Shenzhen Chaosheng Electronic Technology Co.,Ltd
| Payment Terms | T/T, Western Union |
| Supply Ability | 5-200K/pcs per month |
| Delivery Time | 25-35day |
| Packaging Details | Anti-static bag + Anti-static bubble wrap + Good quality carton box |
| Copper thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Type | High Tg board High frequency Rogers 5880 PCB |
| Material | Tg180 |
| Solder mask color | White.Black.Yellow.Green.Red.Blue |
| Layer | 1-12 layers+ SMT + plug-in + back soldering |
| Service | PCB&PCBA,EMS/OMD/OEM/turnkey assembly |
| Pcb standard | IPC-A-610 D/IPC-III Standard |
| Usage | OEM Electronics |
| Brand Name | China chao sheng |
| Model Number | 4L plate thicknesssize902*902mm,rigid flex printed +SMT+Plugin |
| Certification | ISO/UL/RoHS/TS |
| Place of Origin | Shenzhen, Guangdong, China |
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Product Specification
| Payment Terms | T/T, Western Union | Supply Ability | 5-200K/pcs per month |
| Delivery Time | 25-35day | Packaging Details | Anti-static bag + Anti-static bubble wrap + Good quality carton box |
| Copper thickness | 1/2OZ 1OZ 2OZ 3OZ | Type | High Tg board High frequency Rogers 5880 PCB |
| Material | Tg180 | Solder mask color | White.Black.Yellow.Green.Red.Blue |
| Layer | 1-12 layers+ SMT + plug-in + back soldering | Service | PCB&PCBA,EMS/OMD/OEM/turnkey assembly |
| Pcb standard | IPC-A-610 D/IPC-III Standard | Usage | OEM Electronics |
| Brand Name | China chao sheng | Model Number | 4L plate thicknesssize902*902mm,rigid flex printed +SMT+Plugin |
| Certification | ISO/UL/RoHS/TS | Place of Origin | Shenzhen, Guangdong, China |
| High Light | multilayer flexible pcb ， prototype circuit board assembly | ||
4L plate thicknesssize902*902mm,rigid flex printed +SMT+Plugin Drone product immersion goldpcb,High FrequencyPCB
Product Description
PCBA capabilities:
PCB Assembly services:
PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products
Advantages:
1. Turnkey manufacturing or quick-turn prototypes
2. Board-level assembly or complete system integration
3. Low-volume or mixed-technology assembly for PCBA
4. Even consignment production
5. Supoorted capabilities
PCB, FPC process production capability
| Technical ltem | MassProduct | Advanced Technology | |||||
| 2016 | 2017 | 2018 | |||||
| Max.Layer Count | 26L | 36L | 80L | ||||
| Through-hole plate | 2～45L | 2～60L | 2～80L | ||||
| Max.PCBSize(in) | 24*52" | 25*62" | 25*78.75" | ||||
| The layer number of FPC | 1～36L | 1～50L | 1～60L | ||||
| Max.PCBSize(in) | 9.8"*196" | 9.8"*196" | 10"*196"Reel to reel | ||||
| Layeredplatelayer | 2～12L | 2～18L | 2～26L | ||||
| Max.PCBSize(in) | 9"*48" | 9"*52" | 9"*62" | ||||
| Combination of hard and soft layers | 3～26L | 3～30L | 3～50L | ||||
| Interconnect HDI | 5+X+5Interconnect HDI | 7+X+7Interconnect HDI | 8+X+8,Interconnect HDI | ||||
| HDI PCB | 4～45L | 4～60L | 4～80L | ||||
| Interconnect HDI | 3+20+3 | 4+X+4Interconnect HDI | 4+X+4,Interconnect HDI | ||||
| Max.PCBSize(in) | 24"*43" | 24"*49" | 25"*52" | ||||
| Material | FR-4 Rogers | FR-4 Rogers | FR-4 Rogers | ||||
| Base material | Halogenfree,LowDK | Halogenfree,LowDK | Halogenfree,LowDK | ||||
| Build-up Material | FR-4 | FR-4 | FR-4 | ||||
| BOard,Thickness(mm) | Min.12L(mm) | 0.43 | 0.42～8.0mm | 0.38～10.0mm | |||
| Min.16L(mm) | 0.53 | 1.60～8.0mm | 0.45～10.0mm | ||||
| Min.18L(mm) | 0.63 | 2.0～8.0 | 0.51～10.0mm | ||||
| Min.52L(mm) | 0.8 | 2.50～8.0mm | 0.65～10.0mm | ||||
