Payment Terms | T/T, Western Union |
Supply Ability | 5-200K/pcs per month |
Delivery Time | 18-20day |
Packaging Details | Anti-static bag + Anti-static bubble wrap + Good quality carton box |
Micro machining or not | Micro Machining |
Cnc machining or not | CNC Machining |
Type | Laser Machining |
Material capabilities | Aluminum |
Material | Aluminum |
Product name | Clamp pcb test fixture manufacturer |
Service | OEM/ODM availabe and welcome |
Process | Cnc Machining+deburrs |
Keyword | CNC Macining Parts,Prototyping Supplier Rapid Prototyping 2D&3D Drawing Design |
Tolerance | 0.01mm |
Name | PCB Instrument Box |
Packing | Poly Bag + Inner Box + Carton |
Brand Name | China chao sheng |
Model Number | electric products |
Place of Origin | Shenzhen, Guangdong, China |
Certification | ISO/UL/RoHS/TS |
View Detail Information
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Product Specification
Payment Terms | T/T, Western Union | Supply Ability | 5-200K/pcs per month |
Delivery Time | 18-20day | Packaging Details | Anti-static bag + Anti-static bubble wrap + Good quality carton box |
Micro machining or not | Micro Machining | Cnc machining or not | CNC Machining |
Type | Laser Machining | Material capabilities | Aluminum |
Material | Aluminum | Product name | Clamp pcb test fixture manufacturer |
Service | OEM/ODM availabe and welcome | Process | Cnc Machining+deburrs |
Keyword | CNC Macining Parts,Prototyping Supplier Rapid Prototyping 2D&3D Drawing Design | Tolerance | 0.01mm |
Name | PCB Instrument Box | Packing | Poly Bag + Inner Box + Carton |
Brand Name | China chao sheng | Model Number | electric products |
Place of Origin | Shenzhen, Guangdong, China | Certification | ISO/UL/RoHS/TS |
High Light | smt pcb assembly , pcb printed circuit board |
8-layer coil electric FR4 Printed Circuit Board with Laser Machining
Product Description
FR4 Printed Circuit Board Application,PCB process production capability
Process capability table | |||||||
Technical ltem | MassProduct | Advanced Technology | |||||
2016 | 2017 | 2018 | |||||
Max.Layer Count | 26L | 36L | 80L | ||||
Through-hole plate | 2~45L | 2~60L | 2~80L | ||||
Max.PCBSize(in) | 24*52" | 25*62" | 25*78.75" | ||||
The layer number of FPC | 1~36L | 1~50L | 1~60L | ||||
Max.PCBSize(in) | 9.8"*196" | 9.8"*196" | 10"*196"Reel to reel | ||||
Layeredplatelayer | 2~12L | 2~18L | 2~26L | ||||
Max.PCBSize(in) | 9"*48" | 9"*52" | 9"*62" | ||||
Combination of hard and soft layers | 3~26L | 3~30L | 3~50L | ||||
HDI,Interconnect HDI | 5+X+5Interconnect HDI | 7+X+7Interconnect HDI | 8+X+8,Interconnect HDI | ||||
HDI PCB | 4~45L | 4~60L | 4~80L | ||||
HDI,Interconnect HDI | 3+20+3 | 4+X+4Interconnect HDI | 4+X+4,Interconnect HDI | ||||
Max.PCBSize(in) | 24"*43" | 24"*49" | 25"*52" | ||||
Material | FR-4 Rogers | FR-4 Rogers | FR-4 Rogers | ||||
Base material | Halogenfree,LowDK | Halogenfree,LowDK | Halogenfree,LowDK | ||||
Build-up Material | FR-4 | FR-4 | FR-4 | ||||
BOard,Thickness(mm) | Min.12L(mm) | 0.43 | 0.42~8.0mm | 0.38~10.0mm | |||
Min.16L(mm) | 0.53 | 1.60~8.0mm | 0.45~10.0mm | ||||
Min.18L(mm) | 0.63 | 2.0~8.0 | 0.51~10.0mm | ||||
Min.52L(mm) | 0.8 | 2.50~8.0mm | 0.65~10.0mm | ||||
MAX(mm) | 3.5 | 10.0mm | 10.0mm | ||||
Min.CoreThickness um(mil) | 254"(10.0) | 254"(10.0) | 0.10~254(10.0mm) | ||||
Min.Build up Dielectric | 38(1.5) | 32(1.3) | 25(1.0) | ||||
BaseCopperWeight | Inner Layer | 4/1-8 OZ | 4/1-15 OZ | 4/1-0.30mm | |||
Out Layer | 4/1-10 OZ | 4/1-15 OZ | 4/1-30 OZ | ||||
Gold thick | 1~40u" | 1~60u" | 1~120u" | ||||
Nithick | 76~127u" | 76~200u" | 1~250u" | ||||
Min.HOle/Land um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | ||||
Min.Laser via/landum(mil) | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) | ||||
Min. IVH,Hole size/landum(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | ||||
