Payment Terms | T/T |
Delivery Time | fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production |
Packaging Details | vacuum |
PCB Layer | 4 Layer Flexible Pcb Prototype Board |
Material | PI |
Board Layer | 4L |
Finished treatment | ENIG |
Copper thickness | 1/1oz |
Minimum drilling size | 0.1mm |
Brand Name | Huashengxin |
Model Number | ED9A8120 |
Certification | UL , ISO9001 |
Place of Origin | China |
View Detail Information
Explore similar products
ODM Fpc Flexible Printed Circuit ENIG 1oz 4mil 4 Layer Pcb Board
PI FR4 Double Layer Flex PCB Board Immersion Gold 2L Lightweight
2 Sided Flexible Circuit Board Fast Turn Pcb HASL 4mil 0.1mm
Polymer Film Flex PCB Board Double Sided 3mil 1oz ENIG Finished
Product Specification
Payment Terms | T/T | Delivery Time | fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production |
Packaging Details | vacuum | PCB Layer | 4 Layer Flexible Pcb Prototype Board |
Material | PI | Board Layer | 4L |
Finished treatment | ENIG | Copper thickness | 1/1oz |
Minimum drilling size | 0.1mm | Brand Name | Huashengxin |
Model Number | ED9A8120 | Certification | UL , ISO9001 |
Place of Origin | China | ||
High Light | 3mil Flexible Pcb Prototype Board ,3mil Pcb Prototype Board ,3mil pcb prototype board |
PI 4 Layer Flexible Pcb Prototype Board 1oz ENIG Immersion Gold 3mil
Flex PCB Board 4 Layer Flexible Printed Circuit Board Pcba Board Printed Circuit Board Assembly
4 Layer Flexible Printed Circuit Board
Flexible printed circuits are circuit boards that have the ability to bend or twist. From this assertion, it is obvious that they are distinguished by a flexible construction. That is why electronic engineers and designers use them in applications that demand for their qualities. They are also referred to as flex circuits and are mostly used in small electronic applications. Since they are characterized by their ability to bend, flexible printed circuits are made of flexible substrate such as polyimide. Another important quality of flexible printed circuits is that they have superior heat dissipation than printed circuit boards. It is this quality that makes it possible for the electronics that use it to stay in quality condition for a long time.
FPC Technology Capability | |||
Attribute (All dimensions are mils unless otherwise specified) | Mass Production (Yield≥ 80%,Cpk≥1.33) | Small Amount(Yield≥60%, Key Specification Yield≥80% | Sample |
FPC(yes/no) | yes | yes | yes |
Layer count/Structure, Max. | 2 | 4 | 6 |
Size(L×W), Max. | 550mm*250mm | 550mm*250mm | 700mm*250mm |
Nominal thickness (mm) | 0.1~0.5 | 0.1~0.5 | 0.1~0.8 |
Thickness tolerance | ±10%(>0.3mm)/±0.03mm(≤0.3mm) | ±10%(>0.3mm)/±0.03mm(≤0.3mm) | ±10%(>0.3mm)/±0.03mm(≤0.3mm) |
Surface finish type | ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold | ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold | ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold |
Soft ENIG(yes/no) | no | no | no |
Base material type | PI | PI | PILCPTK |
Coverlay thickness (um) | 28/50/60/80 | 28/50/60/80 | 28/50/60/80 |
Adhesive thickness (um) | 25/40/50/65 | 25/40/50/65 | 25/40/50/65 |
Copper thickness, Min./Max. (um) | 12-70 | 12-70 | 12-70 |
Base material thickness, Min./Max. (um) | 25-75 | 25-75 | 25-100 |
Mechanical drilled thru-hole size (DHS), Min. | 0.15 | 0.15 | 0.15 |
Plating aspect ratio, Max. | 3:1 | 3:1 | 5:1 |
Pad size, Min. | With through hole:0.4mm Without through hole:0.2mm | With through hole:0.4mm Without through hole:0.2mm | With through hole:0.3mm Without through hole:0.2mm |
Pad size tolerance | 20% | 20% | 10% |
Pad to pad space, Min. | 4mil | 4mil | 4mil |
Pad to outline tolerance | ±3mil | ±3mil | ±2mil |
