Payment Terms | T/T, Western Union |
Supply Ability | 5-200K/pcs per month |
Delivery Time | 15-18day |
Packaging Details | Anti-static bag + Anti-static bubble wrap + Good quality carton box |
Cnc machining or not | CNC Machining |
Type | Rapid Prototyping |
Material capabilities | Stainless Steel |
Product name | ITG 70 Customized High Precision Aluminum PCB Enclosure Profile Box |
Application | Industrial equipment |
Service | OEM/ODM availabe and welcome |
Keyword | plastic prototype fabrication |
Equipment | CNC machining&turning&milling&grinding machine |
Name | Customized Machined CNC Machining,PCB Instrument Box |
Oem service | yes |
Size | According to your drawing |
Provided by | Gerber/PCB File Needed/BOM |
Brand Name | China chao sheng |
Model Number | Automotive communication products |
Certification | ISO/UL/RoHS/TS |
Place of Origin | Shenzhen, Guangdong, China |
View Detail Information
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Product Specification
Payment Terms | T/T, Western Union | Supply Ability | 5-200K/pcs per month |
Delivery Time | 15-18day | Packaging Details | Anti-static bag + Anti-static bubble wrap + Good quality carton box |
Cnc machining or not | CNC Machining | Type | Rapid Prototyping |
Material capabilities | Stainless Steel | Product name | ITG 70 Customized High Precision Aluminum PCB Enclosure Profile Box |
Application | Industrial equipment | Service | OEM/ODM availabe and welcome |
Keyword | plastic prototype fabrication | Equipment | CNC machining&turning&milling&grinding machine |
Name | Customized Machined CNC Machining,PCB Instrument Box | Oem service | yes |
Size | According to your drawing | Provided by | Gerber/PCB File Needed/BOM |
Brand Name | China chao sheng | Model Number | Automotive communication products |
Certification | ISO/UL/RoHS/TS | Place of Origin | Shenzhen, Guangdong, China |
High Light | surface mount pcb assembly , through hole pcb assembly |
16-layer Anylayer, HDIPCB+PCBA (SMT+ plug-in) + components prototype pcb service pcb etching service pcb service + SMT, DIP, TEST,
Helpset
1: Automotive communication products
2: FR-4, TG170, minimum line width 4/4mil, minimum hole 0.10mm, blind hole, immersion gold, green solder mask, white
3: plate thickness 1.96mm, impedance ±10%, resin plug hole + plating hole, green oil, white
Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB
Standard.
Quantities range from prototype to volume production.
100% E-Test
PCB, FPC process production capability
PCBA multiple packaging methods:
Specifications
- Contract Manufacturing
- Engineering Services
- PCB Design & Assembly
- Product Design
- Prototyping
- Cable and Wire Assemblies
- Plastics and Molds
PCB capability and services:
1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test
PCBA capabilities:
Single- or double-sided mixed technology or SMT (Surface Mount) for PCB assembly
Single- or double-sided BGA and micro-BGA installation and rework with 100% X-ray inspection
PCB board components, including all types of BGAs, QFNs, CSPs, 0201, 01005, POP, and Pressfit Components in small quantities
Part Polarity Capacitors, SMT Polarized Capacitors, and Through-Hole Polarized Capacitors
ROHS capability
IPC-A-610E and IPC/EIA-STD workmanship operation
PCB,FPCProcess capability table | |||||||
Technical ltem | MassProduct | Advanced Technology | |||||
2016 | 2017 | 2018 | |||||
Max.Layer Count | 26L | 36L | 80L | ||||
Through-hole plate | 2~45L | 2~60L | 2~80L | ||||
Max.PCBSize(in) | 24*52" | 25*62" | 25*78.75" | ||||
The layer number of FPC | 1~36L | 1~50L | 1~60L | ||||
Max.PCBSize(in) | 9.8"*196" | 9.8"*196" | 10"*196"Reel to reel | ||||
Layeredplatelayer | 2~12L | 2~18L | 2~26L | ||||
Max.PCBSize(in) | 9"*48" | 9"*52" | 9"*62" | ||||
Combination of hard and soft layers | 3~26L | 3~30L | 3~50L | ||||
Interconnect HDI | 5+X+5Interconnect HDI | 7+X+7Interconnect HDI | 8+X+8,Interconnect HDI | ||||
HDI PCB | 4~45L | 4~60L | 4~80L | ||||
Interconnect HDI | 3+20+3 | 4+X+4Interconnect HDI | 4+X+4,Interconnect HDI | ||||
Max.PCBSize(in) | 24"*43" | 24"*49" | 25"*52" | ||||
Material | FR-4 Rogers | FR-4 Rogers | FR-4 Rogers | ||||
Base material | Halogenfree,LowDK | Halogenfree,LowDK | Halogenfree,LowDK | ||||
Build-up Material | FR-4 | FR-4 | FR-4 | ||||
BOard,Thickness(mm) | Min.12L(mm) | 0.43 | 0.42~8.0mm | 0.38~10.0mm | |||
Min.16L(mm) | 0.53 | 1.60~8.0mm | 0.45~10.0mm | ||||
Min.18L(mm) | 0.63 | 2.0~8.0 | 0.51~10.0mm | ||||
Min.52L(mm) | 0.8 | 2.50~8.0mm | 0.65~10.0mm | ||||
MAX(mm) | 3.5 | 10.0mm | 10.0mm | ||||
Min.CoreThickness um(mil) | 254"(10.0) | 254"(10.0) | 0.10~254(10.0mm) | ||||
Min.Build up Dielectric | 38(1.5) | 32(1.3) | 25(1.0) | ||||
BaseCopperWeight | Inner Layer | 4/1-8 OZ | 4/1-15 OZ | 4/1-0.30mm | |||
Out Layer | 4/1-10 OZ | 4/1-15 OZ | 4/1-30 OZ | ||||
Gold thick | 1~40u" | 1~60u" | 1~120u" | ||||
