JOPTEC LASER CO., LTD
| Payment Terms | T/T |
| Supply Ability | 5000000 PCS/Month |
| Delivery Time | 30 Days |
| Packaging Details | Boxes |
| Product | Micro channel heat sink |
| Size | 27.00 x 10.80 x 1.50 mm |
| Flatness of chip mounting area | ≤ 2 um |
| Roughness of chip mounting area | ≤ 0.3 um |
| Plating thickness | Au (0.05-0.15um) |
| Water flow | ≥ 300ml/min |
| Brand Name | JOPTEC |
| Place of Origin | HEFEI, CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000000 PCS/Month |
| Delivery Time | 30 Days | Packaging Details | Boxes |
| Product | Micro channel heat sink | Size | 27.00 x 10.80 x 1.50 mm |
| Flatness of chip mounting area | ≤ 2 um | Roughness of chip mounting area | ≤ 0.3 um |
| Plating thickness | Au (0.05-0.15um) | Water flow | ≥ 300ml/min |
| Brand Name | JOPTEC | Place of Origin | HEFEI, CHINA |
| High Light | Laser Hermetic heatsink ，ceramic laser diode hermetic package | ||
Technical characteristics:
Product: Micro channel heat sink
Size: 27.00 x 10.80 x 1.50 mm
Flatness of chip mounting area: ≤ 2 um
Roughness of chip mounting area: ≤ 0.3 um
Plating thickness: Ni (2-5um)
Au (0.05-0.15um)
Water flow: ≥ 300ml/min
High thermal conductivity aluminum nitride ceramic heat sink
Type of ceramic: Aluminum Nitride AlN
Thermal conductivity: 200 W/m.K
Roughness of metallized area: Ra 0.5um Max
Flatness of metallized area: 5um Max
Copper thickness accuracy: 75±10 um
Preset gold tin solder: Au (75±5wt%) Sn
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler
Year Established:
1988
Total Annual:
50000000-100000000
Employee Number:
500~1000
Ecer Certification：
Verified Supplier
Founded in 1988 in Hefei, JOPTEC is a global leader in R&D and manufacturing of hermetic metal-glass packages for hybrid integrated circuits, high power laser, optical communication, infrared detector and other optoelectronic devices. With the continuous investment in new technologies and facili... Founded in 1988 in Hefei, JOPTEC is a global leader in R&D and manufacturing of hermetic metal-glass packages for hybrid integrated circuits, high power laser, optical communication, infrared detector and other optoelectronic devices. With the continuous investment in new technologies and facili...
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