Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | TLY-3 |
| Layer count | 2 layers |
| PCB size | 100 x 90mm=1PCS |
| PCB thickness | 0.8mm |
| Silkscreen | White |
| Copper weight | 0.5oz |
| Surface finish | immersion gold |
| Brand Name | Bicheng |
| Model Number | BIC-036.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | TLY-3 | Layer count | 2 layers |
| PCB size | 100 x 90mm=1PCS | PCB thickness | 0.8mm |
| Silkscreen | White | Copper weight | 0.5oz |
| Surface finish | immersion gold | Brand Name | Bicheng |
| Model Number | BIC-036.V1.0 | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | Lightweight Communication PCB ，100x90mm Communication PCB ，100x90mm 2 Sided PCB | ||
Taconic High Frequency PCB Built On TLY-3 30mil 0.762mm With Immersion Gold for Satellite / Cellular Communications
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Taconic TLY laminates are a type of low loss laminates. They are manufactured with very lightweight woven fiberglass and are more dimensionally stable than chopped fiber reinforced PTFE composites. The woven matrix yields a more mechanically stable laminate that is suitable for high volume manufacturing. The low dissipation factor enables successful deployment for automotive radar applications designed at 77 GHz as well as other antennas in millimeter wave frequencies.
The dielectric constant is as low as 2.17-2.20 +/-0.02, and dissipation factor is as low as 0.0009.
Data Sheet of Taconic TLY Material
| TLY TYPICAL VALUES | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| DK at 10 GHz | IPC-650 2.5.5.5 | 2.2 | 2.2 | ||
| Df at 10 GHz | IPC-650 2.5.5.5 | 0.0009 | 0.0009 | ||
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
| Dielectric Strength | ASTM D 149 | V/mil | 2,693 | V/mil | 106,023 |
| Volume Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms/cm | 1010 | Mohms/cm | 1010 |
| Volume Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms/cm | 1010 | Mohms/cm | 109 |
| Surface Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms | 108 | Mohms | 108 |
| Surface Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms | 108 | Mohms | 108 |
| Flex Strength(MD) | IPC-650 2.4.4 | psi | 14,057 | N/mm2 | 96.91 |
| Flex Strength(CD) | IPC-650 2.4.4 | psi | 12,955 | N/mm2 | 89.32 |
| Peel Stength(½ oz.ed copper) | IPC-650 2.4.8 | Ibs./inch | 11 | N/mm | 1.96 |
| Peel Stength(1 oz.CL1 copper) | IPC-650 2.4.8 | Ibs./inch | 16 | N/mm | 2.86 |
| Peel Stength(1 oz..CV1 copper) | IPC-650 2.4.8 | Ibs./inch | 17 | N/mm | 3.04 |
| Peel Stength | IPC-650 2.4.8(after elevated temp.) | Ibs./inch | 13 | N/mm | 2.32 |
| Young's Modulus(MD) | ASTM D 3039/IPC-650 2.4.19 | psi | 1.4 x 106 | N/mm2 | 9.65 x 103 |
| Poisson's Ratio(MD) | ASTM D 3039/IPC-650 2.4.19 | 0.21 | 0.21 | ||
| Thermal Conductivity | ASTM F 433 | W/M*K | 0.22 | W/M*K | 0.22 |
| Dimensional Stability(MD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.038 | -0.038 | |
| Dimensional Stability(CD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.031 | -0.031 | |
| Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.19 | g/cm3 | 2.19 |
| CTE(X axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 26 | ppm/℃ | 26 |
| CTE(Y axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 15 | ppm/℃ | 15 |
| CTE(Z axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 217 | ppm/℃ | 217 |
| NASA Outgassing(% TML) | 0.01 | 0.01 | |||
| NASA Outgassing(% CVCM) | 0.01 | 0.01 | |||
| NASA Outgassing(% WVR) | 0.00 | 0.00 | |||
| UL-94 Flammability Rating | UL-94 | V-0 | V-0 | ||
The use of high-performance materials in electronic devices and systems can significantly improve their functionality and reliability, leading to a range of benefits across various industries. One such material is a dimensionally stable and low-moisture absorption substrate with low dielectric loss and a high copper peel strength. These features make it an ideal choice for applications in automotive radar, satellite/cellular communications, power amplifiers, LNBs, LNAs, LNCs, and aerospace.
In addition, the uniform and consistent dielectric constant of this material allows for accurate and predictable signal performance, which is essential in advanced communication systems. Moreover, its laser ablation capability provides a high degree of precision and flexibility in the manufacturing process, allowing for the creation of complex and intricate circuit designs. Overall, the benefits of using this material extend beyond its technical performance characteristics, as it can also provide significant cost-saving advantages due to its long-term reliability and durability in harsh operating environments.
Furthermore, the use of this material is particularly advantageous in Ka, E, and W band applications, which require high-frequency capabilities and low signal loss. These frequency ranges are used in various communication systems, including satellite and cellular communication, where low loss and high efficiency are crucial for reliable and efficient transmission of data. Additionally, the material's high copper peel strength makes it an excellent choice for power amplifiers, which require high thermal conductivity and robust mechanical properties. The combination of its unique features makes it an ideal choice for a wide range of applications, from consumer electronics to advanced communication systems and aerospace technology.
PCB Specifications
| PCB SIZE | 100 x 90mm=1PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 18um(0.5 oz)+plate TOP layer |
| TLY-3 0.762mm | |
| copper ------- 18um(0.5 oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4 mil / 4 mil |
| Minimum / Maximum Holes: | 0.4mm |
| Number of Different Holes: | 1 |
| Number of Drill Holes: | 1 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | TLY-3 0.762mm |
| Final foil external: | 1oz |
| Final foil internal: | N/A |
| Final height of PCB: | 0.8 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold (31%) |
| Solder Mask Apply To: | NO |
| Solder Mask Color: | N/A |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | Top Side |
| Colour of Component Legend | white |
| Manufacturer Name or Logo: | Marked on the board in a conductor and legend FREE AREA |
| VIA | N/A |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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