Jiangsu GIS Laser Technologies Inc.,
| Supply Ability | 30set per month |
| Delivery Time | 20 work days |
| Packaging Details | wooden case packing |
| Name | laser Direct Imaging (LDI) |
| Application | PCB HDI FPC |
| Exposure Size Max | 610*710mm |
| Line Width | 30μ |
| Line Line Distance | 10% |
| Line Width tolerance | 10% |
| Alignment Capability | 24μm |
| Laser Type | LD Laser, 405±5nm |
| Efficient | 30-40S@18"*24" |
| Deviation increase and decrease | Fixed increase and contracton, automatic increase and contraction, interval increase and contraction, partition alignment |
| File Format | Gerber 274X, ODB++ |
| Brand Name | GIS |
| Model Number | DPX230 |
| Certification | ISO 9001 CE |
| Place of Origin | Jiangsu, China |
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Product Specification
| Supply Ability | 30set per month | Delivery Time | 20 work days |
| Packaging Details | wooden case packing | Name | laser Direct Imaging (LDI) |
| Application | PCB HDI FPC | Exposure Size Max | 610*710mm |
| Line Width | 30μ | Line Line Distance | 10% |
| Line Width tolerance | 10% | Alignment Capability | 24μm |
| Laser Type | LD Laser, 405±5nm | Efficient | 30-40S@18"*24" |
| Deviation increase and decrease | Fixed increase and contracton, automatic increase and contraction, interval increase and contraction, partition alignment | File Format | Gerber 274X, ODB++ |
| Brand Name | GIS | Model Number | DPX230 |
| Certification | ISO 9001 CE | Place of Origin | Jiangsu, China |
| High Light | FPC laser direct imaging equipment ，FPC PCB laser direct imaging equipment ，FPC HDI laser direct imaging pcb | ||
laser direct imaging (LDI) system solutions HDI PCB
LDI is used for imaging requirements for HDI PCB mass production
In order to meet the requirements of HDI PCB mass production, the imaging method shall:
While achieving a low defect rate and high output, it can achieve the stable production of HDI PCB conventional high-precision operation. For example:
* Advanced mobile phone board, CSP pitch less than 0.5mm (with or without wires between BGA pads)
* The plate structure is 3 + N + 3, and there are stacked via hole.
In terms of imaging, such designs require a ring width of less than 75μm. In some cases, the ring width is even less than 50μm. Due to the alignment problem, these inevitably lead to low output. In addition, driven by miniaturization, the lines and spacing are becoming thinner and thinner - meeting this challenge requires changing the traditional imaging methods.
This can be done by reducing the panel size or use a shutter exposure machine for panel imaging in several steps (four or six). Both methods achieve better alignment by reducing the influence of material deformation. Changing the panel size leads to high material costs, and using the shutter exposure machine leads to low production every day. Neither method can completely solve the material deformation and reduce the defects related to the photographic film, including the actual deformation of the photographic film when printing batch boards.
PCB laser direct imaging (LDI)
When fabricating a circuit board, the circuit traces are defined by what is the imaging process. Laser direct imaging ( LDI ) exposes the traces directly with a highly focused laser beam that in NC controlled, instead of flooded light passing through a photo tool, a laser beam will digitally create the image.
How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.
| Specification/model | DPX230 |
| Application | PCB,HDI,FPC (inner layer,outer layer,anti-welding) |
| Resolution (mass production) | 30um |
| Capacity | 30-40S@18"*24" |
| Exposure Size | 610*710mm |
| Panel thickness | 0.05mm-3.5mm |
| Alignment Mode | UV-Mark |
| Alignment capability | Outer layer±12um；Inner laye±24um |
| Line width tolerance | ±10% |
| Deviation increase and decrease mode | Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment |
| Laser type | LD Laser,405±5nm |
| File format | Gerber 274X；ODB++ |
| Power | 380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10% |
| Condition | Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above; Vibration requirements to avoid violent vibration near the equipment |
About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Other
Total Annual:
>1000000
Employee Number:
>100
Ecer Certification：
Verified Supplier
Jiangsu GIS Laser Technologies Inc. (hereafter referred to as GIS Laser) is a subsidiary of GIS Tech Inc. which is a multinational company providing advanced intelligent solutions into the industries of New Energy, Semiconductor Packaging, Lithium Battery, PCB and Printing, with its incredible innov... Jiangsu GIS Laser Technologies Inc. (hereafter referred to as GIS Laser) is a subsidiary of GIS Tech Inc. which is a multinational company providing advanced intelligent solutions into the industries of New Energy, Semiconductor Packaging, Lithium Battery, PCB and Printing, with its incredible innov...
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