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Huaswin Electronics Co.,Limited

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China FR4 Material Through Hole Assembly Low Volume Mixed Technology Thickness1.6mm
China FR4 Material Through Hole Assembly Low Volume Mixed Technology Thickness1.6mm

  1. China FR4 Material Through Hole Assembly Low Volume Mixed Technology Thickness1.6mm

FR4 Material Through Hole Assembly Low Volume Mixed Technology Thickness1.6mm

  1. MOQ: 1 sets
  2. Price: Negotiation
  3. Get Latest Price
Payment Terms T/T, Western Union, L/C
Supply Ability 10,000pcs per month
Delivery Time 15-20 working days
Packaging Details Anti-static bag + Anti-static bubble wrap + Good quality carton box
Material FR4
Surface Finishing Lead Free HASL
Finished Thickness 1.6mm
Sold Mask Green
Silkscreen White
Brand Name HUASWIN
Model Number HSPCBA188
Certification Rohs,UL
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T, Western Union, L/C Supply Ability 10,000pcs per month
Delivery Time 15-20 working days Packaging Details Anti-static bag + Anti-static bubble wrap + Good quality carton box
Material FR4 Surface Finishing Lead Free HASL
Finished Thickness 1.6mm Sold Mask Green
Silkscreen White Brand Name HUASWIN
Model Number HSPCBA188 Certification Rohs,UL
Place of Origin China
High Light through hole assemblypcb assembler

Through Hole PCB Assembly FR4 Material Completed Quality Processes Low-volume/Mixed-technology Thickness1.6mm Industrial

 

Quality Processes:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949



Design file format:

1. Gerber RS-274X, 274D, Eagle and AutoCAD's DXF, DWG
2. BOM (bill of materials)
3. Pick and place file (XYRS)

Advantages:

1. Turnkey manufacturing or quick-turn prototypes
2. Board-level assembly or complete system integration
3. Low-volume or mixed-technology assembly for PCBA
4. Even consignment production
5. Supoorted capabilities

 

Huaswin specialized in PCB manufacturing and and PCB Assembly

PCBA capabilities:

  1. Fast prototyping
  2. High mix, low and medium volume build
  3. SMT MinChip:0201
  4. BGA: 1.0 to 3.0 mm pitch
  5. Through-hole assembly
  6. Special processes (such as conformal coating and potting)
  7. ROHS capability
  8. IPC-A-610E and IPC/EIA-STD workmanship operation

PCB Assembly services:

SMT Assembly

Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection

 

Detailed Specification of PCB Manufacturing

 

1 layer 1-30 layer
2 Material CEM-1, CEM-3 FR-4, FR-4 High TG,
Polyimide,
Aluminum-based
material.
3 Board thickness 0.2mm-6mm
4 Max.finished board size 800*508mm
5 Min.drilled hole size 0.25mm
6 min.line width 0.075mm(3mil)
7 min.line spacing 0.075mm(3mil)
8 Surface finish HAL, HAL Lead free,Immersion Gold/
Silver/Tin,
Hard Gold, OSP
9 Copper thickness 0.5-4.0oz
10 Solder mask color green/black/white/red/blue/yellow
11 Inner packing Vacuum packing,Plastic bag
12 Outer packing standard carton packing
13 Hole tolerance PTH:±0.076,NTPH:±0.05
14 Certificate UL,ISO9001,ISO14001,ROHS,TS16949
15 Profiling punching Routing,V-CUT,Beveling



 

 

 

 

 

Through-hole Assembly 
Wave Soldering 
Hand Assembly and Soldering 
Material Sourcing 
IC pre-programming / Burning on-line
Function testing as requested 
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc) 
Packing design
 
 
Conformal coating

Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is 
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to 
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
 When coated, it is clearly visible as a clear and shiny material.
 
 
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts, 
plastics, casings and print & packaging material
 
 
Testing Methods
AOI Testing
Checks for solder paste 
Checks for components down to 0201" 
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of: 
BGAs 
Bare boards 
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by 
component problems. 
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing
 
 

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Exporter

  • Year Established:

    2000

  • Employee Number:

    >500

  • Ecer Certification:

    Active Member

  Huaswin Electronics Co., Limited is a professional PCB and PCBA manufacturer founded in 2000 year.   We supply a comprehensive suit of one-stop manufacturing service: Bare PCB fabrication =>components sourcing =>Automatic SMT / through hole PCB ass...   Huaswin Electronics Co., Limited is a professional PCB and PCBA manufacturer founded in 2000 year.   We supply a comprehensive suit of one-stop manufacturing service: Bare PCB fabrication =>components sourcing =>Automatic SMT / through hole PCB ass...

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  • Huaswin Electronics Co.,Limited
  • http://www.printedboardassembly.com/

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