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China Electronic Multilayer PCB Circuit Board Assembly OEM With FR-4 Material
China Electronic Multilayer PCB Circuit Board Assembly OEM With FR-4 Material

  1. China Electronic Multilayer PCB Circuit Board Assembly OEM With FR-4 Material
  2. China Electronic Multilayer PCB Circuit Board Assembly OEM With FR-4 Material
  3. China Electronic Multilayer PCB Circuit Board Assembly OEM With FR-4 Material
  4. China Electronic Multilayer PCB Circuit Board Assembly OEM With FR-4 Material
  5. China Electronic Multilayer PCB Circuit Board Assembly OEM With FR-4 Material
  6. China Electronic Multilayer PCB Circuit Board Assembly OEM With FR-4 Material

Electronic Multilayer PCB Circuit Board Assembly OEM With FR-4 Material

  1. MOQ: 1
  2. Price: 0.2-6$/pieces
  3. Get Latest Price
Payment Terms L/C, T/T, Western Union, MoneyGram
Supply Ability 1580000
Delivery Time 3-8 work days
Product name Metal Core Pcb Circuit Board
Certificate ISO9001
Base material FR-4
Min. line spacing 0.2mm
Board thickness 1.6mm
Min. line width 3mi
Brand Name YScircuit
Model Number YS-00010
Certification ISO9001,UL,REACH, RoHS
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms L/C, T/T, Western Union, MoneyGram Supply Ability 1580000
Delivery Time 3-8 work days Product name Metal Core Pcb Circuit Board
Certificate ISO9001 Base material FR-4
Min. line spacing 0.2mm Board thickness 1.6mm
Min. line width 3mi Brand Name YScircuit
Model Number YS-00010 Certification ISO9001,UL,REACH, RoHS
Place of Origin China
High Light Multilayer PCB Circuit Board AssemblyElectronic Multilayer PCB Circuit BoardOEM Multilayer PCB Board

Custom Electronic Printed Circuit Board PCB Assembly Services Oem Other Multilayer PCB

What is Multilayer PCBs

In a typical four-layer stack up, to improve the electromagnetic compatibility (EMI) performance, the signal layers should be spaced as close to the planes and use a large core between the power and ground plane. The tight coupling between signal trace and ground plane often reduces the plane impedance which further reduces the common-mode radiation from the cables connected to the printed circuit board. Also, the close trace to plane coupling will decrease the crosstalk between traces.

 

PCB Sideplating

Sideplating is the metalization of the board edge in the PCB filed.

Edge plating,plated contour, side metal, these words can also be used to describe the same function.

 

Half-cut Castellated Holes

Castellations are plated through holes or vias located in the edges of a printed circuit board.

Are indentations created in the form of semi-plated holes on the edges of the PCB boards.

These half holes serve as pads intended to create a link between the module board and the board that it will be soldered onto.

 

Parameters

  • Layers: 8L multilayer pcb
  • Board Thinkness:2.0mm
  • Base Material:S1000-2 High tg
  • Min Holes:0.2mm
  • Minimum Line Width/Clearance:0.25mm/0.25mm
  • Minimum Clearance between Inner Layer PTH to Line: 0.2mm
  • Size:250.6mm×180.5mm
  • Aspect Ratio:10 : 1
  • Surface treatment:ENIG+ Selective hard gold
  • Process characteristics: High tg, Sideplating, Selective hard gold, Half-cut Castellated Holes
  • Applications: Wi-Fi modules
YS Multilayer PCB manufacturing capabilities overview
Feature capabilities
Layer Count 3-60L
Available Multilayer PCB Technology Through hole with Aspect Ratio 16:1
buried and blind via
Hybrid High Frequency Material such as RO4350B and FR4 Mix etc.
High Speed Material such as M7NE and FR4 Mix etc.
Thickness 0.3mm-8mm
Minimum line Width and Space 0.05mm/0.05mm(2mil/2mil)
BGA PITCH 0.35mm
Min mechanical Drilled Size 0.15mm(6mil)
Aspect Ratio for through hole 10:1
Surface Finish HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc.
Via Fill Option The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO)
Copper filled, silver filled
Registration ±4mil
Solder Mask Green, Red, Yellow,White, Black, Purple, Matte Black, Matte green.etc.

FQA

 

1. What is hard gold in PCB?

The Hard Gold surface finish, also known as Hard Electrolytic Gold, is composed of a layer of gold with added hardeners for increased durability, plated over a barrier coat of nickel using an electrolytic process.

 

2. What is hard gold plating?
Hard gold plating is a gold electrodeposit that has been alloyed with another element to alter the grain structure of the gold to achieve a harder deposit with a more refined grain structure.

The most common alloying elements used in hard gold plating are cobalt, nickel or iron.

 

3. What is the difference between Enig and hard gold?
ENIG plating is much softer than hard gold plating.

Grain sizes are about 60 times larger with ENIG plating, and hardness runs between 20 and 100 HK25.

ENIG plating holds up well at only 35 grams of contact force or less, and ENIG plating typically lasts for fewer cycles than hard plating.

 

A popular trend among manufacturers is board-to-board soldering.

This technique allows companies to produce integrated modules (often containing dozens of parts) on a single board that can be built into another assembly during production.

One easy way to produce a PCB that is destined to be mounted to another PCB is to create castellated mounting holes.

These are also known as "castellated vias" or "castellations."

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Exporter

  • Year Established:

    2012

  • Total Annual:

    230,000,000-250,000,000

  • Employee Number:

    20~200

  • Ecer Certification:

    Verified Supplier

Welcome to YScircuit! Welcome to YScircuit!

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  • Reach Us
  • Shenzhen Yingsheng Technology Co., Ltd.
  • Shenzhen YingSheng Technology Co., Ltd 805, Tongxin Technology Building, Qiaotou Community, Fuhai Street, Baoan District, Shenzhen
  • https://www.pcbs-board.com/

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