Payment Terms | T/T |
Supply Ability | 5000000 PCS/Month |
Delivery Time | 30 Days |
Packaging Details | Boxes |
bottom | CS1010 |
lead | oxgyen free copper |
lead 2 | copper cored alloy |
insulator | Al2O3 |
Plating coating | shell and lead plating Ni 3-11.43um |
Leak rate | <=1*10-3 Pa*cm3/s |
Insulation resistance | 500V DC |
Brand Name | JOPTEC |
Place of Origin | HEFEI, CHINA |
View Detail Information
Explore similar products
Extended Bottom Brazing Hybrid Integrated Circuit Package
Gold Plating SMD Ceramic Hybrid Integrated Circuit Package
Hermetic Hybrid Integrated Circuit Package
Product Specification
Payment Terms | T/T | Supply Ability | 5000000 PCS/Month |
Delivery Time | 30 Days | Packaging Details | Boxes |
bottom | CS1010 | lead | oxgyen free copper |
lead 2 | copper cored alloy | insulator | Al2O3 |
Plating coating | shell and lead plating Ni 3-11.43um | Leak rate | <=1*10-3 Pa*cm3/s |
Insulation resistance | 500V DC | Brand Name | JOPTEC |
Place of Origin | HEFEI, CHINA | ||
High Light | CRS1010 housing Integrated Circuit Package ,parallel sealing cap GJB548 hermetic package ,Ceramic Al2O3 Integrated Circuit Package |
Product name: | High quality Customized Ceramic To Metal Sealing Package | |
Product formation | Material | Quantity |
bottom | CS1010 | 1 |
lead1 | oxgyen free copper | 4 |
lead 2 | copper cored alloy | 8 |
insulator | Al2O3 | 12 |
Plating coating: | Coating: shell and lead plating Ni:3-11.43um, lead plating Au>=1.3um. | |
Hermeticity: | Leak rate <=1*10-3 Pa*cm3/s. | |
Insulation resistance: | 500V DC, Insulation resistance between a single glass closure lead and the shell≥1*1010Ω | |
Product features: | 1.Housing material adopts CRS1010 which has good heat dissipation. | |
2.The pin material adopts Cupper cored alloy which has low resistance that can load high voltage. | ||
3.The method of sealing cap is parallel sealing welding. | ||
4.The pin cross bottom or sidewall which can be designed according to customers' needs. | ||
5.The position of ground lead can be designed according to customers' needs. | ||
6.The design of lid fits the dimension of package. | ||
7.Customers could choose fully plating or selective plating. | ||
8.All index of parameter conform to requirement of GJB548 |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler
Year Established:
1988
Total Annual:
50000000-100000000
Employee Number:
500~1000
Ecer Certification:
Verified Supplier
Founded in 1988 in Hefei, JOPTEC is a global leader in R&D and manufacturing of hermetic metal-glass packages for hybrid integrated circuits, high power laser, optical communication, infrared detector and other optoelectronic devices. With the continuous investment in new technologies and facili... Founded in 1988 in Hefei, JOPTEC is a global leader in R&D and manufacturing of hermetic metal-glass packages for hybrid integrated circuits, high power laser, optical communication, infrared detector and other optoelectronic devices. With the continuous investment in new technologies and facili...
Get in touch with us
Leave a Message, we will call you back quickly!