IBE ELectronics Co.,LTD
| Payment Terms | D/A, L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 50000pcs/week |
| Delivery Time | 5-8 working days |
| Packaging Details | ESD bag |
| Min. line width | 0.075mm/0.075mm(3mil/3mil) |
| Surface finishing | ENIG |
| Copper thickness | 1oz |
| Base material | FR4 |
| Min. line spacing | 0.075mm |
| Board thickness | 1.6mm |
| Min. hole size | 0.25mm |
| soldermask color | green |
| silkscreen color | white |
| layer | 1-32L |
| Brand Name | IBE |
| Model Number | Electricity Meter PCBA |
| Certification | ISO/TS16949 ISO13485 |
| Place of Origin | China |
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Product Specification
| Payment Terms | D/A, L/C, D/A, D/P, T/T, Western Union, MoneyGram | Supply Ability | 50000pcs/week |
| Delivery Time | 5-8 working days | Packaging Details | ESD bag |
| Min. line width | 0.075mm/0.075mm(3mil/3mil) | Surface finishing | ENIG |
| Copper thickness | 1oz | Base material | FR4 |
| Min. line spacing | 0.075mm | Board thickness | 1.6mm |
| Min. hole size | 0.25mm | soldermask color | green |
| silkscreen color | white | layer | 1-32L |
| Brand Name | IBE | Model Number | Electricity Meter PCBA |
| Certification | ISO/TS16949 ISO13485 | Place of Origin | China |
| High Light | High Tg HDI Multilayer PCBs ，hdi pcb design HASL Immersion Gold ，OEM High Tg hdi pcb design | ||
PCBA Capability
| PCB Manufacturing Capability | |
| PCB Layers: | 1Layers to 18 layer (Max) |
| Board thickness: | 0.13~6.0mm |
| Min line width/space: | 3mil |
| Min mechanical hole size: | 4mil |
| Copper thickness: | 9um~210um(0.25oz~6oz) |
| Max aspect ratio: | 1:10 |
| Max board size: | 400*700mm |
| Surface Finish: | HASL, immersion gold, immersion silver,immersion tin, flash gold, gold finger,peelable mask |
| Material: | FR4,High Tg, Rogers, CEM-1, CEM-3, Aluminum BT, PTFE. |
| PCB Assembly Capability | |
| Stencil size range: | 1560*450mm |
| Min SMT package: | 0402/1005(1.0x0.5mm) |
| Min IC pitch: | 0.3mm |
| Max PCB Size: | 1200*400mm |
| Min PCB thickness: | 0.35mm |
| Min Chip Size: | 01005 |
| Max BGA Size: | 74*74mm |
| BGA Ball Pitch: | 1.00~3.00mm |
| BGA Ball Diameter: | 0.4~1.0mm |
| QFP Lead Pitch: | 0.38~2.54mm |
| Testing : | ICT,AOI,X-RAY,Funtional test etc. |
| Order Conditions | Standard Delivery Date | The fastest Delivery Date |
| Prototype ( <20pcs) | 2days | 8hours |
| Small Volume (20-100pcs) | 6days | 12hours |
| Medium Volume (100-1000) | 3days | 24hours |
| Mass Production (>1000) | Depends on BOM | Depends on BOM |
FAQ:
For turnkey projects, we’ll need the following:
Gerber file
Bill of materials (BOM)
Component placement list (CPL)
All relevant CAD and .stp file
2. Do you offer testing and inspection services?
Yes, IBE offers a comprehensive list of testing and inspection services for both SMT and through-hole assemblies.
Visual inspection/scanning microscopes
AOI inspection
In-circuit test
Functional testing include automated test equipment and system
Burn-in tests
Low/High Temp Chamber Testing
X-ray inspection and repair
Salt fog tester
Drop Test
packing vibration
Conformal coating and potting
IBE has obtained the following IPC electronics industry standards for PCB assembly
IPC-A-600G for PCB production
IPC-620 for practices and requirements for cables, wire, and harness assembly manufacturing
IPC-A-610E PCBA Acceptability of Electronic Assemblies
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
2004
Total Annual:
85000000-90000000
Employee Number:
500~1000
Ecer Certification：
Active Member
IBE Electronics Co.,ltd has been serving the contract manufacturing (ODM,OEM/EMS), industry for 25 years in China. The service includes Electronic Device Design , PCB Fabrication, components sourcing, PCB Assembly,conformal coating, sub-assembly and programming&testing, ... IBE Electronics Co.,ltd has been serving the contract manufacturing (ODM,OEM/EMS), industry for 25 years in China. The service includes Electronic Device Design , PCB Fabrication, components sourcing, PCB Assembly,conformal coating, sub-assembly and programming&testing, ...
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