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China factory - Witgain Technology Limited

Witgain Technology Limited

  • China,Shenzhen
  • Active Member

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China 1.2MM HDI Prototype Printed Circuit Board Assembly 10 Layer Immersion Gold 2U'
China 1.2MM HDI Prototype Printed Circuit Board Assembly 10 Layer Immersion Gold 2U'

  1. China 1.2MM HDI Prototype Printed Circuit Board Assembly 10 Layer Immersion Gold 2U'
  2. China 1.2MM HDI Prototype Printed Circuit Board Assembly 10 Layer Immersion Gold 2U'
  3. China 1.2MM HDI Prototype Printed Circuit Board Assembly 10 Layer Immersion Gold 2U'
  4. China 1.2MM HDI Prototype Printed Circuit Board Assembly 10 Layer Immersion Gold 2U'
  5. China 1.2MM HDI Prototype Printed Circuit Board Assembly 10 Layer Immersion Gold 2U'
  6. China 1.2MM HDI Prototype Printed Circuit Board Assembly 10 Layer Immersion Gold 2U'

1.2MM HDI Prototype Printed Circuit Board Assembly 10 Layer Immersion Gold 2U'

  1. MOQ: 1pcs/lot
  2. Price: Negotiable
  3. Get Latest Price
Payment Terms T/T
Supply Ability 100kpcs/Month
Delivery Time 25 days
Packaging Details vacuum package in bubble wrap
Solder Mask Green Solder Mask
Layer Count 10 Layer
Board Thickness 1.2MM
Min Hole 0.1MM
Copper Thickness H/H/H/H/H/H/H/H/H/H
Surface Treatment Immersion Gold 2U'
Size 800mm*60mm
BGA Size 8 MIL
Brand Name WITGAIN PCB
Model Number HDIPCB0026
Certification UL
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 100kpcs/Month
Delivery Time 25 days Packaging Details vacuum package in bubble wrap
Solder Mask Green Solder Mask Layer Count 10 Layer
Board Thickness 1.2MM Min Hole 0.1MM
Copper Thickness H/H/H/H/H/H/H/H/H/H Surface Treatment Immersion Gold 2U'
Size 800mm*60mm BGA Size 8 MIL
Brand Name WITGAIN PCB Model Number HDIPCB0026
Certification UL Place of Origin China
High Light HDI Printed Circuit Board Assembly1.2MM Printed Circuit Board AssemblyImmersion Gold prototype circuit board

HDI PCB 10 Layer 1.2MM Thickness Immersion Gold 2U' FR4 Substrate

 

PCB Specifications:  

 

1 Part NO: HDIPCB0026

2 Layer Count: 10 Layer HDI PCB

3 Finished Board Thickness: 1.2MM

4 Hole Structure: L1-L2 0.1MM, L2-L3 0.1MM, L3-L4 0.1MM, L4-L5 0.1MM, L5-L6 0.1MM, L6-L7 0.1MM,

                        L7-L8 0.1MM, L8-L9 0.1MM, L1-L10 0.15MM

5 Min Lind Space&Width: 2.5/2.5mil

6 Copper Thickness: H/H/H/H/H/H/H/H/H/H

7 Application Area: Consumer Porducts

 

 

 

Our production applications:

 

1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.

2 Industrial control:main boards in machines, industrial robots, servo motors etc.

3 Automotive: BMS main boards, automotive radar etc.

4 Power supplies: UPS, industrial power supply, frequency power supply.

5 Medical: medical equipment, medical equipment power supply.

6 Communication products: 5G base station, routers, satellites, antennas.

 

 

FAQ: 

Q1: What is the Thermal Resistance of a PCB?

A1: PCB makes the dispersion of heat easier. This is basically the inverse of thermal conductivity. The thermal resistance of a PCB can be calculated by evaluating all the layers of the board and the heat parameters of the material.

To find the total thermal resistance for your board, you must include all layers of the board and the associated heat parameters for the type of material through which heat will flow.

 

[Formula]

R_theta = absolute thermal resistance (K/W) across the thickness of the sample

Delta x = thickness (m) of the sample (measured on a path parallel to the heat flow)

k = thermal conductivity (W/(K·m)) of the sample

A = cross-sectional area (m2) perpendicular to the path of heat flow

 

In addition to the thermal resistance of the board. The Thermal resistance of Vias must also be calculated. This usually depends on the copper trance, the laminate and the substrate and their respective thermal resistivities.

 

How can you reduce the Thermal Resistance of a PCB?

 


Thermal resistance can be reduced by increasing the thickness of the copper traces.
Another method to decrease the thermal resistance is to place copper pads below the hot components. The high thermal conductivity of copper provides a low resistance path for the dispersion of heat. These pads can be connected to an internal ground plane through vias, which have good thermal conductivity and thus help move heat away from the component.
Using Heat Sinks can help lower the thermal resistivity of the board.

 

 

 

 

 

 

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2007

  • Total Annual:

    25,000,000-30,000,000

  • Employee Number:

    200~300

  • Ecer Certification:

    Active Member

Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer... Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer...

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Get in touch with us

  • Reach Us
  • Witgain Technology Limited
  • Room 1520, Block 11, International E-Commerce Logistics Center, PingAn Road, PingHu Street, LongGang District, ShenZhen City, China 518111
  • https://www.printedcircuit-boards.com/

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