Shenzhen Hansome Technology Co., Ltd.
| Payment Terms | T/T, Western Union, MoneyGram |
| Supply Ability | 100 sets per month |
| Delivery Time | 7~9 work days |
| Packaging Details | Wooden package |
| Product Name | Mobile Phone BGA Rework Station |
| Warranty | 1 Year |
| Control | Touch screen |
| PLC | MITSUBISHI |
| Relay Brand | Schneider |
| Optoelectronic Switch | OMRON |
| Material | Aluminum Alloy |
| Condition | New |
| Thickness | 0.3 - 5mm |
| Signal | SMEMA |
| Application | Electronic Assembly |
| Color | Silver |
| Control System | PLC |
| OEM/ODM | Available |
| Total power | 2600W |
| Power Supply | AC220V |
| Air Pressure | 4-6bar |
| Mounting accuracy | ±0.01mm |
| Type | Automatic |
| Weight | 30KG |
| Brand Name | HSTECH |
| Model Number | HS-700 |
| Certification | CE |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Western Union, MoneyGram | Supply Ability | 100 sets per month |
| Delivery Time | 7~9 work days | Packaging Details | Wooden package |
| Product Name | Mobile Phone BGA Rework Station | Warranty | 1 Year |
| Control | Touch screen | PLC | MITSUBISHI |
| Relay Brand | Schneider | Optoelectronic Switch | OMRON |
| Material | Aluminum Alloy | Condition | New |
| Thickness | 0.3 - 5mm | Signal | SMEMA |
| Application | Electronic Assembly | Color | Silver |
| Control System | PLC | OEM/ODM | Available |
| Total power | 2600W | Power Supply | AC220V |
| Air Pressure | 4-6bar | Mounting accuracy | ±0.01mm |
| Type | Automatic | Weight | 30KG |
| Brand Name | HSTECH | Model Number | HS-700 |
| Certification | CE | Place of Origin | China |
5 Modes Stepping Motor CCD Color Align System Mobil Phone BGA Rework Station
Specification
| Mobile Phone BGA Rework Station | Model:HS-700 |
| Power Supply | AC 100V / 220V±10% 50/60Hz |
| Total power | 2600W |
| Heater power | Top heater 1200W(Max), bottom heater 1200W(Max) |
| Electric material | Driving motor + smart temp. controller + color touch screen |
| Temperature control | high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃) |
| Sensor | 1pcs |
| Locating way | V shape PCB support + external universal fixture + laser light for centering and positioning |
| Overall dimension | L450mm*W470mm*H670mm |
| PCB size | Max 140mm*160mm Min 5mm*5mm |
| BGA size | Max 50mm*50mm Min 1mm*1mm |
| Applicable PCB thickness | 0.3 - 5mm |
| Mounting accuracy | ±0.01mm |
| Weight of machine | 30KG |
| Mount chip weight | 150g |
| Working modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
| Usage Repair | chips / phone motherboard etc |
Repair steps
1.Separate the BGA chip from mother board –we called desoldering.
2.Clean Pad.
3.Reballing or replace a new BGA chip directly.
4.Alignment/Positioning – Depend on experience ,silk frame ,optical camera.
5. replace a new BGA chip - we called Soldering hot air smd rework station iphone ic replace machine.
About Packaging
Company Details
Business Type:
Manufacturer
Year Established:
2012
Total Annual:
2,000,000.00-3,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012 by prefessional and experienced engineer who wroked many years in EMS company,we specilized in PCB handling equipments at first, then we develop the PCB depaneling machine and SMT cleaning machine. HSTECH not only have professional ... Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012 by prefessional and experienced engineer who wroked many years in EMS company,we specilized in PCB handling equipments at first, then we develop the PCB depaneling machine and SMT cleaning machine. HSTECH not only have professional ...
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