| MAX(mm) | 3.5 | 10.0mm | 10.0mm | ||||
| Min.CoreThickness um(mil) | 254"(10.0) | 254"(10.0) | 0.10～254(10.0mm) | ||||
| Min.Build up Dielectric | 38(1.5) | 32(1.3) | 25(1.0) | ||||
| BaseCopperWeight | Inner Layer | 4/1-8 OZ | 4/1-15 OZ | 4/1-0.30mm | |||
| Out Layer | 4/1-10 OZ | 4/1-15 OZ | 4/1-30 OZ | ||||
| Gold thick | 1～40u" | 1～60u" | 1～120u" | ||||
| Nithick | 76～127u" | 76～200u" | 1～250u" | ||||
| Min.HOle/Land um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | ||||
| Min.Laser via/landum(mil) | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) | ||||
| Min. IVH,Hole size/landum(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | ||||
| DieletricThickness | 38(1.5) | 32(1.3) | 32(1.3) | ||||
| 125(5) | 125(5) | 125(5) | |||||
| SKipvia | Yes | Yes | Yes | ||||
| viaoNhie(laserviaon BuriedPTH) | Yes | Yes | Yes | ||||
| Laser Hole Filling | Yes | Yes | Yes | ||||
| Technicalltem | Mass Product | Advanced Technolgy | |||||
| 2017year | 2018year | 2019year | |||||
| Drill hole depth ratio | ThroughHole | 2017year | .40:1 | .40:1 | |||
| Aspet Ratio | Micro Via | .35:1 | 1.2:1 | 1.2:1 | |||
| Copper Filling Dimple Size um(Mil) | 10(0.4) | 10(0.4) | 10(0.4) | ||||
| Min.LineWidth＆space | lnner Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | |||
| Plated Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | ||||
| BGAPitch mm(Mil) | 0.3 | 0.3 | 0.3 | ||||
| Min.PTH Hole ring um(mil) | 75(3mil) | 62.5(2.5mil) | 62.5(2.5mil) | ||||
| Line Width Control | ∠2.5MIL | ±0.50 | ±0.50 | ±0.50 | |||
| 2.5Mil≤L/W∠4mil | ±0.50 | ±0.50 | ±0.50 | ||||
| ≦3mil | ±0.60 | ±0.60 | ±0.60 | ||||
| Laminated structure | Layer by layer | 3+N+3 | 4+N+4 | 5+N+5 | |||
| Sequential Build-up | 20L Any Layer | 36L Any Layer | 52L Any Layer | ||||
| Multi-layer overlay | N+N | N+N | N+N | ||||
| N+X+N | N+X+N | N+X+N | |||||
| sequential Lamination | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 | ||||
| Soft and hard bonding | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 | ||||
| PTH filling process | PTH resin plug hole + plating fill Electroplated hole/copper plug hole | PTH resin plug hole + plating fill Electroplated hole/copper plug hole | PTH resin plug hole + plating fill Electroplated hole/copper plug hole | ||||
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material
Testing Methods
AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing
Quality Processes:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949
Design file format:
1. Gerber RS-274X, 274D, Eagle and AutoCAD's DXF, DWG
2. BOM (bill of materials)
3. Pick and place file (XYRS)
FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.
Company Details
Business Type:
Manufacturer,Importer,Exporter,Seller
Year Established:
1997
Total Annual:
716277898-736287698
Employee Number:
2500~2768
Ecer Certification：
Active Member
Chaosheng Company specializes in producing any order of HDI, high frequency mixed pressure HDI, soft and hard combined HDI, multi-layer ceramic, special size, mixed copper base, metal cladding, high and low copper, buried, buried resistance, special process, special materials High-end (PCB, FPC) cir... Chaosheng Company specializes in producing any order of HDI, high frequency mixed pressure HDI, soft and hard combined HDI, multi-layer ceramic, special size, mixed copper base, metal cladding, high and low copper, buried, buried resistance, special process, special materials High-end (PCB, FPC) cir...
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