Huashengxin Circuit Limited
| Payment Terms | T/T |
| Delivery Time | fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production |
| Packaging Details | vacuum |
| PCB Layer | 2 Layer Flexible PCB |
| Material | Polymer Film |
| Board Layer | 2L |
| Finished treatment | ENIG |
| Copper thickness | 1/1oz |
| Minimum drilling size | 0.1mm |
| Brand Name | Huashengxin |
| Model Number | ED9A8108 |
| Certification | UL , ISO9001 |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Delivery Time | fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production |
| Packaging Details | vacuum | PCB Layer | 2 Layer Flexible PCB |
| Material | Polymer Film | Board Layer | 2L |
| Finished treatment | ENIG | Copper thickness | 1/1oz |
| Minimum drilling size | 0.1mm | Brand Name | Huashengxin |
| Model Number | ED9A8108 | Certification | UL , ISO9001 |
| Place of Origin | China | ||
| High Light | ODM OEM Flex PCB Board ，0.1mm Flex PCB Board ，0.1mm 2 Layer Rigid Flex Pcb | ||
Polymer Film Flex PCB Board 0.1mm 2 Layer Rigid Flex Pcb Lightweight
Flex PCB Board 2 Layer Flexible PCB 2L Flex Printed Circuit Board 2L Flexible Printed Circuit Board
2 Layer Flexible PCB
Flexible circuits (also called as flex circuits, flexible printed circuit boards, flex PCB, etc) are consisted of a thin insulating polymer film having conductive circuit patterns affixed thereto and typically supplied with a thin polymer coating to protect the conductor circuits. The technology has been used for interconnecting electronic devices since long long time ago. It is now one of the most important interconnection technologies in use for the manufacture of many advanced electronic products.
In practice there are many different kinds of flexible circuits, including one metal layer, double sided, multilayer and rigid flex circuits. The circuits can be formed by etching metal foil cladding (normally of copper) from polymer bases, plating metal or printing of conductive inks among other processes.
Advantage:
1) Accuracy of designs. Most of the advanced electronic devices in use today use flexible circuit boards because of the high level of precision expected of them.
2) They are lightweight. The circuit boards can be folded easily, thus they can be positioned in compartments.
3) Long-term performance. The superior qualities of flexible circuit boards allow them to have durability and long-term performance. The characteristics of low ductility and mass contained in these boards allow them to overcome the influence of vibrations, therefore giving them the capacity to have improved performance.
4) Heat dissipation. Because of the compact designs of the circuit board, there are shorter thermal paths generated and the dissipation of heat is faster compared to other kind of PCBs.
5) Flexibility. Due to their ability to be flexible, it is easily to bend flexible circuit boards to various levels when installing them, thus make it possible to enhance the functionality levels of various electronics.
| FPC Technology Capability | |||
| Attribute (All dimensions are mils unless otherwise specified) | Mass Production (Yield≥ 80%,Cpk≥1.33) | Small Amount(Yield≥60%, Key Specification Yield≥80% | Sample |
| FPC(yes/no) | yes | yes | yes |
| Layer count/Structure, Max. | 2 | 4 | 6 |
| Size(L×W), Max. | 550mm*250mm | 550mm*250mm | 700mm*250mm |
| Nominal thickness (mm) | 0.1~0.5 | 0.1~0.5 | 0.1~0.8 |
| Thickness tolerance | ±10%(>0.3mm)/±0.03mm(≤0.3mm) | ±10%(>0.3mm)/±0.03mm(≤0.3mm) | ±10%(>0.3mm)/±0.03mm(≤0.3mm) |
| Surface finish type | ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold | ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold | ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold |
| Soft ENIG(yes/no) | no | no | no |
| Base material type | PI | PI | PILCPTK |
| Coverlay thickness (um) | 28/50/60/80 | 28/50/60/80 | 28/50/60/80 |
