China factories

China factory - Shenzhen Hiner Technology Co.,LTD

Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
  • Verified Supplier

Leave a Message

we will call you back quickly!

Submit Requirement
China ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved
China ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved

  1. China ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved
  2. China ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved
  3. China ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved
  4. China ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved

ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved

  1. MOQ: 1000 pcs
  2. Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
  3. Get Latest Price
Payment Terms T/T
Supply Ability The capacity is between 4000PCS~5000PCS/per day
Delivery Time 5~8 working days
Packaging Details It depends on the QTY of order and size of product
Material ABS.PC.PPE.MPPO...etc
Color Black.Red.Yellow.Green.White..etc
Property ESD,Non-ESD
Design Standard and Non-standard
Size All kinds of
Surface Resistance 1.0x10E4~1.0x10E11Ω
Clean class General And Ultrasonic Cleaning
Incoterms EXW,FOB,CIF,DDU,DDP
Injection Mold Lead Time 20~25Days,Mold Life Span: 30~450,000 Times
Molding Method Injection Moulding
Brand Name Hiner-pack
Model Number To meet all kinds of custom needs of customers
Certification ISO 9001 ROHS SGS
Place of Origin Made In China

View Detail Information

Contact Now Ask for best deal
Get Latest Price Request a quote
  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability The capacity is between 4000PCS~5000PCS/per day
Delivery Time 5~8 working days Packaging Details It depends on the QTY of order and size of product
Material ABS.PC.PPE.MPPO...etc Color Black.Red.Yellow.Green.White..etc
Property ESD,Non-ESD Design Standard and Non-standard
Size All kinds of Surface Resistance 1.0x10E4~1.0x10E11Ω
Clean class General And Ultrasonic Cleaning Incoterms EXW,FOB,CIF,DDU,DDP
Injection Mold Lead Time 20~25Days,Mold Life Span: 30~450,000 Times Molding Method Injection Moulding
Brand Name Hiner-pack Model Number To meet all kinds of custom needs of customers
Certification ISO 9001 ROHS SGS Place of Origin Made In China
High Light ESD Chip Waffle TrayJedec Waffle TrayWaffle Jedec Trays

ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved

 

Antistatic Matrix Chip Tray For Moisture Protection In Normal Environment

 

IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP).

 
Antistatic plastic tray can eliminate static electricity, a large number of electronic devices and products in the production process of turnover loading, packaging, storage and transportation. The finished product has good mechanical strength and heat resistance; Good impact resistance and chemical corrosion resistance. It will not change its anti-static performance due to the environment, time and temperature. It is mainly used in the electronic product industry.

 

Advantages

 

1. More than 10 years export experience

2. With professional engineers and efficient management

3. Short delivery time and good quality

4. Support small batch production in the first batch

5. Professional sales within 24 hours efficient reply

6. Factory has ISO certification, and the products comply to RoHS standard.

7. Our products are exported to the United States, Germany, UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, service        or cost performance has been well recognized

 

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

 

 

Outline Line Size 50*50*4mm Brand Hiner-pack
Model HN 210*210-24 Package Type IC Parts
Cavity Size 5.33*5.33*6.1mm Matrix QTY 7*7=49PCS
Material ABS Flatness MAX 0.2mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS

 

Material Description

 

ESD Conductive Material

Also can be antistatic or Conductive and can be normal one .

 

Application

 

IC, Electronic component, Semiconductor, Micro and Nano systems and Sensor IC etc

FAQ

 

Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

+ Read More

Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN
  • https://www.jedecictrays.com/

Leave a Message, we will call you back quickly!

Email

Check your email

Phone Number

Check your phone number

Requirement Details

Your message must be between 20-3,000 characters!

Submit Requirement