Payment Terms | T/T |
Supply Ability | 100k pcs/month |
Delivery Time | 20 days |
Packaging Details | Vacuum bubble bag packaging |
PCB Kind | 4 Layer PCB |
Material: | FR4 TG150 |
Material Brand | S1150G |
PCB Thickness: | 1.0 MM |
Solder Mask | Green Solder Mask |
Min Lind Space&Width: | 3/3.9 mil |
Brand Name | WITGAIN PCB |
Model Number | Half hole PCB0019 |
Certification | UL |
Place of Origin | China |
View Detail Information
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Product Specification
Payment Terms | T/T | Supply Ability | 100k pcs/month |
Delivery Time | 20 days | Packaging Details | Vacuum bubble bag packaging |
PCB Kind | 4 Layer PCB | Material: | FR4 TG150 |
Material Brand | S1150G | PCB Thickness: | 1.0 MM |
Solder Mask | Green Solder Mask | Min Lind Space&Width: | 3/3.9 mil |
Brand Name | WITGAIN PCB | Model Number | Half hole PCB0019 |
Certification | UL | Place of Origin | China |
High Light | 4 Layer Half Hole PCB ,1.0 MM Half Hole PCB ,TG150 PCB |
4 Layer Half Hole PCB TG150 Material 1.0 MM Thickness
Board Info:
1 Part NO: Half hole PCB0019
2 Layer Count: 4 Layer PCB
3 Finished Board Thickness: 1.0 MM tolerance is +/-0.1MM
4 Solder Mask: Green Solder Mask
5 Min Lind Space&Width: 4/4 mil
6 Application Area: Blue-tooth Module
7 Drillings: L1-L2 0.1MM, L2-L3 0.15MM, L3-L4 0.1MM, L1-L4 0.2MM Mechanical Drilling
8 PCB Size: 105.95mm*83mm/30pcs
9 Material: S1150G
Packing Specifications:
1 One vacuum pcb package should not be over 25 panels based on panel size.
2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.
3 The pcb package must be suitable to ensure effective vacuum sealing.
4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.
5 Humidity indicator card target less than 10%.
X-OUT per panel:
1 X-OUT panel must be packed separately and marked clearly
2 A black X must be permanently marked on both sides of pcb
3 X-OUT per panel not be over 25%
4 X-OUT per lot not be over 5%
Requirement:
1 All dimensions are in MM.
2 Fabricate per IPC-6012A Class2.
3 Materials:
3.1 Dielectric: FR4 Per IPC or equivalent
3.2 Min Tg: 170DEG
3.3 Copper: As per stack up
3.4 UL Rating: 94V0 Minimum
4 Surface finish: ENIG
5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed.
6 Editing of existing copper layers shall require customer approval.
7 Silkscreen legend to be applied per layer stackup using white non-conductitive epoxy ink.
8 100% continuity testing using database netlist shall be performed.Vendor to identify test passed in secondary side.
9 Vendor to mark date code and logo in legend secondary side.
10 Bow and twist shall not exceed 1.0% of longest side.
11 Vendor to provide panel drawing for customer approval before production
Company Details
Business Type:
Manufacturer
Year Established:
2007
Total Annual:
25,000,000-30,000,000
Employee Number:
200~300
Ecer Certification:
Active Member
Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer... Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer...
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