| Adhesive thickness (um) | 25/40/50/65 | 25/40/50/65 | 25/40/50/65 |
| Copper thickness, Min./Max. (um) | 12-70 | 12-70 | 12-70 |
| Base material thickness, Min./Max. (um) | 25-75 | 25-75 | 25-100 |
| Mechanical drilled thru-hole size (DHS), Min. | 0.15 | 0.15 | 0.15 |
| Plating aspect ratio, Max. | 3:1 | 3:1 | 5:1 |
| Pad size, Min. | With through hole:0.4mm Without through hole:0.2mm | With through hole:0.4mm Without through hole:0.2mm | With through hole:0.3mm Without through hole:0.2mm |
| Pad size tolerance | 20% | 20% | 10% |
| Pad to pad space, Min. | 4mil | 4mil | 4mil |
| Pad to outline tolerance | ±3mil | ±3mil | ±2mil |
| Pattern location accurancy | ±3mil | ±3mil | ±2mil |
| Pattern location accurancy from top side to bottom | ±3mil | ±3mil | ±2mil |
| Laser via hole diameter/pad, Min. | 4/12mil | 4/10mil | 4/10mil |
| Outerlayer(Hoz+plating) line width/space, Min. | 3/3mil | 3/3mil | 2/2mil |
| Innerlayer(Hoz) line width/space, Min. | 3/3mil | 3/3mil | 2/2mil |
| Inner line width tolerance | ±10% | ±10% | ±10% |
| Outerlayer registration, Min. (Pad diameter = DHS + X) | DHS + 8 | DHS + 8 | DHS + 6 |
| Innerlayer registration, Min. (Pad diameter = DHS + X)(L≤4 layer) | DHS + 10 | DHS + 10 | DHS + 8 |
| Laser via hole pitch, Min. | 0.40mm | 0.40mm | 0.35mm |
| Mechanical hole pitch, Min. | 0.50mm | 0.50mm | 0.40mm |
| Drilled hole position tolerance | ±2mil | ±2mil | ±2mil |
| Hole size tolerance | ±2mil | ±2mil | ±2mil |
| Location accurancy from tooling hole(PTH&NPTH) to pad | ±3mil | ±3mil | ±2mil |
| Location accurancy from tooling hole(PTH&NPTH) to outline | ±3mil | ±3mil | ±2mil |
| Outline size tolerance | ±2mil | ±2mil | ±2mil |
| LPI registration/dam, Min. | 2mil/4mil | 2mil/4mil | 2mil/3mil |
| LPI dam on CVL | 8mil | 8mil | 8mil |
| Coverlay open window/dam | Φ0.5mm/0.3mm | Φ0.5mm/0.3mm | Φ0.3mm/0.2mm |
| Coverlay registration/Resin flow | 4mil | 4mil | 2mil |
| Stifferness material | FR4/PI/Steel | FR4/PI/Steel | FR4/PI/Steel |
| Stifferness dam, Min. | 12mil | 12mil | 8mil |
| Stifferness registration/Resin flow | 8mil/4mil | 8mil/4mil | 4mil/2mil |
| Impedance tolerance | 10% | 10% | 5% |
| Thermal reliability(LPI, FCCL, CVL) | 288°/10s/3times | 288°/10s/3times | 288°/10s/3times |
| Qualified material and structure UL | PI | PI | PI |
FAQ:
1. What service can you provide?
Printed Circuit board, Printed Circuit Assembly, Rapid Prototype order
2. How fast is your lead time?
HDI board fastest 3 WDs, 2L and 4L Rigid board fastest 24H
3. How to get quick quotation?
Please provide gerber file and details of the board(including layer, board thickness, copper thickness, surface treatment, solder mask and silkscreen color, special request if any, demand quantity, etc)
Sample list:
| PCB Layer | 4L |
| PCB surface | ENIG |
| PCB material | FR4, TG135 |
| finished Copper thickness | 2/2/2/2oz |
| solder mask color | Double side, red |
| Silkscreen | Double side, black |
| Quantity | 1000pcs, 2 weeks |
4. What payment terms do you accept?
A: Wire Transfer(T/T) or Letter of Credit(L/C) or Paypal(only for small value less than 500usd)
Company Details
Business Type:
Manufacturer
Year Established:
2010
Total Annual:
50000000-65000000
Employee Number:
200~500
Ecer Certification：
Verified Supplier
Founded in 2010, Shenzhen Huashengxin Circuit is a professional manufacturer for printed circuit boards. HSX Circuit provides flexible quick turn production services (12hours to 72 hours), as well as small volume to big volume PCB manufacturing. Its products covers 1~32L FR-4 PCB, IMS PCB, HDI Board... Founded in 2010, Shenzhen Huashengxin Circuit is a professional manufacturer for printed circuit boards. HSX Circuit provides flexible quick turn production services (12hours to 72 hours), as well as small volume to big volume PCB manufacturing. Its products covers 1~32L FR-4 PCB, IMS PCB, HDI Board...
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