JOPTEC LASER CO., LTD
| Payment Terms | T/T |
| Supply Ability | 5000000 PCS/Month |
| Delivery Time | 30 Days |
| Packaging Details | Boxes |
| Base | Wu80Cu20 |
| Frame | 4J29 |
| Pin | 4J29 |
| Glass Insulator | BH-A/K |
| Brazing ring frame | HlAgCu |
| Tube | 4J29 |
| Brazing ring | HlAgCu |
| Brand Name | JOPTEC |
| Place of Origin | HEFEI, CHINA |
View Detail Information
Explore similar products
500V DC Resistance Platform Plugin Hermetic Seal Metal Packages
GJB548 Parallel Sealing Cap Flatpack Hermetic Packages
Robust Iron Nickel Cobalt Kovar Flatpack Electronic Packages
Ceramic To Metal Customized Hermetically Sealed Electronic Packages
Product Specification
| Payment Terms | T/T | Supply Ability | 5000000 PCS/Month |
| Delivery Time | 30 Days | Packaging Details | Boxes |
| Base | Wu80Cu20 | Frame | 4J29 |
| Pin | 4J29 | Glass Insulator | BH-A/K |
| Brazing ring frame | HlAgCu | Tube | 4J29 |
| Brazing ring | HlAgCu | Brand Name | JOPTEC |
| Place of Origin | HEFEI, CHINA | ||
| High Light | JOPTEC Hermetic Glass To Metal Seal ，4J29 pin hermetically sealed packaging ，Parallel Fiber Optic Hermetic Compression Seal | ||
| Product Name | Flat Stock With Leads Parallel To The Substrate Mounting Surface Glass-To-Metal Seals | |
| Product Model | JOPTEC | |
| Plating Coating | Fully plating Au or selective plating Au | |
| Finsih | Shell,pins and lid are plated Ni:1.3~1.43um and Shell and pins are plated Au ≥0.75um;Lid is plated Au ≥0.6um | |
| Product Formation | Material | Quantity |
| 1 Base | Wu80Cu20 | 1 |
| 2. Frame | 4J29 | 1 |
| 3. Pin | 4J29 | 6 |
| 4. Glass Insulator | BH-A/K | 6 |
| 5. Brazing ring frame | HlAgCu | 1 |
| 6. Tube | 4J29 | 1 |
| 7. Brazing ring | HlAgCu | 1 |
| 8. Lid | 4J42 | 1 |
| Insulation Resistance | 500V DC resistance between single pin and shell is ≥1*10^10Ω | |
| Hermeticity | Leak rate is ≤1*10^-3Pa.cm^3/s | |
| Product Features | 1. Fiber optic packages have different structures include optical port ; | |
| 2. The material of housing are different and are adopted by different features of packages. | ||
| 3. The sections of pin are rectangular or cyclinder. | ||
| 4. The pin cross bottom or sidewall whose rank accord to customers' needs | ||
| 5. The sealing cap or lid method adopts proper technique according to structure of packages. | ||
| 6 .Finish could adopt fully plating or lead selective plating. | ||
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler
Year Established:
1988
Total Annual:
50000000-100000000
Employee Number:
500~1000
Ecer Certification：
Verified Supplier
Founded in 1988 in Hefei, JOPTEC is a global leader in R&D and manufacturing of hermetic metal-glass packages for hybrid integrated circuits, high power laser, optical communication, infrared detector and other optoelectronic devices. With the continuous investment in new technologies and facili... Founded in 1988 in Hefei, JOPTEC is a global leader in R&D and manufacturing of hermetic metal-glass packages for hybrid integrated circuits, high power laser, optical communication, infrared detector and other optoelectronic devices. With the continuous investment in new technologies and facili...
Get in touch with us
Leave a Message, we will call you back quickly!