Payment Terms | T/T |
Supply Ability | 5000000 PCS/Month |
Delivery Time | 30 Days |
Packaging Details | Boxes |
Base material | Low carbon steel, Kovar ceramic, tungsten copper |
Lead material | Kovar, Kovar copper, copper alloy |
Thermal conductivity of base plate | >150W/m.K |
Air tightness | ≤1x10-3Pa.cm3/s (He) |
Plating | Ni/Au |
Reliability | Meets MIL-883 requirements |
Brand Name | JOPTEC |
Place of Origin | HEFEI, CHINA |
View Detail Information
Explore similar products
TO8 Header Encapsulated Components Transistor Outline Package
Diode Component Module Fenico Optical Sensor Package
Wire Bond Surface Coining Base Transistor Outline Package
FeNiCo Shell Robust 8pin To Transistor Packages Header
Product Specification
Payment Terms | T/T | Supply Ability | 5000000 PCS/Month |
Delivery Time | 30 Days | Packaging Details | Boxes |
Base material | Low carbon steel, Kovar ceramic, tungsten copper | Lead material | Kovar, Kovar copper, copper alloy |
Thermal conductivity of base plate | >150W/m.K | Air tightness | ≤1x10-3Pa.cm3/s (He) |
Plating | Ni/Au | Reliability | Meets MIL-883 requirements |
Brand Name | JOPTEC | Place of Origin | HEFEI, CHINA |
High Light | Glass Automobiles SMD Outline Package ,joptec SMD Transistor Outline Package ,JEDE SMD Outline Package |
Product name: TO and SMD type packages for transistor device
Applications: automatic control of machinery and electrical appliances in the fields of home appliances, automobiles, ships, motor cars, power electronics, etc.
Product characteristics: The external dimensions meet the JEDE standard, and the glass or ceramic air-tight connection is used. It is suitable for insertion and surface mounting. Parallel seam welding or energy storage welding can be used for cover (cap) sealing , the surface is nickel-plated and gold-plated, differential plating areas, differential gold and nickel plating thickness, good heat dissipation, good hermeticity and high reliability.
Technical characteristics
Base material: Low carbon steel, Kovar ceramic, tungsten copper, etc.
Lead material: Kovar, Kovar copper, copper alloy, etc.
Thermal conductivity of base plate: >150W/m.K
Air tightness: ≤1x10-3Pa.cm3/s (He)
Plating: Ni/Au
Reliability: Meets MIL-883 requirements
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler
Year Established:
1988
Total Annual:
50000000-100000000
Employee Number:
500~1000
Ecer Certification:
Verified Supplier
Founded in 1988 in Hefei, JOPTEC is a global leader in R&D and manufacturing of hermetic metal-glass packages for hybrid integrated circuits, high power laser, optical communication, infrared detector and other optoelectronic devices. With the continuous investment in new technologies and facili... Founded in 1988 in Hefei, JOPTEC is a global leader in R&D and manufacturing of hermetic metal-glass packages for hybrid integrated circuits, high power laser, optical communication, infrared detector and other optoelectronic devices. With the continuous investment in new technologies and facili...
Get in touch with us
Leave a Message, we will call you back quickly!