JOPTEC LASER CO., LTD
Products
Manufacturer of a wide range of products which include Pump Hermetic High Power Laser Package,Gold Plating SMD Ceramic Hybrid Integrated Circuit Package,Ceramic Metal Insulator Al2O3 Hybrid Integrated Circuit Package,etc
MOQ: 50 PCS
Price:
| Payment Terms | T/T |
| Supply Ability | 5000000 PCS/Month |
| Delivery Time | 30 Days |
| Packaging Details | Boxes |
| Application field | Pump laser package |
| Lead welding method | tin welding, gold wire bonding |
| Nickel layer thickness | >3μm |
| Gold layer thickness | >0.45μm |
| Hermeticity | leak rate ≤≤1x10-3Pa.cm3/s (He) |
| Insulation resistance | ≥1000MΩ (DC500V) |
| Pin current | 16A(φ1.5mm), 10A(φ1mm) |
| Base | copper |
| Lead | Kovar alloy, iron-nickel alloy, copper core composite |
| Insulator | DM308 or similar, iron sealed glass beads, ceramic |
| Brand Name | JOPTEC |
| Place of Origin | HEFEI, CHINA |
MOQ: 50 PCS
Price:
| Payment Terms | T/T |
| Supply Ability | 5000000 PCS/Month |
| Delivery Time | 30 Days |
| Packaging Details | Boxes |
| Types of Ceramic | Aluminum Nitride AlN |
| Flatness of chip mounting area | ≤ 2 um |
| Roughness of chip mounting area | ≤ 0.3 um |
| Plating thickness | Ni (2-5um) |
| Water flow | ≥ 300ml/min |
| Brand Name | JOPTEC |
| Place of Origin | HEFEI, CHINA |
MOQ: 50 PCS
Price:
| Payment Terms | T/T |
| Supply Ability | 5000000 PCS/Month |
| Delivery Time | 30 Days |
| Packaging Details | Boxes |
| bottom | CS1010 |
| lead | oxgyen free copper |
| lead 2 | copper cored alloy |
| insulator | Al2O3 |
| Plating coating | shell and lead plating Ni 3-11.43um |
| Leak rate | <=1*10-3 Pa*cm3/s |
| Insulation resistance | 500V DC |
| Brand Name | JOPTEC |
| Place of Origin | HEFEI, CHINA |
MOQ: 50 PCS
Price:
| Payment Terms | T/T |
| Supply Ability | 5000000 PCS/Month |
| Delivery Time | 30 Days |
| Packaging Details | Boxes |
| Application field | Pump laser package |
| Lead welding method | tin welding, gold wire bonding |
| Nickel layer thickness | >3μm |
| Gold layer thickness | >0.45μm |
| Hermeticity | leak rate ≤≤1x10-3Pa.cm3/s (He) |
| Insulation resistance | ≥1000MΩ (DC500V) |
| Pin current | 16A(φ1.5mm), 10A(φ1mm) |
| Base | copper |
| Lead | Kovar alloy, iron-nickel alloy, copper core composite |
| Insulator | DM308 or similar, iron sealed glass beads, ceramic |
| Brand Name | JOPTEC |
| Place of Origin | HEFEI, CHINA |
MOQ: 50 PCS
Price:
| Payment Terms | T/T |
| Supply Ability | 5000000 PCS/Month |
| Delivery Time | 30 Days |
| Packaging Details | Boxes |
| Finish | Fully plating Au or selective plating Au |
| Plating | Package is plated Ni:3~11.43um and Au ≥0.8um Pins are plated Au ≥1.3um ;Lid is plated Au ≥0.8um |
| Cover plate | 4J42(42alloy) |
| Insulators | BH-G/K |
| Lead | 4J29(Kovar) |
| Cavity | 4J29(Kovar) |
| Insulation Resistance | 500V DC resistance between single pin and shell is ≥1*1010Ω |
| Hermeticity | Leak rate is ≤1*10-3Pa.cm/s |
| Brand Name | JOPTEC |
| Place of Origin | HEFEI, CHINA |
MOQ: 50 PCS
Price:
| Payment Terms | T/T |
| Supply Ability | 5000000 PCS/Month |
| Delivery Time | 30 Days |
| Packaging Details | Boxes |
| Product | Micro channel heat sink |
| Size | 27.00 x 10.80 x 1.50 mm |
| Flatness of chip mounting area | ≤ 2 um |
| Roughness of chip mounting area | ≤ 0.3 um |
| Plating thickness | Au (0.05-0.15um) |
| Water flow | ≥ 300ml/min |
| Brand Name | JOPTEC |
| Place of Origin | HEFEI, CHINA |
MOQ: 50 PCS
Price:
| Payment Terms | T/T |
| Supply Ability | 5000000 PCS/Month |
| Delivery Time | 30 Days |
| Packaging Details | Boxes |
| Application field | pump laser package |
| Lead welding method | tin welding, gold wire bonding |
| Nickel layer thickness | >3μm |
| Gold layer thickness | >0.45μm |
| Hermeticity | leak rate ≤1x10-3Pa.cm3/s (He) |
| Insulation resistance | ≥1000MΩ (DC500V) |
| Pin current | 16A(φ1.5mm), 10A(φ1mm) |
| Insulator | DM308 or similar, iron sealed glass beads, ceramic |
| Brand Name | JOPTEC |
| Place of Origin | HEFEI, CHINA |
MOQ: 50 PCS
Price:
| Payment Terms | T/T |
| Supply Ability | 5000000 PCS/Month |
| Delivery Time | 30 Days |
| Packaging Details | Boxes |
| Application field | Pump laser package |
| Lead welding method | tin welding, gold wire bonding |
| Nickel layer thickness | >3μm |
| Gold layer thickness | >0.45μm |
| Hermeticity | leak rate ≤≤1x10-3Pa.cm3/s (He) |
| Insulation resistance | ≥1000MΩ (DC500V) |
| Pin current | 16A(φ1.5mm), 10A(φ1mm) |
| Base | copper |
| Lead | Kovar alloy, iron-nickel alloy, copper core composite |
| Insulator | DM308 or similar, iron sealed glass beads, ceramic |
| Brand Name | JOPTEC |
| Place of Origin | HEFEI, CHINA |
MOQ: 50 PCS
Price:
| Payment Terms | T/T |
| Supply Ability | 5000000 PCS/Month |
| Delivery Time | 30 Days |
| Packaging Details | Boxes |
| Application field | Pump laser package |
| Lead welding method | tin welding, gold wire bonding |
| Nickel layer thickness | >3μm |
| Gold layer thickness | >0.45μm |
| Hermeticity | leak rate ≤≤1x10-3Pa.cm3/s (He) |
| Insulation resistance | ≥1000MΩ (DC500V) |
| Pin current | 16A(φ1.5mm), 10A(φ1mm) |
| Base | copper |
| Lead | Kovar alloy, iron-nickel alloy, copper core composite |
| Insulator | DM308 or similar, iron sealed glass beads, ceramic |
| Brand Name | JOPTEC |
| Place of Origin | HEFEI, CHINA |
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