Payment Terms | T/T |
Supply Ability | 100k pcs/month |
Delivery Time | 20 days |
Packaging Details | Vacuum bubble bag packaging |
No of layers: | 6 Layer |
Material: | FR4 TG>150 |
Place of Origin: | ShenZhen |
Solder mask colour: | Black |
Surface technics: | ENIG 1U' |
Min Lind Space&Width: | 4/4 mil |
Brand Name | WITGAIN PCB |
Model Number | PCB000389 |
Certification | UL |
Place of Origin | China |
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Product Specification
Payment Terms | T/T | Supply Ability | 100k pcs/month |
Delivery Time | 20 days | Packaging Details | Vacuum bubble bag packaging |
No of layers: | 6 Layer | Material: | FR4 TG>150 |
Place of Origin: | ShenZhen | Solder mask colour: | Black |
Surface technics: | ENIG 1U' | Min Lind Space&Width: | 4/4 mil |
Brand Name | WITGAIN PCB | Model Number | PCB000389 |
Certification | UL | Place of Origin | China |
High Light | Conference Device 6 Layer PCB ,Black Solder Mask 6 Layer PCB ,White Silkscreen PCB |
6 Layer PCB Black Solder Mask White Silkscreen Used In Video Conference Devices
Printed Circuit Board Features:
1 6 Layer printed circuit board used in video conference devices.
2 FR4 substrate material, tg 150 degree.
3 Black solder mask and white silkscreen.
4 ENIG, gold thickness 1U'
5 Finished pcb thickness 1.0mm.
6 35 um copper thcikness on each layer.
7 PCB file or gerber file should be offered by customer.
8 Customized printed circuit board.
Packing Specifications:
1 One vacuum pcb package should not be over 25 panels based on panel size.
2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.
3 The pcb package must be suitable to ensure effective vacuum sealing.
4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.
5 Humidity indicator card target less than 10%.
S1150G Data Sheet:
S1150G | |||||
Items | Method | Condition | Unit | Typical Value | |
Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 155 | |
Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 380 | |
CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 36 | |
After Tg | ppm/℃ | 220 | |||
50-260℃ | % | 2.8 | |||
T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
T288 | IPC-TM-650 2.4.24.1 | TMA | min | 30 | |
Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- | pass | |
Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 6.4 x 107 | |
E-24/125 | MΩ.cm | 5.3 x 106 | |||
Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 4.8 x 107 | |
E-24/125 | MΩ | 2.8 x 106 | |||
Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 140 | |
Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 45+kV NB | |
Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 4.8 | |
IEC 61189-2-721 | 10GHz | -- | — | ||
Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 0.01 | |
IEC 61189-2-721 | 10GHz | -- | — | ||
Peel Strength (1Oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
After thermal Stress 288℃,10s | N/mm | 1.4 | |||
125℃ | N/mm | 1.3 | |||
Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 600 |
CW | IPC-TM-650 2.4.4 | A | MPa | 450 | |
Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.1 | |
CTI | IEC60112 | A | Rating | PLC 0 | |
Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
E-24/125 | Rating | V-0 |
Company Details
Business Type:
Manufacturer
Year Established:
2007
Total Annual:
25,000,000-30,000,000
Employee Number:
200~300
Ecer Certification:
Active Member
Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer... Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer...
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