electronic circuit board assembly Copper 1OZ AOI X-Ray Function Test

Product Specification

SMT PCB Assembly With FR4 Material Thickness 1.6mm Green Solder Mask Copper 1OZ AOI X-Ray Function Test CE Rohs Standard

SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection

Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design

PCB Assembly services:

Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.


Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material

FAQ

Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, PNP and Components Position

Q:Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6 hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: How can I know the process of my PCB production?
A: 5-7days for PCB production and components purchasing, and 14 days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB products work well before shipping. We'll test all of them according to your test procedure.

Huaswin specialized in PCB manufacturing and and PCB Assembly
 
PCBA capabilities: 

1. Fast prototyping
2. High mix, low and medium volume build
3. SMT MinChip:0201
4. BGA: 1.0 to 3.0 mm pitch
5. Through-hole assembly
6. Special processes (such as conformal coating and potting)
7. ROHS capability
8. IPC-A-610E and IPC/EIA-STD workmanship operation

 
Detailed Specification of PCB Manufacturing
 

 
Testing Methods
AOI Testing
Checks for solder paste 
Checks for components down to 0201" 
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of: 
BGAs 
Bare boards 
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by 
component problems. 
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing
 
 
Quality Processes: 
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process 
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949
 
 
Design file format:
 
1. Gerber RS-274X, 274D, Eagle and AutoCAD's DXF, DWG
2. BOM (bill of materials)
3. Pick and place file (XYRS)
 
Advantages:
 
1. Turnkey manufacturing or quick-turn prototypes
2. Board-level assembly or complete system integration
3. Low-volume or mixed-technology assembly for PCBA
4. Even consignment production
5. Supoorted capabilities