Payment Terms | T/T |
Supply Ability | 100k pcs/month |
Delivery Time | 20 days |
Packaging Details | Vacuum bubble bag packaging |
Layer Count | 6 Layer |
Material: | FR4 TG>170 |
Board Thickness | 1.2 MM |
Solder mask colour: | Red |
PTH Wall Copper | 25 UM |
Copper Thickness | 2/2/2/2/2/2 OZ |
Brand Name | WITGAIN PCB |
Model Number | HeavyCopperPCB0004 |
Certification | UL |
Place of Origin | China |
View Detail Information
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Product Specification
Payment Terms | T/T | Supply Ability | 100k pcs/month |
Delivery Time | 20 days | Packaging Details | Vacuum bubble bag packaging |
Layer Count | 6 Layer | Material: | FR4 TG>170 |
Board Thickness | 1.2 MM | Solder mask colour: | Red |
PTH Wall Copper | 25 UM | Copper Thickness | 2/2/2/2/2/2 OZ |
Brand Name | WITGAIN PCB | Model Number | HeavyCopperPCB0004 |
Certification | UL | Place of Origin | China |
High Light | 2 OZ Power Supply PCB ,6 Layer Power Supply PCB ,FR4 TG Heavy Copper PCB |
Power Supply PCB 6 Layer Heavy Copper 2 OZ On Each Layer
PCB Specifications:
Code: IE097_VC
Comcode: 851000056
CROSS SECTION DETAIL (Top to Bottom)
Layer Est. Start Material Finish Thickness Units
(Nom)
====================================================
01 COPPER(1/2_OZ)OUTER 3.74 mil
BSTAGE/DIELECTRIC 5.00 mil
COPPER(1_OZ)INNER 1.08 mil
FR4_017_CORE 17.00 mil
COPPER(1_OZ)INNER 1.08 mil
BSTAGE/DIELECTRIC 5.00 mil
COPPER(1_OZ)INNER 1.08 mil
FR4_017_CORE 17.00 mil
COPPER(1_OZ)INNER 1.08 mil
BSTAGE/DIELECTRIC 5.00 mil
06 COPPER(1/2_OZ)OUTER 3.74 mil
====================================================
Total Board Thickness 60.8
History Detail
Jul 31 16:50:07 2013
Replaces previous comcode 851000056/AM1
SUMMARY DETAILS
====================================================
Product Name: IE097_CB
ProjectName: IE097_CB
Comcode/Artmaster/Issue: 850031128/am2 Issue 1
Panel Specification: nopanel
Circuit Dimension: X 7005.00 Y 3940.00 Units mils
Number of Layers: 6
Number of Through Holes per circuit: 241
1 All dimensions are in MM.
2 Fabricate per IPC-6012A Class2.
3 Materials:
3.1 Dielectric: FR4 Per IPC or equivalent
3.2 Min Tg: 170DEG
3.3 Copper: As per stack up
3.4 UL Rating: 94V0 Minimum
4 Surface finish: ENIG
5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed.
6 Editing of existing copper layers shall require customer approval.
7 Silkscreen legend to be applied per layer stackup using white non-conductitive epoxy ink.
8 100% continuity testing using database netlist shall be performed.Vendor to identify test passed in secondary side.
9 Vendor to mark date code and logo in legend secondary side.
10 Bow and twist shall not exceed 1.0% of longest side.
11 Vendor to provide panel drawing for customer approval before production
Company Details
Business Type:
Manufacturer
Year Established:
2007
Total Annual:
25,000,000-30,000,000
Employee Number:
200~300
Ecer Certification:
Active Member
Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer... Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer...
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