Payment Terms | T/T |
Supply Ability | 100kpcs/Month |
Delivery Time | 25 days |
Packaging Details | vacuum package in bubble wrap |
Layer Count | 10 Layer |
Board Thickness | 1.6MM |
PCB Kind | HDI PCB |
Min Hole | 0.1MM |
Impedance Control | 50 Ohm |
Surface Treatment | Immersion Gold 3U' |
Size | 154mm*143mm/1pcs |
BGA Size | 16 MIL |
Brand Name | WITGAIN PCB |
Model Number | HDIPCB0015 |
Certification | UL |
Place of Origin | China |
View Detail Information
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Product Specification
Payment Terms | T/T | Supply Ability | 100kpcs/Month |
Delivery Time | 25 days | Packaging Details | vacuum package in bubble wrap |
Layer Count | 10 Layer | Board Thickness | 1.6MM |
PCB Kind | HDI PCB | Min Hole | 0.1MM |
Impedance Control | 50 Ohm | Surface Treatment | Immersion Gold 3U' |
Size | 154mm*143mm/1pcs | BGA Size | 16 MIL |
Brand Name | WITGAIN PCB | Model Number | HDIPCB0015 |
Certification | UL | Place of Origin | China |
High Light | 1.6 MM HDI PCB ,FR4 Substrate HDI PCB ,10 Layer Matte Green PCB |
HDI PCB 10 Layer 1.6 MM Thickness FR4 Substrate Green Solder Mask
PCB Specifications:
1 Part NO: HDIPCB0014
2 Layer Count: 10 Layer HDI PCB
3 Finished Board Thickness: 1.6MM
4 2+N+2 Drilling: L1-L2 0.1MM, L2-L3 0.1MM, L2-L9 0.2MM,L8-L9 0.1MM, L9-L10 0.1MM, L1-L100.2MM
5 Min Lind Space&Width:5/5mil
6 Copper Thickness: 1/H/H/H/H/H/H/H/H/1
7 Application Area: Automobile
8 PCB Size: 154mm*143mm/1pcs
9 PCB Drawing File Size: Gerber File
X-OUT per panel:
1 X-OUT panel must be packed separately and marked clearly
2 A black X must be permanently marked on both sides of pcb
3 X-OUT per panel not be over 25%
4 X-OUT per lot not be over 5%
S1000-2 Data Sheet:
S1000-2 | |||||
Items | Method | Condition | Unit | Typical Value | |
Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 180 | |
IPC-TM-650 2.4.24.4 | DMA | ℃ | 185 | ||
Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 345 | |
CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 45 | |
After Tg | ppm/℃ | 220 | |||
50-260℃ | % | 2.8 | |||
T260 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | |
T288 | IPC-TM-650 2.4.24.1 | TMA | min | 20 | |
T300 | IPC-TM-650 2.4.24.1 | TMA | min | 5 | |
Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- | 100S No Delamination | |
Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 2.2 x 108 | |
E-24/125 | MΩ.cm | 4.5 x 106 | |||
Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 7.9 x 107 | |
E-24/125 | MΩ | 1.7 x 106 | |||
Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 100 | |
Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 63 | |
Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 4.8 | |
IEC 61189-2-721 | 10GHz | -- | — | ||
Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 0.013 | |
IEC 61189-2-721 | 10GHz | -- | — | ||
Peel Strength (1Oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
After thermal Stress 288℃,10s | N/mm | 1.38 | |||
125℃ | N/mm | 1.07 | |||
Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 562 |
CW | IPC-TM-650 2.4.4 | A | MPa | 518 | |
Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.1 | |
CTI | IEC60112 | A | Rating | PLC 3 | |
Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
E-24/125 | Rating | V-0 |
Company Details
Business Type:
Manufacturer
Year Established:
2007
Total Annual:
25,000,000-30,000,000
Employee Number:
200~300
Ecer Certification:
Active Member
Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer... Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer...
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