JOPTEC LASER CO., LTD
| Payment Terms | T/T |
| Supply Ability | 5000000 PCS/Month |
| Delivery Time | 30 Days |
| Packaging Details | Boxes |
| Eyelet and pin Finish | Ni 1.3-8.9um and plated Au≥0.3um |
| Eyelet | Kovar |
| The brazing ring | HLAgCu28 |
| Shell adopt material | FeNiCo,FeNi42 or CRS |
| shape of pi | cyclinder |
| Brand Name | JOPTEC |
| Place of Origin | HEFEI, CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000000 PCS/Month |
| Delivery Time | 30 Days | Packaging Details | Boxes |
| Eyelet and pin Finish | Ni 1.3-8.9um and plated Au≥0.3um | Eyelet | Kovar |
| The brazing ring | HLAgCu28 | Shell adopt material | FeNiCo,FeNi42 or CRS |
| shape of pi | cyclinder | Brand Name | JOPTEC |
| Place of Origin | HEFEI, CHINA | ||
| High Light | fenico header ，optical sensor hermetic header ，laser diode package header | ||
| Product Name | optical sensor package diode component module package |
| Finish: Eyelet and pins are plated Ni:1.3-8.9um and plated Au≥0.3um |
| Insulation Resistance:500V DC Resistance between two pins ≥1*1010Ω |
| Hermeticity:Leak rate≤1*10-3Pa.cm3/s |
| 1. Eyelet | Kovar | Kovar |
| 2. Pin1 | Kovar | Kovar |
| 3. Pin2 | Kovar | Kovar |
| 4. Glass insulators | BH-A/K | BH-A/K |
| 5. Pin3 | Kovar | -- |
| 6. The brazing ring | HLAgCu28 | -- |
| Product features |
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Company Details
Business Type:
Manufacturer,Distributor/Wholesaler
Year Established:
1988
Total Annual:
50000000-100000000
Employee Number:
500~1000
Ecer Certification：
Verified Supplier
Founded in 1988 in Hefei, JOPTEC is a global leader in R&D and manufacturing of hermetic metal-glass packages for hybrid integrated circuits, high power laser, optical communication, infrared detector and other optoelectronic devices. With the continuous investment in new technologies and facili... Founded in 1988 in Hefei, JOPTEC is a global leader in R&D and manufacturing of hermetic metal-glass packages for hybrid integrated circuits, high power laser, optical communication, infrared detector and other optoelectronic devices. With the continuous investment in new technologies and facili...
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