Payment Terms | T/T, Western Union, L/C, MoneyGram |
Supply Ability | 10,000,000 Point /Day |
Delivery Time | 1-7days |
Packaging Details | ESD packaging with carton box |
Product name | High Volume PCB Assembly |
Material | Fr4 High Tg |
Copper thickness | 1OZ to 6OZ |
Min. line width/spacing | 0.030mm |
Board thickness | 2mm ,...... 3.5mm |
Min. hole size | Laser 0.05mm ; Mechnical 0.15 |
Surface finishing | HASL Lead Free |
Solder mask color | Blue.green etc |
Service | One-stop Service,PCB&PCBA,ODM and OEM |
Testing service | AOI E-test, Function test, |
Number of layers | 1-46 layers |
PCB Assembly method | Mixed, SMT, DIP, THT |
Brand Name | HNL-PCBA |
Model Number | PCB Assembly 04 |
Certification | ISO9001,IS16949, ISO14001,ROHS ,IPC-A ,QC080000 |
Place of Origin | CHINA |
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Product Specification
Payment Terms | T/T, Western Union, L/C, MoneyGram | Supply Ability | 10,000,000 Point /Day |
Delivery Time | 1-7days | Packaging Details | ESD packaging with carton box |
Product name | High Volume PCB Assembly | Material | Fr4 High Tg |
Copper thickness | 1OZ to 6OZ | Min. line width/spacing | 0.030mm |
Board thickness | 2mm ,...... 3.5mm | Min. hole size | Laser 0.05mm ; Mechnical 0.15 |
Surface finishing | HASL Lead Free | Solder mask color | Blue.green etc |
Service | One-stop Service,PCB&PCBA,ODM and OEM | Testing service | AOI E-test, Function test, |
Number of layers | 1-46 layers | PCB Assembly method | Mixed, SMT, DIP, THT |
Brand Name | HNL-PCBA | Model Number | PCB Assembly 04 |
Certification | ISO9001,IS16949, ISO14001,ROHS ,IPC-A ,QC080000 | Place of Origin | CHINA |
High Light | Quick Turn OEM PCBA ,EMS High Volume PCB Assembly ,OEM High Volume PCB Assembly |
We offer high volume PCBA with SMT as well as THT selective soldering. we can offer bulk volume printed circuit boards to meet your requirements. Although large volumes, each PCB goes through a strict testing process, ensuring that quality is never compromised. For high-volume PCBA order, we offer competitive pricing, as well as flexible shipment plans to you. Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs .
FACTORY CAPABILITIES | |||
No. | Items | 2019 | 2020 |
1 | HDI Capabilities | HDI ELIC (4+2+4) | HDI ELIC(5+2+5) |
2 | Max layer count | 32L | 36L |
3 | Board Thickness | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm |
4 | Min.Hole Size | Laser 0.075mm | Laser 0.05mm |
Mechnical 0.15mm | Mechnical 0.15mm | ||
5 | Min Line Width/Space | 0.035mm/0.035mm | 0.030mm/0.030mm |
6 | Copper Thickness | 1/3oz-4oz | 1/3oz-6oz |
7 | Size Max Panel size | 700x610mm | 700x610mm |
8 | Registration Accuracy | +/-0.05mm | +/-0.05mm |
9 | Routing Accuracy | +/-0.075mm | +/-0.05mm |
10 | Min.BGA PAD | 0.15mm | 0.125mm |
11 | Max Aspect Ratio | 10:1 | 10:1 |
12 | Bow and Twist | 0.50% | 0.50% |
13 | Impedance Control Tolerance | +/-8% | +/-5% |
14 | Daily Output | 3,000m2 (Max capacity of equipment) | 4,000m2 (Max capacity of equipment) |
15 | Surface Finishing | ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD | |
16 | Raw Material | FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI |
PCBA Capability | |||
Material Type | Item | Min | Max |
PCB | Dimension (length,width,height.mm) | 50*40*0.38 | 600*400*4.2 |
Material | FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC | ||
Surface finish | HASL,OSP,Immersion gold,Flash Gold Finger | ||
Components | Chip&IC | 1005 | 55mm |
BGA Pitch | 0.3mm | - | |
QFP Pitch | 0.3mm | - |
Our SMT capabilities:
SMT Assembly: SMT provides a flexible high technology. These solutions include:
7 high-speed placement machines,
7 automatic printers with fiducial alignment,
2 X-ray machines,
BGA maintenance machines,
ICT test machines
Our DIP function:
A-8 semi-assembly production line with four wave soldering machines
