Huashengxin Circuit Limited
Products
Manufacturer of a wide range of products which include 4 Layers FR4 HDI high density interconnect pCB For Medical Device,Lead Free Assembly Material Rigid Flex Board with good reliability,4 Layer HDI Rigid Flex PCB Board Immersion...
MOQ: 1pcs
Price: 0.1usd per pcs
| Payment Terms | T/T, Western Union, MoneyGram |
| Supply Ability | 100000pcs per month |
| Delivery Time | 3-7days |
| Packaging Details | Anti-static Bag |
| Board Layer | 4L |
| Material | FR4 TG135 |
| Surface Treatment | ENIG |
| Finished Copper Thickness | 1/1/1/1oz |
| Solder mask | Green |
| Silkscreen | White |
| Brand Name | HSX Circuit |
| Model Number | NA |
| Certification | IATF16949-2016 | ISO9001 2015 | ZPMV2.E509426 | ROHS |
| Place of Origin | Shenzhen China |
MOQ: 1pcs
Price:
| Payment Terms | T/T |
| Delivery Time | 5-8 days |
| Packaging Details | vacuum |
| Brand Name | Huashengxin |
| Model Number | PCB |
| Certification | UL,ISO9001 |
| Place of Origin | China |
MOQ: 1pcs
Price:
| Payment Terms | T/T |
| Delivery Time | fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production |
| Packaging Details | vacuum |
| PCB Layer | 4L Flexible Rigid PCB |
| Material | FR-4+PI |
| Board Layer | 4L |
| Surface finished | Immersion gold |
| Board thickness | 1.6mm |
| Copper thickness | 1/1/1/1oz finished |
| Min. hole size | 0.3mm |
| Min.PCB track/gap: | 4mil/4mil |
| Solder mask | Green color TAIYO |
| Application | Digital products |
| Brand Name | Huashengxin |
| Model Number | 211912 |
| Certification | UL , ISO9001 |
| Place of Origin | China |
MOQ: 1pcs
Price:
| Payment Terms | T/T |
| Delivery Time | 7-12 days |
| Packaging Details | vacuum |
| Brand Name | Huashengxin |
| Model Number | HDI PCB |
| Certification | ISO9001,UL,Reach,IATF16949 |
| Place of Origin | China |
MOQ: 1pcs
Price: Usd0.1 per piece
| Payment Terms | T/T, T/T, MoneyGram |
| Supply Ability | 100000pcs per month |
| Delivery Time | 3-7days |
| Packaging Details | Anti-static Bag |
| Layers | 12L |
| Material | FR4 |
| Outer Finished Copper Thickness | 1oz |
| Inner Finished Copper Thickness | 1oz |
| Surface Treatment | ENIG |
| Application | Medical device |
| Solder Mask | Green |
| Silkscreen | White |
| Brand Name | HSX Circuit |
| Model Number | HSX6656 |
| Certification | IATF16949-2016 | ISO9001 2015 | ZPMV2.E509426 | ROHS |
| Place of Origin | Shenzhen China |
MOQ: 1pcs
Price:
| Payment Terms | T/T |
| Delivery Time | fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production |
| Packaging Details | vacuum |
| PCB Name | 4L 1+N+1 HDI Printed Circuit Board |
| Marterial | FR4 TG170 |
| Surface finished | Immersion gold |
| Board Thickness | 0.8mm |
| Copper thickness | 1/1/1/1OZ |
| Min.PCB track/gap: | 4/4mil |
| Solder mask | Green, two sides |
| Smallest Mechanical drilling hole: | 0.4mm |
| Special requirement | resin filled and plated over/0.25mm BGA/high TG |
| Applicationcommunications products | Communications |
| Brand Name | Huashengxin |
| Model Number | 135470 |
| Certification | UL , ISO9001 |
| Place of Origin | China |
MOQ: 1pcs
Price:
| Payment Terms | T/T |
| Delivery Time | fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production |
| Packaging Details | vacuum |
| PCB Name | 4L 1+N+1 High-Density Interconnector PCB |
| Marterial | FR4 TG170 |
| Surface finished | Immersion gold |
| Board Thickness | 2.0mm |
| Copper thickness | 1/1/1/1OZ |
| Min.PCB track/gap: | 4/4mil |
| Solder mask | Green, two sides |
| Smallest Mechanical drilling hole: | 0.2mm |
| Special requirement | impedance control/high TG |
| Applicationcommunications products | Communications products |
| Brand Name | Huashengxin |
| Model Number | 135464 |
| Certification | UL , ISO9001 |
| Place of Origin | China |
MOQ: 1pcs
Price:
| Payment Terms | T/T |
| Delivery Time | fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production |
| Packaging Details | vacuum |
| PCB Name | 8L 3+N+3 HDI Printed Circuit Boards |
| Marterial | FR4 TG150 |
| Surface finished | Immersion gold |
| Board Thickness | 1.6mm |
| Copper thickness | 1/1/1/1/1/1/1/1OZ |
| Min.PCB track/gap: | 3/3mil |
| Solder mask | Blue |
| Smallest Mechanical drilling hole: | 0.2mm |
| Special request | Small line space and gap:3/3mil/ three step stack up |
| Applicationcommunications products | Digital products |
| Brand Name | Huashengxin |
| Model Number | 135419 |
| Certification | UL , ISO9001 |
| Place of Origin | China |
MOQ: 1pcs
Price:
| Payment Terms | T/T |
| Delivery Time | fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production |
| Packaging Details | vacuum |
| PCB Name | 6L 2+N+2 HDI Printed Circuit Boards |
| Marterial | FR4 TG170 S1000-2 |
| Surface finished | Immersion gold |
| Board Thickness | 1.6mm |
| Copper thickness | 1/1/1/1/1/1OZ |
| Min.PCB track/gap: | 3/4mil |
| Solder mask | Green |
| Smallest Mechanical drilling hole: | 0.15mm |
| Special request | impedance control/0.25mm BGA |
| Applicationcommunications products | HDI Buried vias and blind vias, two step stack up /impedance control/resin filled |
| Brand Name | Huashengxin |
| Model Number | 135416 |
| Certification | UL , ISO9001 |
| Place of Origin | China |
MOQ: 1pcs
Price:
| Payment Terms | T/T |
| Delivery Time | fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production |
| Packaging Details | vacuum |
| PCB Name | 6L 1+N+1HDI Boards |
| Marterial | FR4 S1000-2 TG170 |
| Surface finished | Immersion gold |
| Board Thickness | 1.2mm |
| Copper thickness | 1/1/1/1/1/1OZ |
| Min.PCB track/gap: | 6/4mil |
| Solder mask | TAIYO Green |
| Smallest Mechanical drilling hole: | 0.25mm |
| Special request | HDI Buried vias and blind vias, one step stack up |
| Applicationcommunications products | communications products |
| Brand Name | Huashengxin |
| Model Number | 135033 |
| Certification | UL , ISO9001 |
| Place of Origin | China |
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