Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Hydrocarbon Ceramic Laminates |
| Layer count | Double Layer, Multilayer, Hybrid PCB |
| PCB thickness | 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm) |
| PCB size | ≤400mm X 500mm |
| Solder mask | Green, Black, Blue, Yellow, Red etc. |
| Copper weight | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Surface finish | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
| Brand Name | Bicheng |
| Model Number | BIC-130.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Hydrocarbon Ceramic Laminates | Layer count | Double Layer, Multilayer, Hybrid PCB |
| PCB thickness | 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm) | PCB size | ≤400mm X 500mm |
| Solder mask | Green, Black, Blue, Yellow, Red etc. | Copper weight | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Surface finish | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. | Brand Name | Bicheng |
| Model Number | BIC-130.V1.0 | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | 16.7mil Rogers PCB Board ，RO4003C LoPro Rogers PCB Board ，Routers Servers Rogers PCB Board | ||
Double Layer Rogers PCB Built on 16.7mil RO4003C LoPro Reverse Treated Foil for Routers, Servers etc.
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RO4003C LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4003C laminate system.
Features and Benefits:
RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.
1. Lower insertion loss
2. Low PIM
3. Increased signal integrity
4. High circuit density
Low Z-axis coefficient of thermal expansion
1. Multi-layer board capability
2. Design flexibility
Lead-free process compatible
1. High temperature processing
2. Meets environmental concerns
CAF resistant
Our PCB Capability (RO4003C LoPro)
| Our PCB Capability (RO4003C LoPro) | |
| PCB Material: | Hydrocarbon Ceramic Laminates |
| Designation: | RO4003C LoPro |
| Dielectric constant: | 3.38±0.05 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
Some Typical Applications:
1. Digital applications such as servers, routers, and high speed back planes
2. Cellular base station antennas and power amplifiers
3. LNB’s for direct broadcast satellites
4. RF Identification Tags
Typical Properties of RO4003C LoPro
| RO4003C LoPro | |||||
| Property | Typical Value | Direction | Units | Condition | Test Method |
| Dielectric Constant, Process | 3.38 ± 0.05 | z | -- | 10 GHz/23°C | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant, Design | 3.5 | z | -- | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factor tan, | 0.0027 0.0021 | z | -- | 10 GHz/23°C 2.5 GHz/23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coeffifi cient of r | 40 | z | ppm/°C | -50°C to 150°C | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 X 1010 | MΩ•cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 X 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | z | KV/mm(V/mil) | 0.51mm(0.020”) | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 26889(3900) | Y | MPa(kpsi) | RT | ASTM D638 |
| Tensile Strength | 141(20.4) | Y | MPa(kpsi) | RT | ASTM D638 |
| Flexural Strength | 276(40) | MPa(kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m(mils/inch) | after etch +E2/150°C | IPC-TM-650 2.4.39A |
| Coeffifi cient of Thermal Expansion | 11 | x | ppm/°C | -55 to 288°C | IPC-TM-650 2.1.41 |
| 14 | y | ||||
| 46 | z | ||||
| Tg | >280 | °C TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | °C TGA | ASTM D3850 | ||
| Thermal Conductivity | 0.64 | W/m/°K | 80°C | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48 hrs immersion 0.060” sample Temperature 50°C | ASTM D570 | |
| Density | 1.79 | gm/cm3 | 23°C | ASTM D792 | |
| Copper Peel Strength | 1.05(6.0) | N/mm(pli) | after solder float 1 oz. TC Foil | IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-Free Process Compatible | Yes | ||||
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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