Payment Terms | T/T |
Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days |
Packaging Details | Vacuum bags+Cartons |
Base material | Low DK Glass Cloth |
Layer count | Multilayer PCB, Hybrid PCB |
PCB thickness | 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm |
PCB size | ≤400mm X 500mm |
Solder mask | Green, Black, Blue, Yellow, Red etc. |
Copper weight | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Surface finish | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
Brand Name | Bicheng |
Model Number | BIC-173.V1.0 |
Certification | UL, ISO9001, IATF16949 |
Place of Origin | CHINA |
View Detail Information
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Product Specification
Payment Terms | T/T | Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
Base material | Low DK Glass Cloth | Layer count | Multilayer PCB, Hybrid PCB |
PCB thickness | 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm | PCB size | ≤400mm X 500mm |
Solder mask | Green, Black, Blue, Yellow, Red etc. | Copper weight | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Surface finish | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. | Brand Name | Bicheng |
Model Number | BIC-173.V1.0 | Certification | UL, ISO9001, IATF16949 |
Place of Origin | CHINA | ||
High Light | Multilayer Printed High Speed PCB ,Heat Resistant Multilayer Printed PCB ,Mobile Networking Multilayer Printed PCB |
M6 High Speed Low Loss Multilayer Printed Circuit Board Megtron 6 PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Dear friends,
Today, I am going to talk about a type of high speed low loss multilayer PCB: M6 R-5775 PCB.
Megtron 6 is an ultra-low loss, highly heat resistant circuit board material designed for mobile, networking, and wireless applications etc. The main properties of Megtron 6 are low dielectric constant (DK) and dielectric dissipation factors (DF), low transmission loss and high heat resistance.
Part Numbers
Low Dielectric Constant (Dk) Glass Cloth - Laminate R-5775(N) / PrepregR-5670(N)
Standard E Glass Cloth - Laminate R-5775 / PrepregR-5670
They Features low Dk = 3.7 (@ 1GHz), low Df = 0.002 (@ 1GHz), excellent through-hole reliability (5x better than our conventional high Tg FR4 material), lead-free, ROHS-compliant soldering, high heat resistance. M6 also provides excellent high-density interconnect (HDI) and thermal performance.
Our PCB Capabilities (Megtron 6)
PCB Material: | Low DK Glass Cloth |
Designation: | Laminate R-5775(G), Prepreg R-5670(G) |
Dielectric constant: | 3.61 at 10GHz |
Dissipation Factor | 0.004 at 10GHz |
Layer count: | Multilayer PCB, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
Main Applications
Antenna (Automotive millimeter wave radar, Base station)
ICT infrastructure equipment,
Measuring instrument,
Super computer,
Typical Value of R-5775
Property | Units | Test Method | Condition | Typical Value | ||
THERMAL | Glass Transition Temp ( Tg ) | C | DSC | As received | 185 | |
DMA | As received | 210 | ||||
Thermal Decomposition Temp | C | TGA | As received | 410 | ||
Time to Delam (T288) | Without Cu | Min | IPC TM-650 2.4.24.1 | As received | > 120 | |
With Cu | Min | IPC TM-650 2.4.24.1 | As received | > 120 | ||
CTE : α1 | X - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | < Tg | 14 - 16 | |
Y - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | < Tg | 14 - 16 | ||
Z - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | < Tg | 45 | ||
CTE : α2 | Z - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | > Tg 260 | 260 | |
ELECTRICAL | Volume Resistivity | MΩ - cm | IPC TM-650 2.5.17.1 | C-96/35/90 | 1 x 109 | |
Surface Resistivity | MΩ | IPC TM-650 2.5.17.1 | C-96/35/90 | 1 x 108 | ||
Dielectric Constant ( Dk ) | @ 1GHz | / | IPC TM-650 2.5.5.9 | C-24/23/50 | 3.71 | |
@ 10GHz | / | IPC TM-650 2.5.5.5 | C-24/23/50 | 3.61 | ||
Dissipation Factor ( Df ) | @ 1GHz | / | IPC TM-650 2.5.5.9 | C-24/23/50 | 0.002 | |
@ 10GHz | / | IPC TM-650 2.5.5.5 | C-24/23/50 | 0.004 | ||
PHYSICAL | Water Absorption | % | IPC TM-650 2.6.2.1 | D-24/23 | 0.14 | |
Peel Strength | 1oz ( H-VLP ) | kN / m | IPC TM-650 2.4.8 | As Received 0.8 | 0.8 | |
Flammability | / | UL | C-48/23/50 | 94V-0 |
Megtron 6 Material List in stock (as of September 2021)
Item | Thickness (mil) | Thickness(mm) | Structure | Copper weight(oz) | Type of copper |
R5775G | 2.0 | 0.050 | 1035*1 | H/H | HVLP |
R5775G | 2.6 | 0.065 | 1080*1 | H/H | HVLP |
R5775G | 3.0 | 0.075 | 1078*1 | 1.0/1.0 | RTF |
R5775G | 3.0 | 0.075 | 1078*1 | H/H | RTF |
R5775G | 3.0 | 0.075 | 1078*1 | 1.0/1.0 | HVLP |
R5775G | 3.0 | 0.075 | 1078*1 | H/H | HVLP |
R5775G | 3.9 | 0.100 | 3313*1 | H/H | RTF |
R5775G | 3.9 | 0.100 | 3313*1 | 1.0/1.0 | RTF |
R5775G | 5.9 | 0.150 | 1080*2 | 2.0/2.0 | RTF |
R5775G | 9.8 | 0.250 | 2116*2 | H/H | RTF |
We can provide you with prototypes, small batches and mass production PCB’s. Any questions, please feel free to contact us.
Thanks for your reading.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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