Shenzhen Hiner Technology Co.,LTD
| Packaging Details | 70~100pcs/carton(According to the customer demand） |
| Delivery Time | Mold：About 25 Days / Product：7~10 Days |
| Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day |
| Type | BGA IC |
| Stackable | Yes |
| Material | MPPO.PPE.ABS.PEI.IDP |
| Hs Code | 39239000 |
| Custom | Support |
| Overall dimension*2 | 322.6x135.9x7.62mm |
| Pocket Size | 16.8*20*1.37mm |
| Resistance | 1.0x10e4-1.0x10e11Ω |
| Brand Name | Hiner-pack |
| Model Number | HN23109 |
| Place of Origin | SHENZHEN CN |
| Certification | ISO 9001 ROHS SGS |
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Product Specification
| Packaging Details | 70~100pcs/carton(According to the customer demand） | Delivery Time | Mold：About 25 Days / Product：7~10 Days |
| Payment Terms | 100% Prepayment | Supply Ability | 2000PCS/Day |
| Type | BGA IC | Stackable | Yes |
| Material | MPPO.PPE.ABS.PEI.IDP | Hs Code | 39239000 |
| Custom | Support | Overall dimension*2 | 322.6x135.9x7.62mm |
| Pocket Size | 16.8*20*1.37mm | Resistance | 1.0x10e4-1.0x10e11Ω |
| Brand Name | Hiner-pack | Model Number | HN23109 |
| Place of Origin | SHENZHEN CN | Certification | ISO 9001 ROHS SGS |
| High Light | Custom Jedec Trays ，Stackable Custom Jedec Trays ，Various Materials Custom Jedec Trays | ||
| HN PN. | Description | External Size/mm | Pocket Size/mm | Matrix QTY |
| HN23109 | BGA 16.8X20 | 322.6x135.9x7.62 | 16.8*20*1.37 | 5X13=65PCS |
| TYPE | Brand | Flatness | Resistance | Service |
| BGA IC | Hiner-pack | MAX 0.76mm | 1.0x10e4-1.0x10e11Ω | Accept OEM,ODM |
The trays are stackable and have been designed to facilitate efficient storage and transportation. This particular feature aids in maximizing the utilization of space in shipping and storage surroundings.
Many JEDEC trays come with ventilation holes or slots that allow for proper airflow. This feature is essential in preventing heat buildup during transportation, particularly for components that may be susceptible to temperature changes.
Customizability:
While there are standard designs for JEDEC trays, some manufacturers may offer customized trays to accommodate specific device shapes or sizes. This customizability allows manufacturers to create packaging that is tailored to the needs of their products, ensuring a secure and well-fitting package. Customers can work with manufacturers to create trays that are suitable for a wide range of devices, from small chips to larger modules.
The standard JEDEC TRAY structure and shape meets international standards and is designed to fulfill a variety of functions including carrying electronic components and packaging ICs. Additionally, the tray is designed to meet requirements of automated feeding systems and match automation equipment, leading to easy loading and efficient work.
Hiner-pack specializes in providing 100% customized JEDEC TRAY solutions that protects your ICs based on the type of chip package. Our website showcases various JEDEC TRAY designs made specifically to fit many types of packaging including BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, etc. We can provide effective design solutions and wafer-level package protection for your products.
Applications
JEDEC trays are extensively employed in the semiconductor industry for various purposes such as:
This wide range of applications highlights the versatility of JEDEC trays. They are specifically designed to enable the smooth and secure handling of delicate electronic components. The trays conform to industry standards and make it possible to transport ICs and other electronic devices safely. This is a critical requirement for the semiconductor industry, where damage to such sensitive components can result in significant financial losses.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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