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Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
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China ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic
China ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic

  1. China ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic
  2. China ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic
  3. China ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic
  4. China ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic
  5. China ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic

ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic

  1. MOQ: 1000 pcs
  2. Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
  3. Get Latest Price
Payment Terms T/T
Supply Ability 4500~5000PCS/per day
Delivery Time 5~8 working days
Packaging Details It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30)
Material ABS.PC.MPPO...etc
Color Black.Red.Yellow.Green.White..etc
Temperature General 80°C~100°C
Property ESD
Surface resistance 1.0x10E4~1.0x10E11Ω
Warpage less than 0.2mm(2Inch) 0.3mm(4Inch)
Clean Class General and ultrasonic cleaning
Incoterms EXW,FOB,CIF,DDU,DDP
Brand Name Hiner-pack
Model Number 4Inch
Certification ISO 9001 ROHS SGS
Place of Origin Made In China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 4500~5000PCS/per day
Delivery Time 5~8 working days Packaging Details It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30)
Material ABS.PC.MPPO...etc Color Black.Red.Yellow.Green.White..etc
Temperature General 80°C~100°C Property ESD
Surface resistance 1.0x10E4~1.0x10E11Ω Warpage less than 0.2mm(2Inch) 0.3mm(4Inch)
Clean Class General and ultrasonic cleaning Incoterms EXW,FOB,CIF,DDU,DDP
Brand Name Hiner-pack Model Number 4Inch
Certification ISO 9001 ROHS SGS Place of Origin Made In China
High Light ROHS Waffle Pack Chip TraysWafer Waffle Pack Chip TraysWaffle Jedec IC Trays

ROHS Stable Flatness PC Waffle Pack Chip Trays For Die

 

Stable Flatness Antistatic PC Waffle Pack With Different Colors Can Be Customized For Wafer Bare

 

 

For electronic products in the process of transportation and packing unavoidably will produce some friction, from the perspective of physics, friction causes electrostatic generation, and the temperature change in the weather outside, and will produce static electricity, the electrostatic if stay in electronic products, it is easy to cause a short-circuit damage to the precision of electronic products,In order to avoid this situation so its packaging materials require the use of good anti-static function of the pallet or packaging solutions.

 

Advantages


1. Small size, light weight, low transportation cost
2. Each tray can accommodate a large number of chips suitable for transfer or loading samples for testing
3. Stable anti-static performance, good protection chip is not hurt by resistance
4. Very good flatness, easy to operate on automatic equipment
5. It can be matched with the cover and clips of the same series, convenient to meet all kinds of shipping methods
6. Recycling, plastic material is easy to degrade after waste, no environmental concerns
7. It can be stack-able and can also ensure the design of maximum utilization of tray matrix

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

 
Product Application
 
Wafer Die / Bar / Chips                  PCBA module component
Electronic component packaging  Optical device packaging
 
Packaging 


Packaging Details:Packing according to customer's specified size
 

Cavity Size Customized Size
Item Material: ABS / PC / MPPO / PPE... acceptable
OEM & ODM: YES
Item Color: Can be customized
Feature: Durable;Reusable;Rcofriendly;Biodegradable
Sample: A. The free samples: choosen from existing products.
B. customized samples as per your design/demand
MOQ: 500pcs.
Packing: Carton or as per customer's request
Delivery time: Usually 8-10 working days,depends on order quantity
Term of payment: Products:100% prepayment. Mold:50% T/T deposit, 50% balance after sample confirmation

 
FAQ
 
Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN
  • https://www.jedecictrays.com/

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