Quanhong FASTPCB
| Supply Ability | 10PCS+48Hour |
| Packaging Details | Corrugated case |
| PCBA Type | Consumer Electronics PCBA Manufacture |
| Base Material | FR-4 TG170 |
| Number Of Layers | 4 Layer |
| Copper Thickness | 2 Oz. |
| Board Thickness | 1.6mm |
| Min. Hole Size | 0.3mm |
| Min. Line Width | 0.10mm |
| Min. Line Spacing | 0.125mm |
| Surface Finishing | HAL lead free |
| Solder Mask Color | Black |
| Brand Name | FASTPCB |
| Place of Origin | CHINA |
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Product Specification
| Supply Ability | 10PCS+48Hour | Packaging Details | Corrugated case |
| PCBA Type | Consumer Electronics PCBA Manufacture | Base Material | FR-4 TG170 |
| Number Of Layers | 4 Layer | Copper Thickness | 2 Oz. |
| Board Thickness | 1.6mm | Min. Hole Size | 0.3mm |
| Min. Line Width | 0.10mm | Min. Line Spacing | 0.125mm |
| Surface Finishing | HAL lead free | Solder Mask Color | Black |
| Brand Name | FASTPCB | Place of Origin | CHINA |
| High Light | Sub Contract Electronics Assembly ，Smt Electronics Manufacturing ，Electronic Assembly Fabrication | ||
Consumer electronics refers to electronic products used by everyday consumers. Consumer electronics products are made all over the world, with relatively concentrated production in mainland China due to its low-cost advantage
Since the late 1990s, the information home appliance, which integrates computer, information and communication and consumer electronics, has been widely used in family life. It has functions such as audio-visual, information processing and two-way network communication. It consists of embedded processor, related supporting hardware (such as display card, storage medium, IC card or credit card reading device), embedded operating system and software package of application layer. Broadly speaking, information home appliances include all home appliances that can exchange information through the network system, such as PC, set-top box, HPC, DVD, super VCD, wireless data communication equipment, video game equipment, intelligent TV box, WEBTV and so on. At present, audio, video and communication equipment is the main component of information home appliances. In the long run, refrigerators, washing machines, and microwave ovens will also develop into information home appliances and form part of smart home appliances.
| Item | HLC Advanced Technology | |||
| 2019 | 2020 | 2021 | ||
| Max Panel Width (inch) | 25 | 25 | 25 | |
| Max Panel Length (inch) | 29 | 29 | 29 | |
| Max Layer Count (L) | 16 | 18 | 36 | |
| Max Board thickness (mm) | 3.2 | 4 | 6 | |
| Max Board thickness Tolerance | +/-10% | +/-10% | +/-10% | |
| Base copper Thickness | Inner layer ( OZ ) | 4 | 6 | 8 |
| Outer Layer ( OZ ) | 2 | 3 | 4 | |
| Min DHS ( mm ) | 0.2 | 0.15 | 0.15 | |
| PTH Size Tolerance ( mil ) | +/-2 | +/-2 | +/-2 | |
| Back Drill (stub)( mil ) | ~ 3 | ~ 2.4 | ~ 2 | |
| Max. AR | 12:1 | 16:1 | 20:1 | |
| Item | HLC Advanced Technology | |||
| 2019 | 2020 | 2021 | ||
| M-drill tolerance | Inner layer ( mil ) | DHS + 10 | DHS + 10 | DHS + 8 |
| Outer Layer ( mil ) | DHS + 8 | DHS + 8 | DHS + 6 | |
| Solder mask Registration (um) | +/- 40 | +/- 30 | +/- 25 | |
| Impedance control | ≥50ohms | +/-10% | +/-10% | -/-8% |
| <50ohms | 5 Ω | 5 Ω | 4 Ω | |
| Min LW/S (Inner)@1oz base Cu ( mil ) | 3.0 / 3.0 | 2.6 / 2.6 | 2.5 / 2.5 | |
| Min LW/S (Outer)@1oz Cu ( mil ) | 3.5 / 3.5 | 3.0 / 3.5 | 3.0 / 3.0 | |
| Max dimple for POFV ( um ) | 30 | 20 | 15 | |
| Surface Finishing | ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au | |||
| Item | HDI Advanced Technology | |||
| 2019 | 2020 | 2021 | ||
| Structure | 5+n+5 | 6+n+6 | 7+n+7 | |
| HDI Stack Via | AnyLayer(12L) | AnyLayer(14L) | AnyLayer(16L) | |
| Board Thickness(mm) | Min. 8L | 0.45 | 0.4 | 0.35 |
| Min. 10L | 0.55 | 0.45 | 0.4 | |
| Min. 12L | 0.65 | 0.6 | 0.55 | |
| MAX. | 2.4 | |||
