Payment Terms | T/T, Western Union |
Supply Ability | 50-2000K/pcs per month |
Delivery Time | 15-20day |
Packaging Details | Anti-static bag + Anti-static bubble wrap + Good quality carton box |
Surface Finishing | Electroless nickel over Imm |
Board Thickness | 1.60MM |
Copper Thickness | 1.5 oz |
Base Material | 6035HTC+RT6010.2LM |
Min. Line Spacing | 11 mil |
Solder Mask Color | Green |
Min. Hole Size | 0.10MM |
TEST | 100% Electrical Test prior shipment |
Brand Name | Bicheng Enterprise Limited |
Model Number | BIC-008-V8 |
Certification | ISO/UL/RoHS/TS |
Place of Origin | Shenzhen, Guangdong, China |
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Product Specification
Payment Terms | T/T, Western Union | Supply Ability | 50-2000K/pcs per month |
Delivery Time | 15-20day | Packaging Details | Anti-static bag + Anti-static bubble wrap + Good quality carton box |
Surface Finishing | Electroless nickel over Imm | Board Thickness | 1.60MM |
Copper Thickness | 1.5 oz | Base Material | 6035HTC+RT6010.2LM |
Min. Line Spacing | 11 mil | Solder Mask Color | Green |
Min. Hole Size | 0.10MM | TEST | 100% Electrical Test prior shipment |
Brand Name | Bicheng Enterprise Limited | Model Number | BIC-008-V8 |
Certification | ISO/UL/RoHS/TS | Place of Origin | Shenzhen, Guangdong, China |
High Light | hdi pcb design ,multilayer circuit board |
Brief Introduction
16layers of 3nd order HDI 6035HTC+RT6010.2LM High Frequency Circuit Material is glass reinforced hydrocarbon/ceramic laminates
(Not PTFE) designed for performance sensitive, high volume commercial applications. Currently
Double sided and multilayer 16layers of 3nd order HDI 6035HTC+RT6010.2LM PCB's are available at Bicheng company. Double sided
16layers of 3nd order HDI 6035HTC+RT6010.2LM PCB with thickness 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm) and 60mil
(1.524mm) are the bestsellers. We provide prototype runs, small batches and volume production
Services.
Advantages
1) Excellent high frequency performance due to low dielectric tolerance and loss;
2) Excellent dimensional stability.
3) Low thermal coefficient of dielectric constant;
4) Low Z-Axis expansion;
5) Low in-plane expansion coefficient;
6) Stable electrical properties verus frequency;
Applications
1) Attenuator, Automatic gate induction;
2) LNB's for direct broadcast satellites;
3) Microstrip antenna, spread spectrum;
4) Microstrip and cellular base station antennas and power amplifiers;
5) RF identifications tags
6) Spread spectrum communications systems
7) Trunk amplifier, splitter module etc.
PCB Case: 16layers of 3nd order HDI 6035HTC+RT6010.2LM 60 mil High Frequency PCB
Immersion Gold
(PCB's are custom-made products, the picture and parameters shown are just for
Reference)
General description
this is a type of high frequency PCB built on RO4350B for the application of LTE. It's a
2 layer RF PCB board at 1.6 mm thick. It's immersion gold finish with solder mask and
Silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerber data.
Each 10 boards are packed for shipment.
Features and benefits
the temperature coefficient of dielectric constant is among the lowest of any circuit board
Material, making it ideal for temperature sensitive applications.
RO4350B exhibits a stable dielectric constant over a broad frequency range. this makes it
An ideal substrate for broadband applications.
RO4003C exhibit a stable dielectric constant over a broad frequency range. this makes it
An ideal substrate for broadband applications.
ENIG has long storage time (It can be stored for more than 1 year in vacuum bag)
Whole fabrication processes are totally controlled.
Meeting your printed circuit board needs from PCB prototyping to mass volume production.
More than 15 years' experience
High technology
Customer complaint rate: <1%
Application
Uhf radio, Acoustic detection sensors, Digital transmitter, Attenuator
Parameter and data sheet
PCB SIZE | 35 x 65mm=1PCS |
BOARD TYPE | High frequency PCB, RF PCB |
Number of Layers | Double sided PCB |
Surface Mount Components | YES |
through Hole Components | YES |
LAYER STACKUP | Copper ------- 35um(1oz)+PLATE |
6035HTC+RT6010.2LM | |
Copper ------- 35um(1oz)+PLATE | |
TECHNOLOGY | |
Minimum Trace and Space: | 11mil/12mil |
Minimum / Maximum Holes: | 0.3/2.2mm |
Number of Different Holes: | 5 |
Number of Drill Holes: | 184 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 0 |
Impedance Control | NO |
BOARD MATERIAL | |
Glass Epoxy: | 6035HTC+RT6010.2LM60mil, Tg 288 |
Final foil external: | 1.5oz |
Final foil internal: | 0oz |
Final height of PCB: | 1.6mm 0.16 |
PLATING and COATING | |
Surface Finish | Electroless nickel over Immersion Gold (ENIG) ( 2 micoinch over 100 microinch nickel) |
Solder Mask Apply to: | Top and Bottom, 12micon Minimum. |
Solder Mask Color: | Green, PSR-2000GT600D, Taiyo supplied. |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | TOP |
Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Plated through Hole(PTH), via tented. |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" (0.15mm) |
Board plating: | 0.0030" (0.076mm) |
Drill tolerance: | 0.002" (0.05mm) |
TEST | 100% Electrical Test prior shipment |
TYPE of ARTWORK to BE SUPPLIED | Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Company Details
Business Type:
Manufacturer,Importer,Exporter,Seller
Year Established:
1997
Total Annual:
716277898-736287698
Employee Number:
2500~2768
Ecer Certification:
Active Member
Chaosheng Company specializes in producing any order of HDI, high frequency mixed pressure HDI, soft and hard combined HDI, multi-layer ceramic, special size, mixed copper base, metal cladding, high and low copper, buried, buried resistance, special process, special materials High-end (PCB, FPC) cir... Chaosheng Company specializes in producing any order of HDI, high frequency mixed pressure HDI, soft and hard combined HDI, multi-layer ceramic, special size, mixed copper base, metal cladding, high and low copper, buried, buried resistance, special process, special materials High-end (PCB, FPC) cir...
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