Payment Terms | T/T |
Supply Ability | 100k pcs/month |
Delivery Time | 20 days |
Packaging Details | Vacuum bubble bag packaging |
Place of Origin: | Guangdong China |
Material: | FR4 TG>170 |
No of layers: | 6 Layer |
Solder mask colour: | Green |
Min BAG Pad | 8.5 Mil |
Min Lind Space&Width: | 3/3mil |
Brand Name | WITGAIN PCB |
Model Number | Half hole PCB0005 |
Certification | UL |
Place of Origin | China |
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Product Specification
Payment Terms | T/T | Supply Ability | 100k pcs/month |
Delivery Time | 20 days | Packaging Details | Vacuum bubble bag packaging |
Place of Origin: | Guangdong China | Material: | FR4 TG>170 |
No of layers: | 6 Layer | Solder mask colour: | Green |
Min BAG Pad | 8.5 Mil | Min Lind Space&Width: | 3/3mil |
Brand Name | WITGAIN PCB | Model Number | Half hole PCB0005 |
Certification | UL | Place of Origin | China |
High Light | 1.6 MM PCB Electronic Board ,FR4 Substrate pcb electronic board ,6 Layer PCB GPS Module |
Half Hole PCB FR4 Substrate 6 Layer PCB GPS Modole Used 1.6 MM Thickness
Requirements:
1 All dimensions are in MM.
2 Fabricate per IPC-6012A Class2.
3 Materials:
3.1 Dielectric: FR4 Per IPC or equivalent
3.2 Min Tg: 170DEG
3.3 Copper: As per stack up
3.4 UL Rating: 94V0 Minimum
4 Surface finish: ENIG
5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed.
6 Editing of existing copper layers shall require customer approval.
7 Silkscreen legend to be applied per layer stackup using white non-conductitive epoxy ink.
Layer Stackup:
S1000-2 | |||||
Items | Method | Condition | Unit | Typical Value | |
Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 180 | |
IPC-TM-650 2.4.24.4 | DMA | ℃ | 185 | ||
Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 345 | |
CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 45 | |
After Tg | ppm/℃ | 220 | |||
50-260℃ | % | 2.8 | |||
T260 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | |
T288 | IPC-TM-650 2.4.24.1 | TMA | min | 20 | |
T300 | IPC-TM-650 2.4.24.1 | TMA | min | 5 | |
Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- | 100S No Delamination | |
Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 2.2 x 108 | |
E-24/125 | MΩ.cm | 4.5 x 106 | |||
Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 7.9 x 107 | |
E-24/125 | MΩ | 1.7 x 106 | |||
Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 100 | |
Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 63 | |
Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 4.8 | |
IEC 61189-2-721 | 10GHz | -- | — | ||
Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 0.013 | |
IEC 61189-2-721 | 10GHz | -- | — | ||
Peel Strength (1Oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
After thermal Stress 288℃,10s | N/mm | 1.38 | |||
125℃ | N/mm | 1.07 | |||
Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 562 |
CW | IPC-TM-650 2.4.4 | A | MPa | 518 | |
Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.1 | |
CTI | IEC60112 | A | Rating | PLC 3 | |
Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
E-24/125 | Rating | V-0 |
Company Details
Business Type:
Manufacturer
Year Established:
2007
Total Annual:
25,000,000-30,000,000
Employee Number:
200~300
Ecer Certification:
Active Member
Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer... Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer...
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