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China factory - Shenzhen Hiner Technology Co.,LTD

Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
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China ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC
China ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC

  1. China ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC
  2. China ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC
  3. China ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC

ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC

  1. MOQ: 1000 pcs
  2. Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
  3. Get Latest Price
Payment Terms T/T
Supply Ability 3800PCS~4000PCS/per day
Delivery Time 5~8 working days
Packaging Details It depends on the QTY of order and size of product
Material ABS.PC.PPE.MPPO...etc
Color Black.Red.Yellow.Green.White..etc
Property ESD,Non-ESD
Design Standard and Non-standard
Use Transport,Storage,Packing
Surface Resistance 1.0x10E4~1.0x10E11Ω
Clean class General And Ultrasonic Cleaning
Molding Method Injection Moulding
Brand Name Hiner-pack
Model Number 3 Inch Series
Certification ISO 9001 ROHS SGS
Place of Origin Made In China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 3800PCS~4000PCS/per day
Delivery Time 5~8 working days Packaging Details It depends on the QTY of order and size of product
Material ABS.PC.PPE.MPPO...etc Color Black.Red.Yellow.Green.White..etc
Property ESD,Non-ESD Design Standard and Non-standard
Use Transport,Storage,Packing Surface Resistance 1.0x10E4~1.0x10E11Ω
Clean class General And Ultrasonic Cleaning Molding Method Injection Moulding
Brand Name Hiner-pack Model Number 3 Inch Series
Certification ISO 9001 ROHS SGS Place of Origin Made In China
High Light ODM Bare Die TraysCSP Bare Die TraysCSP Chip Scale Package Trays

ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC

 

Factory Customized 3-Inch Anti-Static Tray To Load The Bar In Chip Level Package

 

 

Hiner-pack supplies a wide range of Matrix trays and shipping IC trays for safely storing and transporting IC (Integrated Circuits), other components and modules.

 

IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP).
 
Laser Bar or Touch Bar and other products are light and brittle, and it is easy to cause oxidation or damage due to improper operation. Under the fully automated operating system, there are strict requirements on packaging materials and boxes. The anti-static trays produced not only need to fully protect the products, but also need to deal with debugging such as the turnover of automatic equipment.At the same time in the process of transportation and transit also have high requirements, our company has accumulated a lot of experience in the production of such products, can fully respond to the diversified needs of customers, to provide set design.One - stop packaging solution production

 

 

Advantages


1. Light weight, saving transportation and packaging costs;
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine;
3. Good anti-static performance, effectively ensure that the product is not damaged by anti-static release;
4. High temperature resistance, suitable for high temperature automation equipment assembly;
5. Corrosion resistance, suitable for all kinds of production conditions of products;
6. Matrix arrangement design, under the premise of protecting the product, the most dozen capacity design, cost saving;
7. Edge chamfer design, effectively prevent stacking error, correct the direction of placement

 

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products
Usage Packaging of Electronic Components,Optical device,
Feature ESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly
Material MPPO.PPE.ABS.PEI.IDP...etc
Color Black.Red.Yellow.Green.White and custom color
Size Customized size, rectangle,circle shape
Mold type Injection Mold
Design Original sample or we can create the designs
Packing By Carton
Sample Sample time: after draft confirmed and payment arranged
Sample charge: 1. Free for stock samples
2. Custom Tray negotiated
Lead Time 5-7 Working days
The exact time should according to the ordered quantity

 

Product Application

 

Wafer Die / Bar / Chips                     PCBA module component

Electronic component packaging      Optical device packaging

 


Packaging


Packaging Details:Packing according to customer's specified size

FAQ

 

Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN
  • https://www.jedecictrays.com/

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