1 U-shaped automatic assembly line for box-type building products with test stations
High temperature / low temperature aging test furnace B-4 for products required for aging test
With time control and temperature control
All products are 100% inspected and tested during the DIP process
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Electronic Board Assembly Process
1.Solder Paste stenciling---2.Surface Mount Technology (Pick and Place)---3.Reflow Soldering---4.Inspection and Quality Control---5.Through-Hole Component Insertion (DIP Process)---6.Final Inspection and Functional Test
1.Service value
Independent quotation system to quickly serve the market
2.PCB manufacturing
High-tech PCB and PCB assembly production line
3.Material purchasing
A team of experienced electronic component procurement engineers
4.SMT post soldering
Dust-free workshop, high-end SMT patch processing
Product Type | Qty | Normal lead time | Quick-turn lead time |
SMT+DIP | 1-50 | 1WD-2WD | 8H |
SMT+DIP | 51-200 | 2WD-3WD | 1.5WD |
SMT+DIP | 201-2000 | 3WD-4WD | 2WD |
SMT+DIP | ≥2001 | 4WD-5WD | 3WD |
PCBA(2-4Layer) | 1-50 | 2.5WD-3.5WD | 1WD |
PCBA(2-4Layer) | 51-2000 | 5WD-6WD | 2.5WD |
PCBA(2-4Layer) | ≥2001 | ≥7WD | 5WD |
PCBA(6-10Layer) | 1-50 | 3WD-4WD | 2.5WD |
PCBA(6-10Layer) | 51-2000 | 7WD-8WD | 6WD |
PCBA(10-HDILayer) | 1-50 | 7WD-9WD | 5WD |
PCBA(10-HDILayer) | 51-2000 | 9WD-11WD | 7WD |
Our products are widely used in
1.communication equipment,
2.industrial control,
3.consumer electronics,
4.medical equipment,
5.aerospace,
6.light-emitting diode lighting,
7.automotive electronics etc
Workshop
1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box
Haina lean Electronics Co., Ltd is a one-stop EMS supplier integrating PCB design, PCB manufacturing, Component sourcing and PCB assembly.
Our company was established in May 1, 2006 in Beijing. And expansion was completed in June 2016. The company is specialized in electronic products supporting processing services, mainly to undertake circuit board design, layout production, components procurement, PCB plate making, circuit board welding assembly debugging and other OEM/ODM services.
Our first factory is located in Changping District, Beijing, the main radiation Haidian, Changping, Chaoyang three areas of Beijing. Since our company’s establishment, we have been adhering to creating high quality, high efficiency, low-cost business philosophy based on the circuit board processing industry for customers. Most of the key staff of the company are mature technical talents who have been engaged in the industry for more than 10 years, and have rich experience in the production of SMT and DIP, also has rich experience in production for high density & difficulty to package components such as BGA. We obtain a good reputation in the industry through the continuous efforts from all staff and high quality service . Our second branch plant is located in Langfang city, and mainly cover Fengtai and Daxing Yizhuang area. Our factory covers an area of 6000 square meters.
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
2006
Total Annual:
600-1000
Employee Number:
200~300
Ecer Certification:
Active Member
ecer({videoId:"pzc2uJV-5ho",idContainer:"#EdhmScD"}) Beijing Haina Lean Technology Co., Ltd is one of the most professional PCB manufacturer in Beijing,China. With more then 10 years of development, Haina Lean Electronics turns into a first class manufacture of HDI PCB ,with production ... ecer({videoId:"pzc2uJV-5ho",idContainer:"#EdhmScD"}) Beijing Haina Lean Technology Co., Ltd is one of the most professional PCB manufacturer in Beijing,China. With more then 10 years of development, Haina Lean Electronics turns into a first class manufacture of HDI PCB ,with production ...
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