Nithick | 76~127u" | 76~200u" | 1~250u" | ||||
Min.HOle/Land um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | ||||
Min.Laser via/landum(mil) | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) | ||||
Min. IVH,Hole size/landum(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | ||||
DieletricThickness | 38(1.5) | 32(1.3) | 32(1.3) | ||||
125(5) | 125(5) | 125(5) | |||||
SKipvia | Yes | Yes | Yes | ||||
viaoNhie(laserviaon BuriedPTH) | Yes | Yes | Yes | ||||
Laser Hole Filling | Yes | Yes | Yes | ||||
Technicalltem | Mass Product | Advanced Technolgy | |||||
2017year | 2018year | 2019year | |||||
Drill hole depth ratio | ThroughHole | 2017year | .40:1 | .40:1 | |||
Aspet Ratio | Micro Via | .35:1 | 1.2:1 | 1.2:1 | |||
Copper Filling Dimple Size um(Mil) | 10(0.4) | 10(0.4) | 10(0.4) | ||||
Min.LineWidth&space | lnner Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | |||
Plated Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | ||||
BGAPitch mm(Mil) | 0.3 | 0.3 | 0.3 | ||||
Min.PTH Hole ring um(mil) | 75(3mil) | 62.5(2.5mil) | 62.5(2.5mil) | ||||
Line Width Control | ∠2.5MIL | ±0.50 | ±0.50 | ±0.50 | |||
2.5Mil≤L/W∠4mil | ±0.50 | ±0.50 | ±0.50 | ||||
≦3mil | ±0.60 | ±0.60 | ±0.60 | ||||
Laminated structure | Layer by layer | 3+N+3 | 4+N+4 | 5+N+5 | |||
Sequential Build-up | 20L Any Layer | 36L Any Layer | 52L Any Layer | ||||
Multi-layer overlay | N+N | N+N | N+N | ||||
N+X+N | N+X+N | N+X+N | |||||
sequential Lamination | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 | ||||
Soft and hard bonding | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 | ||||
PTH filling process | PTH resin plug hole + plating fill Electroplated hole/copper plug hole | PTH resin plug hole + plating fill Electroplated hole/copper plug hole | PTH resin plug hole + plating fill Electroplated hole/copper plug hole | ||||
PCB, FPC main material supply
NO | supplier | Supply material name | Material origin | |||||
1 | Japan | High frequency materials, PI, covering membrane,Copper berth | Mitsubishi Japan | |||||
2 | dupont | High frequency materials, PI, covering film, dry film,Copper berth | Japan | |||||
3 | panasonic | High frequency materials, PI, covering membrane,Copper berth | Japan | |||||
4 | SanTie | PI, covering membrane | Japan | |||||
5 | Born good | FR-4,PI,PP,Copper berth | shenzhen, China | |||||
6 | A rainbow | PI, covering membrane,Copper berth | Taiwan | |||||
7 | teflon | High frequency materials | The United States | |||||
8 | Rogers | High frequency materials | The United States | |||||
9 | Nippon Steel | PI, covering membrane,Copper berth | Taiwan | |||||
10 | sanyo | PI, covering membrane,Copper berth | Japan | |||||
11 | South Asia | FR-4,PI,PP,Copper berth | Taiwan | |||||
12 | doosan | FR-4,PP | South Korea | |||||
13 | Tai Yao plate | FR-4,PP,Copper berth | Taiwan | |||||
14 | Alight | FR-4,PP,Copper berth | Taiwan | |||||
15 | Yaoguang | FR-4,PP,Copper berth | Taiwan | |||||
16 | Yalong | FR-4,PP | The United States | |||||
17 | ISOAL | FR-4,PP | Japan | |||||
18 | OAK | Buried, buried resistance, PP | Japan | |||||
19 | United States 3M | FR-4,PP | The United States | |||||
20 | Bergs | Copper and aluminum matrix | Japan | |||||
21 | The sun | ink | Taiwan | |||||
22 | Murata | ink | Japan | |||||
23 | generous andbenevolent | PI, covering membrane,Copper berth | China's jiangxi | |||||
24 | Yasen | PPI, covering membrane | China jiangsu | |||||
25 | Yong Sheng Tai | ink | China guangdong panyu | |||||
26 | mita | ink | Japan | |||||
27 | Transcript | ceramic material | Taiwan | |||||
28 | HOME | ceramic material | Japan | |||||
29 | Fe-Ni-Mn | Alloy Invar, Section Steel | Taiwan | |||||
PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED and other electronic products
FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: How can I know the process of my PCB production?
A: 5-15days for PCB production and components purchasing, and 14-18 days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
Company Details
Business Type:
Manufacturer,Importer,Exporter,Seller
Year Established:
1997
Total Annual:
716277898-736287698
Employee Number:
2500~2768
Ecer Certification:
Active Member
Chaosheng Company specializes in producing any order of HDI, high frequency mixed pressure HDI, soft and hard combined HDI, multi-layer ceramic, special size, mixed copper base, metal cladding, high and low copper, buried, buried resistance, special process, special materials High-end (PCB, FPC) cir... Chaosheng Company specializes in producing any order of HDI, high frequency mixed pressure HDI, soft and hard combined HDI, multi-layer ceramic, special size, mixed copper base, metal cladding, high and low copper, buried, buried resistance, special process, special materials High-end (PCB, FPC) cir...
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