Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | High-Tg and High Thermal Reliability Epoxy Resin |
| Layer count | Double Layer, Multilayer, Hybrid PCB |
| PCB thickness | 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm) |
| PCB size | ≤400mm X 500mm |
| Solder mask | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
| Copper weight | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm) |
| Surface finish | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc.. |
| Brand Name | Bicheng |
| Model Number | BIC-502.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | High-Tg and High Thermal Reliability Epoxy Resin | Layer count | Double Layer, Multilayer, Hybrid PCB |
| PCB thickness | 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm) | PCB size | ≤400mm X 500mm |
| Solder mask | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. | Copper weight | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm) |
| Surface finish | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc.. | Brand Name | Bicheng |
| Model Number | BIC-502.V1.0 | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | Lead Free Multilayer Printed Circuit Board ，E Glass Coated Printed Circuit Board ，Hybrid PCB Printed Circuit Board | ||
High Tg Lead Free Multi-layer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.
Main Applications
Consumer Electronics
Server, workstation
Automotive
Key Features
Lead Free process compatible
Excellent coefficient of thermal expansion
Anti-CAF property
Superior chemical and thermal resistance
Fluorescence for AOI
Moisture resistance
Our PCB Capability (TU-768)
| High Tg Lead Free Multi-layer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg | High-Tg and High Thermal Reliability Epoxy Resin |
| Designation: | TU-768 |
| Dielectric constant: | 4.3 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm) |
| PCB thickness: | 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc.. |
| Technology: | HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc. |
Typical Properties of TU-768
| Typical Values | Conditioning | IPC-4101 /126 | |
| Thermal | |||
| Tg (DMA) | 190°C | ||
| Tg (DSC) | 180°C | > 170°C | |
| Tg (TMA) | 170°C | E-2/105 | |
| Td (TGA) | 350°C | > 340°C | |
| CTE x-axis | 11~15 ppm/°C | N/A | |
| CTE y-axis | 11~15 ppm/°C | E-2/105 | N/A |
| CTE z-axis | 2.70% | < 3.0% | |
| Thermal Stress,Solder Float, 288°C | > 60 sec | A | > 10 sec |
| T260 | > 60 min | > 30 min | |
| T288 | > 20 min | E-2/105 | > 15 min |
| T300 | > 2 min | > 2 min | |
| Flammability | 94V-0 | E-24/125 | 94V-0 |
| DK & DF | |||
| Permittivity (RC 50%) @10GHz | 4.3 | ||
| Loss Tangent (RC 50%) @10GHz | 0.018 | ||
| Electrical | |||
| Permittivity (RC50%) | |||
| 1GHz (SPC method/4291B) | 4.4 / 4.3 | < 5.2 | |
| 5GHz (SPC method) | 4.3 | E-2/105 | N/A |
| 10GHz (SPC method) | 4.3 | N/A | |
| Loss Tangent (RC50%) | |||
| 1GHz (SPC method/4291B) | 0.019 /0.018 | < 0.035 | |
| 5GHz (SPC method) | 0.021 | E-2/105 | N/A |
| 10GHz (SPC method) | 0.023 | N/A | |
| Volume Resistivity | > 1010 MΩ•cm | C-96/35/90 | > 106 MΩ•cm |
| Surface Resistivity | > 108 MΩ | C-96/35/90 | > 104 MΩ |
| Electric Strength | > 40 KV/mm | A | > 30 KV/mm |
| Dielectric Breakdown | > 50 kV | A | > 40 KV |
| Mechanical | |||
| Young’s Modulus | |||
| Warp Direction | 25 GPa | A | N/A |
| Fill Direction | 22 GPa | ||
| Flexural Strength | |||
| Lengthwise | > 60,000 psi | A | > 60,000 psi |
| Crosswise | > 50,000 psi | A | > 50,000 psi |
| Peel Strength, 1.0 oz RTF Cu foil | 7~9 lb/in | A | > 4 lb/in |
| Water Absorption | 0.18% | E-1/105+D-24/23 | < 0.8 % |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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