Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite |
| Layer count | Double Layer, Multilayer, Hybrid PCB |
| PCB thickness | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size | ≤400mm X 500mm |
| Solder mask | Green, Black, Blue, Yellow, Red etc. |
| Copper weight | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Surface finish | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
| Brand Name | Bicheng |
| Model Number | BIC-138.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
View Detail Information
Explore similar products
TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27
Rogers TMM6 Microwave Printed Circuit Board 20mil 50mil 75mil DK6.0 RF PCB With
TMM6 Microwave Printed Circuit Board 50mil 1.27mm Rogers High Frequency PCB DK 6
Rogers TMM13i High Frequency Printed Circuit Board 15mil 20mil 25mil 60mil High
Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite | Layer count | Double Layer, Multilayer, Hybrid PCB |
| PCB thickness | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) | PCB size | ≤400mm X 500mm |
| Solder mask | Green, Black, Blue, Yellow, Red etc. | Copper weight | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Surface finish | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. | Brand Name | Bicheng |
| Model Number | BIC-138.V1.0 | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | 10mil Double Sided PCB ，Rogers TC350 Double Sided PCB ，Microwave Combiners Double Sided PCB | ||
Double Sided PCB Built On 10mil Rogers TC350 With Immersion Gold for Microwave Combiners.
Rogers' TC350 is a woven fiberglass reinforced, ceramic filled, PTFE based composite for use as making printed circuit board.TC350 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies.
Features & Benefits:
1. The increased thermal conductivity of TC350 provides higher power handling, reduces hot-spots and improves device reliability. This results in reduced junction temperatures and extends the life of active components, which is critical for improving power amplifier reliability, extending MTBF and reducing warranty costs.
2. TC350 has excellent Dielectric Constant Stability across a wide temperature range. This helps Power Amplifier and Antenna designers maximize gain and minimize dead bandwidth lost to dielectric constant drift as operating temperature changes.
3. TC350 enjoys a strong bond to copper, utilizing microwave grade, low profile copper. This results in even lower insertion loss due to skin effect losses of copper that are more obvious at higher RF and microwave frequencies.
Our PCB Capabilities (TC350)
| Our PCB Capability (TC350) | |
| PCB Material | Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite |
| Designation | TC350 |
| Dielectric constant | 3.5±0.05 |
| Thermal Conductivity | 0.72 W/m-K |
| Dissipation Factor | Df .002@10 GHz |
| Layer count | Double Layer, Multilayer, Hybrid PCB |
| Copper weight | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size | ≤400mm X 500mm |
| Solder mask | Green, Black, Blue, Yellow, Red etc. |
| Surface finish | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
Typical Applications:
1. Microwave Combiner and Power Dividers
2. Power Amplifiers, Filters and Couplers
3. Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB)
4. Thermally Cycled Antennas sensitive to dielectric drift
Typical Properties of TC350:
| Typical Properties:TC350 | |||
| Property | Units | Value | Test Merthod |
| 1. Electrical Properties | |||
| Dielectric Constant (may vary by thickness) | |||
| @1 MHz | － | 3.50 | IPC TM-650 2.5.5.3 |
| @1.8 GHz | － | 3.50 | RESONANT CAVITY |
| @10 GHz | － | 3.50 | IPC TM-650 2.5.5.5 |
| Dissipation Factor | |||
| @1 MHz | － | 0.0015 | IPC TM-650 2.5.5.3 |
| @1.8 GHz | － | 0.0018 | RESONANT CAVITY |
| @10 GHz | － | 0.0020 | IPC TM-650 2.5.5.5 |
| Temperature Coefficient of Dielectric | － | ||
| TC r @ 10 GHz (-40-150°C) | ppm/ºC | -9 | IPC TM-650 2.5.5.5 |
| Volume Resistivity | |||
| C96/35/90 | MΩ-cm | 7.4x106 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ-cm | 1.4x108 | |
| Surface Resistivity | |||
| C96/35/90 | MΩ | 3.2x107 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ | 4.3x108 | IPC TM-650 2.5.17.1 |
| Electrical Strength | Volts/mil (kV/mm) | 780 (31) | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | kV | 40 | IPC TM-650 2.5.6 |
| Arc Resistance | sec | >240 | IPC TM-650 2.5.1 |
| 2.Thermal Properties | |||
| Decomposition Temperature (Td) | |||
| Initial | °C | 520 | IPC TM-650 2.4.24.6 |
| 5% | °C | 567 | IPC TM-650 2.4.24.6 |
| T260 | min | >60 | IPC TM-650 2.4.24.1 |
| T288 | min | >60 | IPC TM-650 2.4.24.1 |
| T300 | min | >60 | IPC TM-650 2.4.24.1 |
| Thermal Expansion, CTE (x,y) 50-150ºC | ppm/ºC | 7, 7 | IPC TM-650 2.4.41 |
| Thermal Expansion, CTE (z) 50-150ºC | ppm/ºC | 12 | IPC TM-650 2.4.24 |
| % z-axis Expansion (50-260ºC) | % | 1.2 | IPC TM-650 2.4.24 |
| 3. Mechanical Properties | |||
| Peel Strength to Copper (1 oz/35 micron) | |||
| After Thermal Stress | lb/in (N/mm) | 7 (1.2) | IPC TM-650 2.4.8 |
| At Elevated Temperatures (150ºC) | lb/in (N/mm) | 9 (1.6) | IPC TM-650 2.4.8.2 |
| After Process Solutions | lb/in (N/mm) | 7 (1.2) | IPC TM-650 2.4.8 |
| Young’s Modulus | kpsi (MPa) | IPC TM-650 2.4.18.3 | |
| Flexural Strength (Machine/Cross) | kpsi (MPa) | 14/10 (97/69) | IPC TM-650 2.4.4 |
| Tensile Strength (Machine/Cross) | kpsi (MPa) | 11/8 (76/55) | IPC TM-650 2.4.18.3 |
| Compressive Modulus | kpsi (MPa) | ASTM D-3410 | |
| Poisson’s Ratio | － | ASTM D-3039 | |
| 4. Physical Properties | |||
| Water Absorption | % | 0.05 | IPC TM-650 2.6.2.1 |
| Density, ambient 23ºC | g/cm3 | 2.30 | ASTM D792 Method A |
| Thermal Conductivity | W/mK | 0.72 | ASTM D5470 |
| Specific Heat | J/gK | 0.90 | ASTM D5470 |
| Flammability | class | V0 | UL-94 |
| NASA Outgassing, 125ºC, ≤10- 6 torr | |||
| Total Mass Loss | % | 0.02 | NASA SP-R-0022A |
| Collected Volatiles | % | 0.01 | NASA SP-R-0022A |
| Water Vapor Recovered | % | 0.01 | NASA SP-R-0022A |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
Get in touch with us
Leave a Message, we will call you back quickly!