Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | 100PCS/Day |
| Delivery Time | 2~3 Weeks |
| Packaging Details | 4~10pcs/carton (According to the customer demand） |
| Size | 8 Inch |
| Capacity | 25 wafers |
| Surface Finish | Polished |
| Uv Resistance | Yes |
| Temperature | Up to 350°C |
| Application | Semiconductor industry |
| Brand Name | Hiner-pack |
| Model Number | HN24722 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | Made In China |
View Detail Information
Explore similar products
Storage And Transportation During Wafer Manufacturing 6 inch Metal Wafer Carrier
Aluminum Alloy Metal Wafer Cassette Used In The Production And Processing Of
6 Inch 5 Solts Semiconductor Wafer Carrier For Inspection And Transportation In
Groove Type CNC Precision Machining Wafer Frame Box For Plasma Cleaning
Product Specification
| Payment Terms | T/T | Supply Ability | 100PCS/Day |
| Delivery Time | 2~3 Weeks | Packaging Details | 4~10pcs/carton (According to the customer demand） |
| Size | 8 Inch | Capacity | 25 wafers |
| Surface Finish | Polished | Uv Resistance | Yes |
| Temperature | Up to 350°C | Application | Semiconductor industry |
| Brand Name | Hiner-pack | Model Number | HN24722 |
| Certification | ISO 9001 ROHS SGS | Place of Origin | Made In China |
| High Light | 8 Inch Metal Wafer Cassette ，Semiconductor Packaging Metal Wafer Cassette ，25 Slot Metal Wafer Cassette | ||
8 Inch 25 Slot Visual Metal Wafer Cassette Used In Semiconductor Packaging Technology Industry
1.Product Description:
(1)Aluminum with wear-resistant, smooth hard-coating
(2)Heat-resistant up to 350°C (Al)
(3)Smooth slot-entry and -shape vacuum vented screws
(4)Design according to Semiconductor industry standard
2.Applications:
1. In a thermal process environment, wafers are processed in a cassette at temperatures in excess of 110° F (43° C), the upper limit of the typical structural threshold for plastic process cassettes.
This includes Chemical Vapor Deposition (CVD), Rapid Thermal Processing (RTP), and wafer annealing applications.
Bakeout - Long-term thermal bakeout applications where wafers need to be left in the oven for multiple days.
2. Process equipment where the wafer insertion temperature (wafer removed from the process tool) exceeds the melting point of the plastic case.
The need for higher throughput reduces the time for wafers to cool and acclimatize in the chamber.
3. Internal Environment Cassettes - Cluster tool automation environments where cassettes are idle in a heated vacuum environment (chamber) for multiple process steps.
4. Precision Carrier Requirements - Automated environments in moderate heat require dimensional accuracy that plastic cassettes cannot provide.
Thin Wafer Handling - During thin wafer handling, sharp thin wafers cut into the plastic case. Thick Wafer - Bonding or thick wafer applications where industry standard plastic cassettes cannot be used due to slot size.
Customization is available upon request.
Custom configurations are available (minimum order quantities may apply): EN electroless nickel plating on aluminum profiles for high vacuum applications; flat profile slotting for thin or thick wafers; end wall retaining handles; and dual h-bar configurations for backside wafer processing.
| Product Name | 8 inch 25 Slot |
| Product Size | 288(L)*276(W)*205(H)mm |
| Capacity | 25PCS |
| Component Material | 6061 Aluminum Plate |
| Starting position | 12.5 mm |
| Slot distance | 6.34 mm |
(1) Weight limitations.
The total weight of a single package should not exceed 25 kg.
Convenient for loading and unloading, meet the loading capacity of different means of transportation.
(2) Size specification.
Carton size should be less than 1.5 cubic meters.
Plastic cardboard, steel drums and other dimensions according to the actual size of the goods to determine
Ensure that the packaging can be loaded smoothly into the container, aircraft cargo cabin, etc.
(3) Documentation management.
Prepare bill of lading, invoice, packing list and other necessary documents.
Documentary information is complete and accurate, consistent with the actual goods.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
Get in touch with us
Leave a Message, we will call you back quickly!