Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | The capacity is between 2500PCS~3000PCS/per day |
| Delivery Time | 5~8 working days |
| Packaging Details | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm |
| Material | PPE |
| Color | Black |
| Temperature | 150°C |
| Property | ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω |
| Flatness | less than 0.76mm |
| Clean Class | General and ultrasonic cleaning |
| Incoterms | EXW,FOB,CIF,DDU,DDP |
| Brand Name | Hiner-pack |
| Model Number | HN1809 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | Made In China |
View Detail Information
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Product Specification
| Payment Terms | T/T | Supply Ability | The capacity is between 2500PCS~3000PCS/per day |
| Delivery Time | 5~8 working days | Packaging Details | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm |
| Material | PPE | Color | Black |
| Temperature | 150°C | Property | ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω | Flatness | less than 0.76mm |
| Clean Class | General and ultrasonic cleaning | Incoterms | EXW,FOB,CIF,DDU,DDP |
| Brand Name | Hiner-pack | Model Number | HN1809 |
| Certification | ISO 9001 ROHS SGS | Place of Origin | Made In China |
| High Light | Jedec Conductive Tray ，ESD Conductive Tray ，ODM esd component tray | ||
The tray has a 45-degree chamfer to provide the visual indicator of Pin 1 orientation of the IC and prevent the stack of errors, reduce the possibility of workers making mistakes and maximize the protection of the chip.
Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for all packaging methods of chip tray.
Product Application
Electronic component Semiconductor Embedded System Display technology
Micro and Nano systems Sensor Test and Measurement Techology
Electromechanical equipment and systems Power supply
Reference to temperature resistance of different materials
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized | ||
| Outline Line Size | 322.6*135.9*7.62mm | Brand | Hiner-pack |
| Model | HN 1809 | Package Type | IC |
| Cavity Size | 19.0*6.0*2.2 mm | Matrix QTY | 11*12=132PCS |
| Material | PPE | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
FAQ
Q1: Are you a manufacturer?
Ans: Yes, We have ISO 9000 Quality Management System.
Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity and size normally.
Q3: How long you could prepare samples?
Ans: Normally 3 days. If customized one, open new mold 25~30days around.
Q4: How about batch order production?
Ans: Normally 5-8days or so.
Q5: Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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