Pattern location accurancy | ±3mil | ±3mil | ±2mil |
Pattern location accurancy from top side to bottom | ±3mil | ±3mil | ±2mil |
Laser via hole diameter/pad, Min. | 4/12mil | 4/10mil | 4/10mil |
Outerlayer(Hoz+plating) line width/space, Min. | 3/3mil | 3/3mil | 2/2mil |
Innerlayer(Hoz) line width/space, Min. | 3/3mil | 3/3mil | 2/2mil |
Inner line width tolerance | ±10% | ±10% | ±10% |
Outerlayer registration, Min. (Pad diameter = DHS + X) | DHS + 8 | DHS + 8 | DHS + 6 |
Innerlayer registration, Min. (Pad diameter = DHS + X)(L≤4 layer) | DHS + 10 | DHS + 10 | DHS + 8 |
Laser via hole pitch, Min. | 0.40mm | 0.40mm | 0.35mm |
Mechanical hole pitch, Min. | 0.50mm | 0.50mm | 0.40mm |
Drilled hole position tolerance | ±2mil | ±2mil | ±2mil |
Hole size tolerance | ±2mil | ±2mil | ±2mil |
Location accurancy from tooling hole(PTH&NPTH) to pad | ±3mil | ±3mil | ±2mil |
Location accurancy from tooling hole(PTH&NPTH) to outline | ±3mil | ±3mil | ±2mil |
Outline size tolerance | ±2mil | ±2mil | ±2mil |
LPI registration/dam, Min. | 2mil/4mil | 2mil/4mil | 2mil/3mil |
LPI dam on CVL | 8mil | 8mil | 8mil |
Coverlay open window/dam | Φ0.5mm/0.3mm | Φ0.5mm/0.3mm | Φ0.3mm/0.2mm |
Coverlay registration/Resin flow | 4mil | 4mil | 2mil |
Stifferness material | FR4/PI/Steel | FR4/PI/Steel | FR4/PI/Steel |
Stifferness dam, Min. | 12mil | 12mil | 8mil |
Stifferness registration/Resin flow | 8mil/4mil | 8mil/4mil | 4mil/2mil |
Impedance tolerance | 10% | 10% | 5% |
Thermal reliability(LPI, FCCL, CVL) | 288°/10s/3times | 288°/10s/3times | 288°/10s/3times |
Qualified material and structure UL | PI | PI | PI |
FAQ:
Q1:Could you provide PCB Assembly services and components sourcing?
A: Yes, we could also provide components sourcing and PCB Assembly services as well as box build if request.
Q2:Which countries have you worked with?
A:USA, Canada, Italy, Germany, UK, Spain, France, Russia, Iran, Turkey, Czech Republic,Austria, Australia, Brazil, Japan, India etc.
Q3:Are my PCB files safe when I submit them to you for manufacturing?
A: We respect customer's copyright and will never manufacture PCB for someone else with your files unless we receive written permission from your side, nor we'll share these files with any other 3rd parties. And we could sign NDA with client if necessary.
Q4:If we have no PCB file/Gerber file, only have the PCB sample,can you produce it for me?
A: Yes,we could help you to clone the PCB. Just send the sample PCB to us, we could clone the PCB design and work out it.
Q5:What is your standard lead time for PCB?
A: Sample/prototype(less than 3sqm):
1-2 Layers: 3 to 5working days (fastest 24hours for quick turn services)
4-8 Layers: 7~12 working days (fastest 48hours for quick turn services)
Mass production (less than 200sqm):
1-2 Layers:7 to 12 working days
4-8 Layers:10 to 15 working days
Company Details
Business Type:
Manufacturer
Year Established:
2010
Total Annual:
50000000-65000000
Employee Number:
200~500
Ecer Certification:
Verified Supplier
Founded in 2010, Shenzhen Huashengxin Circuit is a professional manufacturer for printed circuit boards. HSX Circuit provides flexible quick turn production services (12hours to 72 hours), as well as small volume to big volume PCB manufacturing. Its products covers 1~32L FR-4 PCB, IMS PCB, HDI Board... Founded in 2010, Shenzhen Huashengxin Circuit is a professional manufacturer for printed circuit boards. HSX Circuit provides flexible quick turn production services (12hours to 72 hours), as well as small volume to big volume PCB manufacturing. Its products covers 1~32L FR-4 PCB, IMS PCB, HDI Board...
Get in touch with us
Leave a Message, we will call you back quickly!