Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | FR-4 |
| Layer count | 6 Layers |
| PCB thickness | 1.6mm ±0.16 |
| PCB size | 54.99 x 87.50mm=1UP |
| Solder mask | Green |
| Silkscreen | White |
| Copper weight | 1oz |
| Surface finish | Immersion gold |
| Brand Name | Bicheng |
| Model Number | BIC-477.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
View Detail Information
Explore similar products
Thick PCB 2.4mm Circuit Board Dual Layer PCB Board Built on FR-4 With 2oz Copper
TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB
Matt Blue 50 Ohm Impedance Controlled PCB for Medical Equipment
6-Layer PCB Single End Impedance Controlled PCB With 90 Ohm Impedance Controlled
Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | FR-4 | Layer count | 6 Layers |
| PCB thickness | 1.6mm ±0.16 | PCB size | 54.99 x 87.50mm=1UP |
| Solder mask | Green | Silkscreen | White |
| Copper weight | 1oz | Surface finish | Immersion gold |
| Brand Name | Bicheng | Model Number | BIC-477.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Immersion Gold Automotive Printed Circuit Board ，FR4 Tg170 Automotive Printed Circuit Board ，FR4 Tg170 High Density PCB | ||
| Number of Layers | 6 |
| Board Type | Multi-layer PCB |
| Board size | 54.99 x 87.50mm=1UP |
| Board Thickness | 1.6mm +/-0.16 |
| Board Material | FR-4 |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 170℃ |
| PTH Cu thickness | ≥20 um (See hole wall details) |
| Inner Iayer Cu thicknes | 35 um (1oz) |
| Surface Cu thickness | 35 um (1oz) |
| Solder Mask Type and Model No. | LPSM, PSR-2000GT600D |
| Solder Mask Supplier | TAiYO |
| Solder Mask Colour | Green |
| Number of Solder Masks | 2 |
| Thickness of Solder Mask | 13um |
| Type of Silkscreen Ink | TAIYO, IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| Mininum Trace (mil) | 7 mil |
| Minimum Gap(mil) | 4.9 mil |
| Surface Finish | Immersion Gold |
| RoHS Required | Yes |
| Warpage | 0.25% |
| Drill table (mm) | |
| T1 | 1.000 |
| T2 | 3.175 |
| Thermal Shock Test | Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Solderablity Test | Pass, 255±5℃,5 seconds Wetting Area Least 95% |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6012C Class 2 |
| Drill table (mm) | T1: 0.600 |
| T2: 0.700 | |
| T3:0.800 | |
| T4: 1.000 | |
| T5: 1.100 | |
| T6: 1.250 | |
| T7: 1.850 | |
| T8: 4.000 | |
| T9: 4.325 | |
| Serial NO. | Procedure | Item | Manufacturing capability | ||
| Large volume (S<100 m²) | Middle volume (S<10 m²) | Prototype(S<1m²) | |||
| 1 | Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) | Min.isolation of layers | 0.1mm | 0.1mm | 0.06mm |
| 2 | Min.track and spacing | 5/5mil(18um) | 4/4mil(18um) | 3/3.5mil(18um) | |
| 3 | 5/5mil(35um) | 4/4mil(35um) | 3/4mil(35um) | ||
| 4 | 7/9mil(70um) | 6/8mil(70um) | 6/7mil(70um) | ||
| 5 | 9/11mil(105um) | 8/10mil(105um) | 8/9mil(105um) | ||
| 6 | 13/13mil(140um) | 12/12mil(140um) | 12/11mil(140um) | ||
| 7 | Min.distance from drill to conductor | 4 Layer 10mil,6 layer 10mil,8-12 layer 12mil | 4 layer 8mil,6 layer 8mil,8-12 layer 10mil,14-20 layer 14mil,22-32 layer 18mil | 4 layer 6mil,6 layer 6mil,8-14 layer 8mil,16-22 layer 12mil,24-32 layer 14mil | |
| 8 | Min.width of annular ring on inner layer | 4 Layer 10mil(35um),≥6 Layer 14mil(35um) | 4 Layer 8mil(35um),≥6 layer 12mil(35um) | 4 Layer 6mil(35um),≥6 Layer 10mil(35um) | |
| 9 | Inner layer isolation ring width(Min) | 10mil (35um) | 8mil (35um) | 6mil (35um) | |
| 10 | Min.via pad diameter | 20mil (35um) | 16mil (35um) | 16mil (35um) | |
| 11 | Min. distance from board edge to conductor(no copper exposured)(inner layer) | 14 mil(35um) | 12 mil(35um)) | 8 mil(35um) | |
| 12 | Maximum copper weight(Inner layer and outer layer) | 3 OZ( 105 um ) | 4 OZ ( 140 um ) | 6 OZ( 210 um ) | |
| 13 | Core with different copper foil on both sides | / | 18/35,35/70 um | 18/35,35/70 um | |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
Get in touch with us
Leave a Message, we will call you back quickly!