Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | 4500~5000PCS/per day |
| Delivery Time | 5~8 working days |
| Packaging Details | It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30) |
| Material | ABS.PC.MPPO...etc |
| Color | Black.Red.Yellow.Green.White..etc |
| Temperature | General 80°C~100°C |
| Property | ESD,Non-ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω |
| Warpage | less than 0.2mm(2Inch) 0.3mm(4Inch) |
| Clean Class | General and ultrasonic cleaning |
| Incoterms | EXW,FOB,CIF,DDU,DDP |
| Customized service | Suitable for all kinds of Bar.Die.Chip devices or parts |
| Injection mold | Customized case need(Lead time 20~25Days,Mold Life Span: 450,000 times.) |
| Brand Name | Hiner-pack |
| Model Number | 4Inch |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | Made In China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 4500~5000PCS/per day |
| Delivery Time | 5~8 working days | Packaging Details | It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30) |
| Material | ABS.PC.MPPO...etc | Color | Black.Red.Yellow.Green.White..etc |
| Temperature | General 80°C~100°C | Property | ESD,Non-ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω | Warpage | less than 0.2mm(2Inch) 0.3mm(4Inch) |
| Clean Class | General and ultrasonic cleaning | Incoterms | EXW,FOB,CIF,DDU,DDP |
| Customized service | Suitable for all kinds of Bar.Die.Chip devices or parts | Injection mold | Customized case need(Lead time 20~25Days,Mold Life Span: 450,000 times.) |
| Brand Name | Hiner-pack | Model Number | 4Inch |
| Certification | ISO 9001 ROHS SGS | Place of Origin | Made In China |
| High Light | Waffle Electronic Component Tray ，PCBA Electronic Component Tray ，Waffle IC Chip Tray | ||
Customized Waffle Micro Electronic Component Tray Structurally Standard
Structurally Standard ESD PC Waffle Pack With Different Requirements Can Be Customized For Micro Electronic Component
Waffle pack has many applications including the packaging of die, die attach preforms and bond pads. Waffle pack is becoming a much more desirable form of packaging as component sizes continue to shrink.
Waffle pack has distinct advantages over taping, particularly with parts that are very small. Waffle packing permits the automated loading of parts as small as .0005.
As the tray in the field of optical application, more and more customers in order to protect components or optical devices, are willing to choose injection molding tray for packaging solution, because the tray can carrier component also provides comprehensive protection to transit and transport provides great convenience, all kinds of specifications and various color can be realized,Provide one-stop service from design to production to packaging.
Silicon dies can be delivered in a tray which is also known as waffle pack – a plastic tray with pockets that match the die size. A waffle pack has a lid and is delivered in an antistatic bag. Waffle packs are ideal for delivering small number of silicon dies, typically from a MPW process.
Product Application
Wafer Die / Bar / Chips PCBA module component
Electronic component packaging Optical device packaging
Packaging
Packaging Details:Packing according to customer's specified size
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
| Cavity Size | Customized Size |
| Item Material: | ABS / PC / MPPO / PPE... acceptable |
| OEM & ODM: | YES |
| Item Color: | Can be customized |
| Feature: | Durable;Reusable;Rcofriendly;Biodegradable |
| Sample: | A. The free samples: choosen from existing products. |
| B. customized samples as per your design/demand | |
| MOQ: | 500pcs. |
| Packing: | Carton or as per customer's request |
| Delivery time: | Usually 8-10 working days,depends on order quantity |
| Term of payment: | Products:100% prepayment. Mold:50% T/T deposit, 50% balance after sample confirmation |
FAQ
Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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