| Min. Core Thickness ( um ) | 50 | 40 | 40 | |
| Min. PP Thickness ( um ) | 30(#1027PP) | 25(#1017PP) | 20(#1010PP) | |
| Base Copper Thickness | Inner Layer ( OZ) | 1/3 ~ 2 | 1/3 ~ 2 | 1/3 ~ 2 |
| Outer Layer ( OZ ) | 1/3 ~ 1 | 1/3 ~ 1 | 1/3 ~ 1 | |
| Item | HDI Advanced Technology | |||
| 2019 | 2020 | 2021 | ||
| Min. Mechanical Drill hole size(um) ** | 200 | 200 | 150 | |
| Max. Through Hole Aspect Ratio * | 8:1 | 10:1 | 10:1 | |
| Min. Laser via/Pad Size ( um ) | 75/200 | 70/170 | 60/150 | |
| Max. Laser Via Aspect Ratio | 0.8:1 | 0.8:1 | 0.8:1 | |
| Laser Via on PTH(VOP)design | Yes | Yes | Yes | |
| Laser X type through hole(DT≤200um) | NA | 60~100um | 60~100um | |
| Min. LW/S (L/S/Cu, um) | Inner Layer | 45 /45 /15 | 40/ 40/ 15 | 30/ 30 /15 |
| outer Layer | 50 /50/ 20 | 40 /50 /20 | 40 /40 /17 | |
| Min BGA Pitch (mm) | 0.35 | 0.3 | 0.3 | |
| Item | HDI Advanced Technology | |||
| 2019 | 2020 | 2021 | ||
| Solder mask Registration (um) | +/- 30 | +/- 25 | +/- 20 | |
| Min. Solder Mask Dam (mm) | 0.07 | 0.06 | 0.05 | |
| PCB Warpage Control | >= 50ohm | +/-10% | +/-8% | +/- 5% |
| < 50ohm | +/- 5ohm | +/- 3ohm | +/- 3ohm | |
| PCB Warpage Control | ≤0.5% | ≤0.5% | ≤0.5% | |
| cavity Depth accuracy (um) | Mechanical | +/- 75 | +/- 75 | +/- 50 |
| Laser directly | +/- 50 | +/- 50 | +/- 50 | |
| Surface Finishing | OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag | OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG | ||
| Item | SMT Capability | |||
| 2019 | 2020 | 2021 | ||
| Min board thickness ( mm ) | 0.1 | 0.06 | 0.05 | |
| Max. board size ( mm ) | 200 x 250 | 250 x 300 | 250 x 350 | |
| Chip component ( L, C, R etc. ) | Minimum size | 1005 | 1005 | 1005 |
| Connector | 0.5 mm pitch | Y | Y | Y |
| 0.4 mm pitch | Y | Y | Y | |
| 0.35 mm pitch | Y | Y | Y | |
| High density component : | 0.5 mm pitch | Y | Y | Y |
| TSOP, QFP, QFN, LGA, BGA etc. | 0.4 mm pitch | Y | Y | Y |
| 0.35 mm pitch | Y | Y | Y | |
| Reflow | N2 reflow | No | Y | Y |
| Under-fill | Fill under chip | Manual | Auto | Auto |
| ACF attach | Gold finger pitch | N/A | 0.3 mm | 0.2 mm |
| Inspection | Component position, direction, missing etc. | Manual check with 10 x scope | Auto AOI inspection | Auto AOI inspection |
| Solder paste thickness | Measure once per shift | 1 line auto full area, online SPI | All lines auto full area, online SPI | |
| Packaging & Delivery | |||||
| Packaging Details: | Inner: vacuum packing or Anti-static package, Outer: export carton or according to the customer's requirement. |
||||
| Port: | Shenzhen or Hongkong | ||||
| Lead Time: | Quantity(Pieces) | 1-10 | 11-100 | 101-1000 | >1000 |
| Est. Time(days) | 3-5 | 3-5 | 7-9 |
To be negotiated |
|
FAQ:
Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.
Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.
Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.
Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.
Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.
Q: Are you factory?
FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer,Exporter,Trading Company,Seller,Other
Year Established:
2007
Total Annual:
12000000-15000000
Employee Number:
100~200
Ecer Certification：
Active Member
Shenzhen Quanhong electronics Co., Ltd. is a professional manufacturer of high-precision double-sided, multi-layer circuit board and aluminum substrate. The factory is located in the complex and difficult allegro, sample and small and medium batch one-stop service, to help customers create more valu... Shenzhen Quanhong electronics Co., Ltd. is a professional manufacturer of high-precision double-sided, multi-layer circuit board and aluminum substrate. The factory is located in the complex and difficult allegro, sample and small and medium batch one-stop service, to help customers create more valu...
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