Supply Ability | 30set per month |
Delivery Time | 20 work days |
Packaging Details | wooden case packing |
Name | laser Direct Imaging (LDI) |
Application | PCB HDI FPC |
Exposure Size Max | 610*710mm |
Line Width | 30μ |
Line Line Distance | 10% |
Line Width tolerance | 10% |
Alignment Capability | 24μm |
Laser Type | LD Laser, 405±5nm |
Efficient | 30-40S@18"*24" |
Deviation increase and decrease | Fixed increase and contracton, automatic increase and contraction, interval increase and contraction, partition alignment |
File Format | Gerber 274X, ODB++ |
Brand Name | GIS |
Model Number | DPX230 |
Certification | ISO 9001 CE |
Place of Origin | Jiangsu, China |
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Product Specification
Supply Ability | 30set per month | Delivery Time | 20 work days |
Packaging Details | wooden case packing | Name | laser Direct Imaging (LDI) |
Application | PCB HDI FPC | Exposure Size Max | 610*710mm |
Line Width | 30μ | Line Line Distance | 10% |
Line Width tolerance | 10% | Alignment Capability | 24μm |
Laser Type | LD Laser, 405±5nm | Efficient | 30-40S@18"*24" |
Deviation increase and decrease | Fixed increase and contracton, automatic increase and contraction, interval increase and contraction, partition alignment | File Format | Gerber 274X, ODB++ |
Brand Name | GIS | Model Number | DPX230 |
Certification | ISO 9001 CE | Place of Origin | Jiangsu, China |
High Light | LD Laser HDI PCB ,710mm HDI PCB ,Three Phase ldi equipment |
laser direct imaging (LDI) system solutions HDI PCB
LDI for production summary
With the increasingly strict and precise alignment requirements, it is necessary to replace the traditional exposure methods. The latest developments in LDI technology, such as all requirements on mass production, can be achieved through LDI, including accuracy, output, automatic control, and traceability.
Although mass production of HDI boards requires high acquisition costs to purchase LDI equipment, the growing team of HDI manufacturers is now using the LDI system as the imaging method of the mass production line. The reason is simple: these manufacturers have confirmed that LDI has increased their production by at least 3% on some more complex HDI boards, and the result is that they can recover their investment within a year.
PCB laser direct imaging (LDI)
When fabricating a circuit board, the circuit traces are defined by what is the imaging process. Laser direct imaging ( LDI ) exposes the traces directly with a highly focused laser beam that in NC controlled, instead of flooded light passing through a photo tool, a laser beam will digitally create the image.
How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.
Specification/model | DPX230 |
Application | PCB,HDI,FPC (inner layer,outer layer,anti-welding) |
Resolution (mass production) | 30um |
Capacity | 30-40S@18"*24" |
Exposure Size | 610*710mm |
Panel thickness | 0.05mm-3.5mm |
Alignment Mode | UV-Mark |
Alignment capability | Outer layer±12um;Inner laye±24um |
Line width tolerance | ±10% |
Deviation increase and decrease mode | Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment |
Laser type | LD Laser,405±5nm |
File format | Gerber 274X;ODB++ |
Power | 380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10% |
Condition | Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above; Vibration requirements to avoid violent vibration near the equipment |
About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Other
Total Annual:
>1000000
Employee Number:
>100
Ecer Certification:
Verified Supplier
Jiangsu GIS Laser Technologies Inc. (hereafter referred to as GIS Laser) is a subsidiary of GIS Tech Inc. which is a multinational company providing advanced intelligent solutions into the industries of New Energy, Semiconductor Packaging, Lithium Battery, PCB and Printing, with its incredible innov... Jiangsu GIS Laser Technologies Inc. (hereafter referred to as GIS Laser) is a subsidiary of GIS Tech Inc. which is a multinational company providing advanced intelligent solutions into the industries of New Energy, Semiconductor Packaging, Lithium Battery, PCB and Printing, with its incredible innov...
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