Payment Terms | T/T |
Supply Ability | 5000000 PCS/Month |
Delivery Time | 30 Days |
Packaging Details | Boxes |
Finish | plated Ni 1-11.43um |
Insulation Resistance | 500V DC resistance |
Hermeticity | Leak rate≤1*10-3Pa.cm3/s |
Frame | Kovar(ASTM-F15) |
Glass insulator | BH-A/K |
Lead Frame | Kovar(4J29) |
The brazing frame | HLAgCu28 |
Brand Name | JOPTEC |
Place of Origin | HEFEI, CHINA |
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Product Specification
Payment Terms | T/T | Supply Ability | 5000000 PCS/Month |
Delivery Time | 30 Days | Packaging Details | Boxes |
Finish | plated Ni 1-11.43um | Insulation Resistance | 500V DC resistance |
Hermeticity | Leak rate≤1*10-3Pa.cm3/s | Frame | Kovar(ASTM-F15) |
Glass insulator | BH-A/K | Lead Frame | Kovar(4J29) |
The brazing frame | HLAgCu28 | Brand Name | JOPTEC |
Place of Origin | HEFEI, CHINA | ||
High Light | butterfly Flat metal hermetic package ,HIC Butterfly hermetic seal ,Multi Piece Flatpack hermetic package |
Product Name | Multi-piece flatpack butterfly metal package for HIC custom hermetic package |
Product Model | JOPTEC |
Finish: Shell and pins are plated Ni 1-11.43um and plated Au≥1.0um |
Insulation Resistance:500V DC resistance between single glass sealed pin and shell≥1*1010Ω |
Hermeticity: Leak rate≤1*10-3Pa.cm3/s |
Material: |
1 | Frame | Kovar(ASTM-F15) |
2 | Glass insulator | BH-A/K |
3 | Lead Frame | Kovar(4J29) |
4 | The brazing frame | HLAgCu28 |
5 | Base | Kovar(FeNiCo) |
6 | Cover | 42alloy |
Product Features |
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Company Details
Business Type:
Manufacturer,Distributor/Wholesaler
Year Established:
1988
Total Annual:
50000000-100000000
Employee Number:
500~1000
Ecer Certification:
Verified Supplier
Founded in 1988 in Hefei, JOPTEC is a global leader in R&D and manufacturing of hermetic metal-glass packages for hybrid integrated circuits, high power laser, optical communication, infrared detector and other optoelectronic devices. With the continuous investment in new technologies and facili... Founded in 1988 in Hefei, JOPTEC is a global leader in R&D and manufacturing of hermetic metal-glass packages for hybrid integrated circuits, high power laser, optical communication, infrared detector and other optoelectronic devices. With the continuous investment in new technologies and facili...
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