50×60×40cm Material Polished Tester Multifunctional Fireproof

Product Specification

HZ-1728 Material Polished Tester

Equipment description:

HZ-1728 Material Polished Tester polished, worn thin or grind the required thickness of the specimen.

Polished Surface Tester
The utility model belongs to a detection device, in particular to a polished surface detector which can effectively detect tiny defects and contamination on a wafer surface or a wafer subsurface.
With the rapid development of microelectronics technology, the number of transistors integrated on semiconductor wafers is increasing. Scientists from Fairchild Semiconductor Corporation in the United States proposed decades ago that the number of transistors that can be fabricated on a certain area of ​​wafers The number will double every eighteen months. In the past two decades, the progress of integration has followed this law, and scientists predict that this law will still exist in the next ten to twenty years. Therefore, the area occupied by each transistor on the wafer becomes smaller and smaller. It is predicted that in the near future, each transistor will be composed of only a dozen or even fewer crystal atoms. This development trend has put forward stricter requirements for the development and production of semiconductor wafers. Small defects or contamination will seriously affect the performance of the device and even cause the device to fail. For the development and production of large-scale and ultra-large-scale integrated circuits, the first step is to reject wafers with small defects or contamination, otherwise the yield will be seriously affected. Therefore, the detection of micro-defects and contamination on the surface or subsurface of the mechanochemically polished wafer is gradually becoming one of the key technologies related to the quality of the polished wafer of semiconductor materials and the yield of the device manufacturing. Unfortunately, there is currently no device that can effectively detect microscopic defects and contamination on the wafer surface or subsurface.
The purpose of this utility model is to provide a polishing surface detector, which can accurately display the topography of the surface and the subsurface of the polishing surface on a suitable medium in the form of a visual image, and at the same time the surface and subsurface inherent , due to processing and environmental defects appear in the image. The materials it can detect generally include metals, semiconductor materials and other solid substances with similar properties.
As conceived above, the technical scheme of the present utility model is: a polished surface detector, which is characterized in that it is composed of a chassis, a control device, a light source device placed in the chassis, a sample conveying device, an imaging screen, and a camera device; wherein the sample conveying device is composed of The device is connected with the sample conveying control circuit; the imaging device is connected with the imaging control circuit; the control circuit includes an amplification, focal length, aperture control circuit and a translation stage control circuit; the input ends of the above control circuits are all connected with the output of the control device in the control device End connection: The output end of the camera device is connected to the input end of the monitor.

Technical parameters: