Payment Terms | T/T, Western Union, L/C, MoneyGram |
Supply Ability | 10,000,000 Point /Day |
Delivery Time | 1-7days |
Packaging Details | ESD packaging with carton box |
Product name | PCB SMT Assembly |
Material | Fr-4 Normal Tg;HIGH Tg 170 HASL lead free |
Copper thickness | 1/3OZ - 6OZ |
Min. line width/spacing | 0.030mm/0.030mm |
Board thickness | 0.3mm to 3.5mm |
Min. hole size | Laser 0.05mm ; Mechnical 0.15 |
Service | One-stop Service,PCB&PCBA,ODM and OEM |
PCB Assembly method | Mixed; SMT, DIP, THT |
Max. panel size | 700x610mm;customized |
MOQ | 1PC |
Brand Name | HNL-PCBA |
Model Number | PCB Assembly 04 |
Certification | ISO9001,IS16949, ISO14001,ROHS ,UL, IPC-A ,QC080000 |
Place of Origin | CHINA |
View Detail Information
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Product Specification
Payment Terms | T/T, Western Union, L/C, MoneyGram | Supply Ability | 10,000,000 Point /Day |
Delivery Time | 1-7days | Packaging Details | ESD packaging with carton box |
Product name | PCB SMT Assembly | Material | Fr-4 Normal Tg;HIGH Tg 170 HASL lead free |
Copper thickness | 1/3OZ - 6OZ | Min. line width/spacing | 0.030mm/0.030mm |
Board thickness | 0.3mm to 3.5mm | Min. hole size | Laser 0.05mm ; Mechnical 0.15 |
Service | One-stop Service,PCB&PCBA,ODM and OEM | PCB Assembly method | Mixed; SMT, DIP, THT |
Max. panel size | 700x610mm;customized | MOQ | 1PC |
Brand Name | HNL-PCBA | Model Number | PCB Assembly 04 |
Certification | ISO9001,IS16949, ISO14001,ROHS ,UL, IPC-A ,QC080000 | Place of Origin | CHINA |
High Light | PCB SMT Assembly 6OZ ,DIP PCB SMT Assembly ,SMT quickturn PCB assembly |
SMT is Surface Mount Technology. We fabricate PCB Assembly with SMT,DIP, BGA, QFP, as well as THT selective soldering.
SMT assembly as an alternative to the through-hole method of PCB manufacturing, is a method of placing electronic components and circuits onto PCBs. SMT assembly has a wide range of uses. It also has a few limitations your design team should consider.
FACTORY CAPABILITIES | |||
No. | Items | 2019 | 2020 |
1 | HDI Capabilities | HDI ELIC (4+2+4) | HDI ELIC(5+2+5) |
2 | Max layer count | 32L | 36L |
3 | Board Thickness | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm |
4 | Min.Hole Size | Laser 0.075mm | Laser 0.05mm |
Mechnical 0.15mm | Mechnical 0.15mm | ||
5 | Min Line Width/Space | 0.035mm/0.035mm | 0.030mm/0.030mm |
6 | Copper Thickness | 1/3oz-4oz | 1/3oz-6oz |
7 | Size Max Panel size | 700x610mm | 700x610mm |
8 | Registration Accuracy | +/-0.05mm | +/-0.05mm |
9 | Routing Accuracy | +/-0.075mm | +/-0.05mm |
10 | Min.BGA PAD | 0.15mm | 0.125mm |
11 | Max Aspect Ratio | 10:1 | 10:1 |
12 | Bow and Twist | 0.50% | 0.50% |
13 | Impedance Control Tolerance | +/-8% | +/-5% |
14 | Daily Output | 3,000m2 (Max capacity of equipment) | 4,000m2 (Max capacity of equipment) |
15 | Surface Finishing | ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD | |
16 | Raw Material | FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI |
PCBA Capability | |||
Material Type | Item | Min | Max |
PCB | Dimension (length,width,height.mm) | 50*40*0.38 | 600*400*4.2 |
Material | FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC | ||
Surface finish | HASL,OSP,Immersion gold,Flash Gold Finger | ||
Components | Chip&IC | 1005 | 55mm |
BGA Pitch | 0.3mm | - | |
QFP Pitch | 0.3mm | - |
Our SMT capabilities:
SMT Assembly: SMT provides a flexible high technology. These solutions include:
7 high-speed placement machines,
7 automatic printers with fiducial alignment,
2 X-ray machines,
BGA maintenance machines,
ICT test machines
Our DIP function:
A-8 semi-assembly production line with four wave soldering machines
1 U-shaped automatic assembly line for box-type building products with test stations
High temperature / low temperature aging test furnace B-4 for products required for aging test
With time control and temperature control
All products are 100% inspected and tested during the DIP process
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PCB SMT Assembly Process
1.Solder Paste stenciling---2.Surface Mount Technology (Pick and Place)---3.Reflow Soldering---4.Inspection and Quality Control---5.Through-Hole Component Insertion (DIP Process)---6.Final Inspection and Functional Test
1.Service value Independent quotation system to quickly serve the market | 2.PCB manufacturing High-tech PCB and PCB assembly production line |
3.Material purchasing A team of experienced electronic component procurement engineers | 4.SMT post soldering Dust-free workshop, high-end SMT patch processing
|
Product Type | Qty | Normal lead time | Quick-turn lead time |
SMT+DIP | 1-50 | 1WD-2WD | 8H |
SMT+DIP | 51-200 | 2WD-3WD | 1.5WD |
SMT+DIP | 201-2000 | 3WD-4WD | 2WD |
SMT+DIP | ≥2001 | 4WD-5WD | 3WD |
PCBA(2-4Layer) | 1-50 | 2.5WD-3.5WD | 1WD |
PCBA(2-4Layer) | 51-2000 | 5WD-6WD | 2.5WD |
PCBA(2-4Layer) | ≥2001 | ≥7WD | 5WD |
PCBA(6-10Layer) | 1-50 | 3WD-4WD | 2.5WD |
PCBA(6-10Layer) | 51-2000 | 7WD-8WD | 6WD |
PCBA(10-HDILayer) | 1-50 | 7WD-9WD | 5WD |
PCBA(10-HDILayer) | 51-2000 | 9WD-11WD | 7WD |
Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics etc.
Workshop
1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
2006
Total Annual:
600-1000
Employee Number:
200~300
Ecer Certification:
Active Member
ecer({videoId:"pzc2uJV-5ho",idContainer:"#EdhmScD"}) Beijing Haina Lean Technology Co., Ltd is one of the most professional PCB manufacturer in Beijing,China. With more then 10 years of development, Haina Lean Electronics turns into a first class manufacture of HDI PCB ,with production ... ecer({videoId:"pzc2uJV-5ho",idContainer:"#EdhmScD"}) Beijing Haina Lean Technology Co., Ltd is one of the most professional PCB manufacturer in Beijing,China. With more then 10 years of development, Haina Lean Electronics turns into a first class manufacture of HDI PCB ,with production ...
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