 35 um (1oz) |
| Solder Mask Type and Model No. | LPSM, PSR-2000GT600D |
| Solder Mask Supplier | TAIYO |
| Solder Mask Colour | Green |
| Number of Solder Masks | 2 |
| Thickness of Solder Mask | 14 um |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| Mininum Trace (mil) | 5.8 mil |
| Minimum Gap(mil) | 5.4 mil |
| Surface Finish | Immersion Gold |
| RoHS Required | Yes |
| Warpage | 0.25% |
| Thermal Shock Test | Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Solderablity Test | Pass, 255±5℃,5 seconds Wetting Area Least 95% |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6012C Class 2 |
| Drill table (mm) | |
| T1 | 0.450 |
| T2 | 0.600 |
| T3 | 0.800 |
| T4 | 0.900 |
| T5 | 0.950 |
| T6 | 1.000 |
| T7 | 1.250 |
| T8 | 1.300 |
| T9 | 1.400 |
| T10 | 1.600 |
| T11 | 1.700 |
| T12 | 2.000 |
| T13 | 2.550 |
| T14 | 3.000 |
| T15 | 3.250 |
| T16 | 3.500 |
| Serial NO. | Procedure | Item | Manufacturing capability | ||
| Large volume (S<100 m²) | Middle volume (S<10 m²) | Prototype(S<1m²) | |||
| 66 | Contour process | Method of contour process | CNC milling, V-CUT, Break-out tap, break-out holes, Punching | ||
| 67 | Minimum router | 0.8mm | |||
| 68 | Min.tolerance of contour | ±0.15mm | ±0.13mm | ±0.1mm | |
| 69 | Min.distance of milling contour(no copper exposure) | 12mil | 10mil | 8mil | |
| 70 | Angle of V-CUT | 20,30,45,60 ±5 degree | |||
| 71 | Degree of symmetry of V-CUT | ±6mil | ±5mil | ±4mil | |
| 72 | Tolerance of residual thickness of V-CUT | ±6mil | ±5mil | ±4mil | |
| 73 | Tolerance of Chamfer angle of Gold finger | ±5 degree | ±5 degree | ±5 degree | |
| 74 | Tolerance of residual thickness of bevel edge of gold finger | ±5mil | ±5mil | ±5mil | |
| 75 | Min radius of inner corner | 0.4mm | |||
| 76 | Min. distance from edge to V-Cut (no copper exposure) | 18mil (1.6mm Thick, 20 degree V-groove cutter) | 14mil(1.6mm Thick, 20 degree V-groove cutter) | 12mil (1.6mm Thick, 20 degree V-groove cutter) | |
| 77 | 20mil (1.6mm Thick, 30 degree V-groove cutter) | 18mil (1.6mm Thick, 30 degree V-groove cutter) | 16mil (1.6mm Thick, 30 degree V-groove cutter) | ||
| 78 | 24mil (1.6mm Thick, 45 degree V-groove cutter) | 22mil (1.6mm Thick, 45 degree V-groove cutter) | 20mil (1.6mm Thick, 45 degree V-groove cutter) | ||
| 79 | 30mil (1.6mm Thick, 60 degree V-groove cutter) | 28mil (1.6mm Thick, 60 degree V-groove cutter) | 26mil (1.6mm Thick, 60 degree V-groove cutter) | ||
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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