DieletricThickness | 38(1.5) | 32(1.3) | 32(1.3) | ||||
125(5) | 125(5) | 125(5) | |||||
SKipvia | Yes | Yes | Yes | ||||
viaoNhie(laserviaon BuriedPTH) | Yes | Yes | Yes | ||||
Laser Hole Filling | Yes | Yes | Yes | ||||
PCB, FPC main material supply
NO | supplier | Supply material name | Material origin | |||||
1 | Japan | High frequency materials, PI, covering membrane,Copper berth | Mitsubishi Japan | |||||
2 | dupont | High frequency materials, PI, covering film, dry film,Copper berth | Japan | |||||
3 | panasonic | High frequency materials, PI, covering membrane,Copper berth | Japan | |||||
4 | SanTie | PI, covering membrane | Japan | |||||
5 | Born good | FR-4,PI,PP,Copper berth | shenzhen, China | |||||
6 | A rainbow | PI, covering membrane,Copper berth | Taiwan | |||||
7 | teflon | High frequency materials | The United States | |||||
8 | Rogers | High frequency materials | The United States | |||||
9 | Nippon Steel | PI, covering membrane,Copper berth | Taiwan | |||||
10 | sanyo | PI, covering membrane,Copper berth | Japan | |||||
11 | South Asia | FR-4,PI,PP,Copper berth | Taiwan | |||||
12 | doosan | FR-4,PP | South Korea | |||||
13 | Tai Yao plate | FR-4,PP,Copper berth | Taiwan | |||||
14 | Alight | FR-4,PP,Copper berth | Taiwan | |||||
15 | Yaoguang | FR-4,PP,Copper berth | Taiwan | |||||
16 | Yalong | FR-4,PP | The United States | |||||
17 | ISOAL | FR-4,PP | Japan | |||||
18 | OAK | Buried, buried resistance, PP | Japan | |||||
19 | United States 3M | FR-4,PP | The United States | |||||
20 | Bergs | Copper and aluminum matrix | Japan | |||||
21 | The sun | ink | Taiwan | |||||
22 | Murata | ink | Japan | |||||
23 | generous andbenevolent | PI, covering membrane,Copper berth | China's jiangxi | |||||
24 | Yasen | PPI, covering membrane | China jiangsu | |||||
25 | Yong Sheng Tai | ink | China guangdong panyu | |||||
26 | mita | ink | Japan | |||||
27 | Transcript | ceramic material | Taiwan | |||||
28 | HOME | ceramic material | Japan | |||||
29 | Fe-Ni-Mn | Alloy Invar, Section Steel | Taiwan | |||||
Quality Assurance:
Our Quality processes include:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004
Certificates:
ISO9001-2008
ISO/TS16949
UL
IPC-A-600G and IPC-A-610E Class II compliance
Customer's requirements
Quick Detail:
1. PCB Assembly on SMT and DIP
2. PCB schematic drawing/ layout /producing
3. PCBA clone/change board
4. Components sourcing and purchasing for PCBA
5. Enclosure design and plastic injection molding
6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,
7. IC programming
Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray
PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products
FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6 hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: How can I know the process of my PCB production?
A: 5-7days for PCB production and components purchasing, and 14 days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB products work well before shipping. We'll test all of them according to your test procedure.
Company Details
Business Type:
Manufacturer,Importer,Exporter,Seller
Year Established:
1997
Total Annual:
716277898-736287698
Employee Number:
2500~2768
Ecer Certification:
Active Member
Chaosheng Company specializes in producing any order of HDI, high frequency mixed pressure HDI, soft and hard combined HDI, multi-layer ceramic, special size, mixed copper base, metal cladding, high and low copper, buried, buried resistance, special process, special materials High-end (PCB, FPC) cir... Chaosheng Company specializes in producing any order of HDI, high frequency mixed pressure HDI, soft and hard combined HDI, multi-layer ceramic, special size, mixed copper base, metal cladding, high and low copper, buried, buried resistance, special process, special materials High-end (PCB, FPC) cir...
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